TDA4863 - Footprints & 3D Models with Customizable Preferences
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Status:Active Updated: 10/23/2017 11:21:00 PM Mounting Type:Through-hole Logical Description: IC, Power-Factor Controller IC for High Power Factor and Low THD Physical Description: DIP, 7.87 mm lead span, 2.54 mm pitch; 8 pin, 9.77 mm L X 6.60 mm W X 4.37 mm H body
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Status:Active Updated: 10/23/2017 11:21:00 PM Mounting Type:Through-hole Logical Description: IC, Power-Factor Controller IC for High Power Factor and Low THD Physical Description: DIP, 7.87 mm lead span, 2.54 mm pitch; 8 pin, 9.77 mm L X 6.60 mm W X 4.37 mm H body
Manufacturer:
Part Number:
Case Code:
Datasheet:
Footprint Name:
Status:Active Updated: 10/23/2017 11:21:00 PM Mounting Type:Through-hole Logical Description: IC, Power-Factor Controller IC for High Power Factor and Low THD Physical Description: DIP, 7.87 mm lead span, 2.54 mm pitch; 8 pin, 9.77 mm L X 6.60 mm W X 4.37 mm H body
Manufacturer:
Part Number:
Case Code:
Datasheet:
Footprint Name:
Status:Active Updated: 10/23/2017 11:21:00 PM Mounting Type:Through-hole Logical Description: IC, Power-Factor Controller IC for High Power Factor and Low THD Physical Description: DIP, 7.87 mm lead span, 2.54 mm pitch; 8 pin, 9.77 mm L X 6.60 mm W X 4.37 mm H body
Manufacturer:
Part Number:
Case Code:
Datasheet:
Footprint Name:
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