PCB Libraries Forum https://www.PCBLibraries.com/forum/ Wed, 05 Aug 2026 18:05:13 +0000 Sun, 02 Aug 2026 15:21:35 +0000 http://blogs.law.harvard.edu/tech/rss Web Wiz Forums 12.07 30 https://www.PCBLibraries.com/forum/RSS_topic_feed.asp <![CDATA[PCB Libraries Forum]]> https://www.PCBLibraries.com/forum/forum_images/PCBLForumLogo.gif https://www.PCBLibraries.com/forum/ <![CDATA[Questions & Answers : Molded Body D1 Dimension]]> https://www.PCBLibraries.com/forum/molded-body-d1-dimension_topic2261_post14607.html#14607 Author: Tom H
Subject: Molded Body D1 Dimension
Posted: 02 Aug 2026 at 3:21pm

V26.08 pre-release has a new Molded Body Calculator. 

The D1 dimension was removed because 80% of component manufacturers do not provide it. Now you can build any version of 15 component families in the Molded Body calculator. 

Please check the latest pre-release and let us know if you like it. 

www.pcblibraries.com/downloads 

Here is the new 3D STEP Model: 


 
]]> Sun, 02 Aug 2026 15:21:35 +0000 https://www.PCBLibraries.com/forum/molded-body-d1-dimension_topic2261_post14607.html#14607 <![CDATA[Questions & Answers : SIP Alignment]]> https://www.PCBLibraries.com/forum/sip-alignment_topic3664_post14605.html#14605 Author: Tom H
Subject: SIP Alignment
Posted: 30 Jul 2026 at 3:03pm

I discussed this issue with the programmer and the through-hole SIP E1 dimension was swapped because in V25 a positive value moved the row down and a negative value moved the pins up. 

This didn't make logical sense and was updated so a positive E1 offset moved the pins up and a negative value moves the pins down. 

Sorry for the update, but the original release was incorrect and fixed in V26. 

]]> Thu, 30 Jul 2026 15:03:14 +0000 https://www.PCBLibraries.com/forum/sip-alignment_topic3664_post14605.html#14605 <![CDATA[Questions & Answers : SIP Alignment]]> https://www.PCBLibraries.com/forum/sip-alignment_topic3664_post14604.html#14604 Author: ransonjd
Subject: SIP Alignment
Posted: 29 Jul 2026 at 7:11pm

The direction of the offset was flipped between 2025.04 and 2026.08. The same FPX gives different footprints. I was wondering when it happened.

--John
]]> Wed, 29 Jul 2026 19:11:31 +0000 https://www.PCBLibraries.com/forum/sip-alignment_topic3664_post14604.html#14604 <![CDATA[Questions & Answers : SIP Alignment]]> https://www.PCBLibraries.com/forum/sip-alignment_topic3664_post14603.html#14603 Author: Tom H
Subject: SIP Alignment
Posted: 29 Jul 2026 at 12:58pm

The E1 dimension is for the 'Offset' from the center. 

If the pins are centered, do not enter a E1 dimension as it's Optional. 

There is no SIP 'Mirror' feature in the current V26.07 release. 

]]> Wed, 29 Jul 2026 12:58:46 +0000 https://www.PCBLibraries.com/forum/sip-alignment_topic3664_post14603.html#14603 <![CDATA[Questions & Answers : SIP Alignment]]> https://www.PCBLibraries.com/forum/sip-alignment_topic3664_post14602.html#14602 Author: ransonjd
Subject: SIP Alignment
Posted: 29 Jul 2026 at 12:10pm

When did the direction of the E1 offset on SIP packages get flipped? 

It bit me on a new design, where a regenerated footprint had a mirrored layout. 

I think the new way is OK, I was just surprised.

]]> Wed, 29 Jul 2026 12:10:38 +0000 https://www.PCBLibraries.com/forum/sip-alignment_topic3664_post14602.html#14602 <![CDATA[Questions & Answers : Molded Body D1 Dimension]]> https://www.PCBLibraries.com/forum/molded-body-d1-dimension_topic2261_post14601.html#14601 Author: AA310
Subject: Molded Body D1 Dimension
Posted: 28 Jul 2026 at 6:48am

That is great news Tom, thank you for your dedication and stellar user support Clap]]> Tue, 28 Jul 2026 06:48:11 +0000 https://www.PCBLibraries.com/forum/molded-body-d1-dimension_topic2261_post14601.html#14601 <![CDATA[Questions & Answers : Molded Body D1 Dimension]]> https://www.PCBLibraries.com/forum/molded-body-d1-dimension_topic2261_post14600.html#14600 Author: Tom H
Subject: Molded Body D1 Dimension
Posted: 27 Jul 2026 at 10:50am

Update: we're working on updating the Molded Body calculator to allow 2 lead forms in a drop-down menu. 
  1. Inward Flat Ribbon L-Lead
  2. Right Angle Lead
This update would effectively eliminate the 'D1' dimension because most Molded Body packages with Right Angle terminal leads do not provide the 'D1' dimension in their datasheets. 

This update will not affect any footprints because they are all based on the 'D' dimension. 

The 'D1' dimension only affects the 3D STEP model but, in the future, the 'D1' dimension will be determined by which lead form the user selects. 

]]> Mon, 27 Jul 2026 10:50:16 +0000 https://www.PCBLibraries.com/forum/molded-body-d1-dimension_topic2261_post14600.html#14600 <![CDATA[Questions & Answers : Under-body outward L-lead courtyard calculation]]> https://www.PCBLibraries.com/forum/underbody-outward-llead-courtyard-calculation_topic3663_post14599.html#14599 Author: felecro
Subject: Under-body outward L-lead courtyard calculation
Posted: 23 Jul 2026 at 1:03am

Ok, thanks for the explanation.]]> Thu, 23 Jul 2026 01:03:59 +0000 https://www.PCBLibraries.com/forum/underbody-outward-llead-courtyard-calculation_topic3663_post14599.html#14599 <![CDATA[Questions & Answers : Molded Body D1 Dimension]]> https://www.PCBLibraries.com/forum/molded-body-d1-dimension_topic2261_post14598.html#14598 Author: Tom H
Subject: Molded Body D1 Dimension
Posted: 22 Jul 2026 at 12:15pm

The main issue with the Molded Body terminal lead flat against the package body is the 3D Model. 

We'll add a new component family for the EIA 7343 series but the 3D STEP model will be an Extruded Block (no terminal leads). 

This condition will take place when 'D1' is less than 0.60 mm than 'D'. The program will throw a warning. 

It will be in the next V26.08 pre-release next week. 

Thanks

]]> Wed, 22 Jul 2026 12:15:09 +0000 https://www.PCBLibraries.com/forum/molded-body-d1-dimension_topic2261_post14598.html#14598 <![CDATA[Questions & Answers : Molded Body D1 Dimension]]> https://www.PCBLibraries.com/forum/molded-body-d1-dimension_topic2261_post14597.html#14597 Author: Tom H
Subject: Molded Body D1 Dimension
Posted: 22 Jul 2026 at 8:40am

The Molded Body component family in the IPC-7351/7352 is intended for the JEDEC DO-241 (SMA, SMB & SMC) where the terminal lead is 0.20 mm thick and requires 0.60 mm difference between the 'D' and 'D1' dimensions. 


 
The EIA 7343–31 has the terminal leads flat against the component package body. 

Use FP Designer and the mfr. recommended pattern to create these footprints. 


]]> Wed, 22 Jul 2026 08:40:05 +0000 https://www.PCBLibraries.com/forum/molded-body-d1-dimension_topic2261_post14597.html#14597