IPC-7352 Mathematical Model

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   The IPC-7352 standard defines the mathematical model for creating reliable surface mount (SMD) PCB footprints by providing formulas to calculate pad width (X), pad spacing (G), and pad span (Z), based on component dimensions, solder fillet goals, and manufacturing tolerances.

The following images illustrate potential pad and terminal relationships under various Material Conditions – Minimum, Nominal, and Maximum.

The Nominal Material condition of the component package & Nominal Terminal.
The Minimum Material condition of the component package & Nominal Terminal.
The Maximum Material condition of the component package & Nominal Terminal.
The Minimum Material condition of the component package & Minimum Terminal.
The Maximum Material condition of the component package & Maximum Terminal.

The resulting pad stack must have terminal leads on the pad stack regardless of every possible Material Condition possible to pass assembly inspection and meet the requirements set forth in the IPC J-STD-001 Standard and the IPC-7352 Guideline.

i.e.: regardless of the Component Package and Terminal Lead Material Condition, the Terminal Lead must never be exposed outside the calculated pad stack.

Note: most component packages are created in the Nominal Material Conditions. The package tolerances play a key role in the resulting pad stack.

Nominal Package Dimensions & no Package Tolerances.
The Footprint Expert uses the IPC-7352 Mathematical Model.
For details, see IPC-7352.

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Nick B Members Profile Send Private Message Find Members Posts Add to Buddy List Admin Group Joined: 02 Jan 2012 Status: Offline Points: 2066	Post Options Post Reply Quote Nick B Report Post Thanks(0) Quote Reply Topic: IPC-7352 Mathematical Model Posted: 15 Aug 2026 at 11:00am
	The IPC-7352 standard defines the mathematical model for creating reliable surface mount (SMD) PCB footprints by providing formulas to calculate pad width (X), pad spacing (G), and pad span (Z), based on component dimensions, solder fillet goals, and manufacturing tolerances. The following images illustrate potential pad and terminal relationships under various Material Conditions – Minimum, Nominal, and Maximum. The Nominal Material condition of the component package & Nominal Terminal. The Minimum Material condition of the component package & Nominal Terminal. The Maximum Material condition of the component package & Nominal Terminal. The Minimum Material condition of the component package & Minimum Terminal. The Maximum Material condition of the component package & Maximum Terminal. The resulting pad stack must have terminal leads on the pad stack regardless of every possible Material Condition possible to pass assembly inspection and meet the requirements set forth in the IPC J-STD-001 Standard and the IPC-7352 Guideline. i.e.: regardless of the Component Package and Terminal Lead Material Condition, the Terminal Lead must never be exposed outside the calculated pad stack. Note: most component packages are created in the Nominal Material Conditions. The package tolerances play a key role in the resulting pad stack. Nominal Package Dimensions & no Package Tolerances. The Footprint Expert uses the IPC-7352 Mathematical Model. For details, see IPC-7352.
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