Samsung Semiconductor - Case Codes

0402 Inch, 1005 Metric Resistor, Chip; 1.00 mm L X 0.50 mm W X 0.40 mm H body
0805, 2012 Metric Capacitor, Chip; 2.00 mm L X 1.25 mm W X 1.40 mm H body
153FBGA Ball Grid Array (BGA), 0.50 mm pitch, square; 153 pin, 11.00 mm L X 11.00 mm W X 0.80 mm H body
170-FBGA-1214 Ball Grid Array (BGA), 0.80 mm pitch, rect; 170 pin, 14.00 mm L X 12.00 mm W X 1.20 mm H body
170-FCFBGA-1214 Ball Grid Array (BGA), 0.80 mm pitch, rect; 170 pin, 14.00 mm L X 12.00 mm W X 1.20 mm H body
54-TSOP2-400AF Small Outline Pkg (SOP), 0.80 mm pitch; 54 pin, 22.22 mm L X 10.16 mm W X 1.20 mm H body
60-FBGA-7595 Ball Grid Array (BGA), 0.80 mm pitch, rect; 60 pin, 9.50 mm L X 7.50 mm W X 1.20 mm H body
60-FBGA-912 Ball Grid Array (BGA), 1.00 mm row pitch X 0.80 mm col. pitch, rect; 60 pin, 12.00 mm L X 9.00 mm W X 1.20 mm H body
60-FCFBGA-7595 Ball Grid Array (BGA), 0.80 mm pitch, rect; 60 pin, 9.50 mm L X 7.50 mm W X 1.20 mm H body
60-FCFBGA-912 Ball Grid Array (BGA), 1.00 mm row pitch X 0.80 mm col. pitch, rect; 60 pin, 12.00 mm L X 9.00 mm W X 1.20 mm H body
66-TSOP2 Small Outline Pkg (SOP), 0.65 mm pitch; 66 pin, 22.22 mm L X 10.16 mm W X 1.20 mm H body
78-FBGA-1011 Ball Grid Array (BGA), 0.80 mm pitch, rect; 78 pin, 11.00 mm L X 10.00 mm W X 1.20 mm H body
78-FBGA-10125 Ball Grid Array (BGA), 0.80 mm pitch, rect; 78 pin, 12.50 mm L X 10.00 mm W X 1.20 mm H body
78-FBGA-7511 Ball Grid Array (BGA), 0.80 mm pitch, rect; 78 pin, 11.00 mm L X 7.50 mm W X 1.20 mm H body
78-FBGA-9115 Ball Grid Array (BGA), 0.80 mm pitch, rect; 78 pin, 11.50 mm L X 9.00 mm W X 1.20 mm H body
78-FCBGA-7511 Ball Grid Array (BGA), 0.80 mm pitch, rect; 78 pin, 11.00 mm L X 7.50 mm W X 1.20 mm H body
84-FBGA-75125 Ball Grid Array (BGA), 0.80 mm pitch, rect; 84 pin, 12.50 mm L X 7.50 mm W X 1.20 mm H body
84-FCFBGA-75125 Ball Grid Array (BGA), 0.80 mm pitch, rect; 84 pin, 12.50 mm L X 7.50 mm W X 1.20 mm H body
96 FBGA Ball Grid Array (BGA), 0.80 mm pitch, rect.; 96 pin, 13.30 mm L X 10.30 mm W X 1.20 mm H body
96-FBGA-75133 Ball Grid Array (BGA), 0.80 mm pitch, rect; 96 pin, 13.30 mm L X 7.50 mm W X 1.20 mm H body
96-FBGA-9133 Ball Grid Array (BGA), 0.80 mm pitch, rect; 96 pin, 13.30 mm L X 9.00 mm W X 1.20 mm H body
96-FCFBGA-75133 Ball Grid Array (BGA), 0.80 mm pitch, rect; 96 pin, 13.30 mm L X 7.50 mm W X 1.20 mm H body
CL-05 Capacitor, Chip; 1.00 mm L X 0.50 mm W X 0.90 mm H body
CL03 Capacitor, Chip; 0.60 mm L X 0.30 mm W X 0.33 mm H body
CL05 Capacitor, Chip; 1.00 mm L X 0.50 mm W X 0.55 mm H body
LH151B LED; 2 pin, 1.70 mm L X 1.70 mm W X 0.38 mm H body
LM101A LED; 2 pin, 1.15 mm L X 1.15 mm W X 0.45 mm H body
RC6432 - 2512 Resistor, Chip; 6.30 mm L X 3.20 mm W X 0.65 mm H body
SCP7PTF1 LED; 2 pin, 2.36 mm L X 2.36 mm W X 0.40 mm H body
SIP-005AFS301 Module; 292 pin, 49.00 mm L X 36.00 mm W X 3.58 mm H body
SPMWHD32AMD7XAT0S0 LED; 2 pin, 3.00 mm L X 3.00 mm W X 0.85 mm H body
SPMWHT541MP7WARMS0 LED; 2 pin, 5.00 mm L X 3.00 mm W X 0.80 mm H body

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