Adesto Technologies - Case Codes

11-WLCSP
16S Small Outline IC (SOIC), 1.27 mm pitch; 16 pin, 10.30 mm L X 7.50 mm W X 2.65 mm H body
21-WLCSP
24C1 Ball Grid Array (BGA), 1.00 mm pitch, rect.; 24 pin, 8.00 mm L X 6.00 mm W X 1.40 mm H body
24C3 Ball Grid Array (BGA), 1.00 mm pitch, rect.; 24 pin, 8.00 mm L X 6.00 mm W X 1.40 mm H body
28T Small Outline Pkg (SOP), 0.55 mm pitch; 28 pin, 8.00 mm L X 11.80 mm W X 1.20 mm H body
44-WLCSP
6-WLCSP
8-SOIC Small Outline IC (SOIC), 1.27 mm pitch; 8 pin, 5.24 mm L X 5.29 mm W X 2.16 mm H body
8-TSSOP Small Outline IC (SOIC), 1.27 mm pitch; 8 pin, 4.925 mm L X 3.90 mm W X 1.75 mm H body
8-UDFN 2x3 Pullback Small Outline No-Lead (PSON with Tab), 0.50 mm pitch; 8 pin, 2.00 mm L X 3.00 mm W X 0.60 mm H body
8-UDFN 5x6 Small Outline No-Lead (SON with Tab), 1.27 mm pitch; 8 pin, 5.00 mm L X 6.00 mm W X 0.60 mm H body
8-UFBGA
8-VDFN 6x8
8-WLCSP
8-WLCSP 1.55x2.28
8-WLCSP 1.63x1.58
8-WLCSP 2.36x1.37
8CN3 Pullback Small Outline No-Lead (PSON), 1.27 mm pitch; 8 pin, 6.00 mm L X 8.00 mm W X 1.00 mm H body
8M1-A Small Outline No-Lead (SON with Tab), 1.27 mm pitch; 8 pin, 5.00 mm L X 6.00 mm W X 1.00 mm H body
8MA1 Small Outline No-Lead (SON with Tab), 1.27 mm pitch; 8 pin, 5.00 mm L X 6.00 mm W X 0.60 mm H body
8MA3 Pullback Small Outline No-Lead (PSON with Tab), 0.50 mm pitch; 8 pin, 2.00 mm L X 3.00 mm W X 0.60 mm H body
8MW Small Outline No-Lead (SON with Tab), 1.27 mm pitch; 8 pin, 6.00 mm L X 8.00 mm W X 1.00 mm H body
8MW1 Small Outline No-Lead (SON with Tab), 1.27 mm pitch; 8 pin, 6.00 mm L X 8.00 mm W X 1.00 mm H body
8S1 Small Outline IC (SOIC), 1.27 mm pitch; 8 pin, 4.925 mm L X 3.90 mm W X 1.75 mm H body
8S2 Small Outline IC (SOIC), 1.27 mm pitch; 8 pin, 5.24 mm L X 5.29 mm W X 2.16 mm H body
8U-4 Ball Grid Array (BGA), 0.50 mm pitch, rect.; 8 pin, 2.50 mm L X 1.50 mm W X 0.409 mm H body
8X Small Outline Pkg (SOP), 0.65 mm pitch; 8 pin, 3.00 mm L X 4.40 mm W X 1.20 mm H body
9CC1 Ball Grid Array (BGA), 1.00 mm pitch, square; 9 pin, 6.00 mm L X 6.00 mm W X 0.60 mm H body

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