PCBL Footprint Naming Convention: Surface Mount

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   Common package types and their respective naming conventions are listed below.

  Ball Grid Array’s with Alphanumeric Rows

  BGA
  + Pin Qty. + C or N + P Pitch _ Ball
  Columns X Ball Rows _ Body
  Length X Width X Height + B Ball Diameter

  Ball Grid Array’s with Alphanumeric Columns

  BGA
  + Pin Qty. + C or N + P Pitch + A + Ball
  Columns X Ball Rows _ Body
  Length X Width X Height + B Ball Diameter

  BGA w/Dual Pitch

  BGA
  + Pin Qty. + C or N + P Col Pitch X Row Pitch _ Ball Columns X Ball
  Rows _ Body Length X Width X
  Height + B Ball Diameter

  BGA w/Staggered Pins

  BGAS
  + Pin Qty. + C or N + P Pitch _ Ball Columns X Ball Rows _ Body Length X Width X Height + B Ball Diameter

  Capacitors, Aluminum Electrolytic 

  CAPAE +
  Base Body Size X Height + L Lead Length X Width

  Capacitors, Chip, Array, Concave

  CAPCAV
  + Pin Qty. + P
  Pitch _ + Body Length X Width X Height + L Lead
  Length X Width

  Capacitors, Chip, Array, Flat

  CAPCAF
  + Pin Qty. + P
  Pitch _ + Body Length X Width X Height + L Lead
  Length X Width

  Capacitors, Chip

  CAPC +
  Body Length X Width X Height + L Lead Length

  Capacitors, Dual Flat No-lead

  CAPDFN +
  Body Length X Width X Height + L Lead Length X Width

  Capacitors, Molded

  CAPM +
  Lead Span X Body Width X Height + L Lead Length X Width

  Capacitors, Polarized, Chip

  CAPPC +
  Body Length X Width X Height + L Lead Length

  Capacitors, Polarized, Dual Flat No-lead

  CAPPDFN +
  Body Length X Width X Height + L Lead Length X Width

  Capacitors, Polarized, Molded

  CAPPM +
  Lead Span X Body Width X Height + L Lead Length X Width

  Capacitors, Side Concave, 2 Pin

  CAPSC +
  Body Length X Height + L Lead Length X Width

  Ceramic Flat Packages

  CFP
  + Pin Qty. + P Pitch
  _ Body Length X Lead Span X Height + L Lead Length X Width

  Column Grid Array, Circular Lead

  CGA
  + Pin Qty. P
  Pitch _ Pin Columns X Pin Rows _ Body Length X
  Width X Height + L Diameter

  Pillar Column Grid Array

  PCGA
  + Pin Qty. P
  Pitch _ Pin Columns X Pin Rows _ Body Length X
  Width X Height + L Diameter

  Crystals (2 leads)

  XTAL + Body Length X Width X Height + L Lead Length X Width

  Crystals, Dual Flat No-lead

  XTALDFN + Body Length X Width X Height + L Lead Length X Width

  Crystals, Side Concave

  XTALSC + Body Length X Height + L Lead Length X Width

  Diodes, Chip

  DIOC
  + Body Length X
  Width X Height + L Lead Length

  Diodes, Dual Flat No-lead

  DIODFN
  + Pin Qty. _ Body Length X Width X Height + L Lead Length X Width

  Diodes, Molded

  DIOM
  + Lead Span X
  Body Width X Height + L Lead Length X Width

  Diodes, Non-polarized, Chip

  DIONC
  + Lead Span X
  Body Width X Height + L Lead Length

  Diodes, Non-polarized, Dual Flat No-lead

  DIONDFN
  + Pin Qty. _ Body Length X Width X Height + L Lead Length X Width

  Diodes, Non-polarized, Molded

  DIONM
  + Lead Span X
  Body Width X Height + L Lead Length X Width

  Diodes, MELF

  DIOMELF
  + Body Length + Diameter + L Lead Length

  Diodes, Side Concave

  DIOSC + Body Length X Width X Height + L Lead Length

  Diodes, Side Concave, 4 Pin

  DIOSC4 + P Pitch _ Body Length X Width X Height + L Lead Length

  Diodes, Small Outline Flat Lead, 2 Pin

  SODFL +
  Lead Span X Body Width X Height + L Lead Length X Width

  Diodes, Small Outline Flat Lead, 3 - 6 Pin

  DIOSOFL
  + Pin Qty. + P
  Pitch _ + Lead Span X Body Height + L Lead Length X Width

  DPAK

  DPAK
  + Pin Qty. + P Pitch _ Lead Span X Height + L Lead
  Length X Width + T Thermal Tab Pad Length X Width

  Ferrite Bead, Chip

  BEADC +
  Body Length X Width X Height + L Lead Length

  Fuses, Chip

  FUSC
  + Body Length X
  Width X Height + L Lead Length

  Fuses, Dual Flat No-Lead

  FUSDFN
  + Body Length X
  Width X Height + L Lead Length X Lead Width

  Fuses, Molded

  FUSM
  + Lead Span X
  Body Width X Height + L Lead Length X Lead
  Width

  Fuses, Side Concave

  FUSSC
  + Body Length X
  Height + L Lead Length X Width

  IC, Small Outline Package, Flat Lead

  SOPFL
  + Pin Qty. + P
  Pitch _ + Lead Span X Body Height + L Lead Length X Width

  Inductors, Chip

  INDC +
  Body Length X Width X Height + L Lead Length

  Inductors, Chip, Array, Concave

  INDCAV
  + Pin Qty. + P Pitch
  _ Body Length X Width X Height + L Lead Length X Width

  Inductors, Chip, Array, Flat

  INDCAF
  + Pin Qty. + P Pitch
  _ Body Length X Width X Height + L Lead Length X Width

  Inductors, Dual Flat No-lead

  INDDFN +
  Body Length X Width X Height + L Lead Length X Width

  Inductors, Molded

  INDM +
  Lead Span X Body Width X Height + L Lead Length X Width

  Inductors, Precision, Molded

  INDPM +
  Lead Span X Body Width X Height + L Lead Length X Width

  Inductors, Side Concave

  INDSC +
  Body Length X Height + L Lead Length X Width

  Integrated Circuit, Small Outline, Flat Lead, 3 - 6
  pin

  ICSOFL
  + Pin Qty. + P
  Pitch _ + Lead Span X Body Height + L Lead Length X Width

  Land Grid Array, Circular Lead

  LGA
  + Pin Qty. + C
  + P Pitch _ Pin Columns X Pin
  Rows _ Body Length X Width X
  Height + L Lead Diameter

  Land Grid Array, Square Lead

  LGA
  + Pin Qty. + S
  + P Pitch _ Pin Columns X Pin
  Rows _ Body Length X Width X
  Height + L Lead Size

  LED’s, Chip

  LEDC
  + Body Length + Width X Height + L Lead
  Length

  LED’s, Dual Flat No-lead

  LEDDFN
  + Body Length X
  Width X Height + L Lead Length X Width

  LED’s, Molded

  LEDM
  + Lead Span X
  Body Width X Height + L Lead Length X Width

  LED’s, Side Concave

  LEDSC + Body Length X Height + L Lead
  Length X Width

  LED’s, Side Concave, 4 Pin

  LEDSC4 + P Pitch _ Body Length X Height
  + L Lead Length X Width

  Oscillators, Dual Flat No-Lead (4-pin)

  OSCDFN4 _
  Body Length X Width X Height + L Lead Length X Width

  Oscillators, Side Concave

  OSCSC
  + Pin Qty. + P Pitch
  _ Body Length X Width X Height + L Lead Length X Width

  Oscillators, Side Flat

  OSCSF
  + Pin Qty. + P Pitch
  _ Body Length X Width X Height + L Lead Length X Width

  Oscillators, J-Lead

  OSCJ
  + Pin Qty. + P Pitch
  _ Body Length X Lead Span X Height + L Lead Width

  Oscillators, L-Bend Lead

  OSCL
  + Pin Qty. + P Pitch
  _ Body Length X Lead Span X Height + L Lead Length X Width

  Oscillators, Corner Concave

  OSCCC
  + Body Length X
  Width X Height + L Lead Length X Width

  Plastic Leaded Chip Carriers

  PLCC
  + Pin Qty. + P Pitch
  _ Lead Span L1 X Lead Span L2 Nominal X Height + L Lead Width

  Plastic Leaded Chip Carrier Sockets Square

  PLCCS
  + Pin Qty. + P Pitch
  _ Lead Span L1 X Lead Span L2 Nominal X Height + L Lead Width

  Pull-back Small Outline No-lead

  PSON
  + Pin Qty. + P Pitch
  _ Body Length X Width X Height + L Lead Length X Width + T Thermal
  Pad Length X Width

  Pull-back Quad Flat No-lead

  PQFN
  + Pin Qty. + P Pitch
  _ Body Length X Width X Height + L Lead Length X Width + T Thermal
  Pad Length X Width

  Quad Flat Packages

  QFP
  + Pin Qty. + P Pitch
  _ Lead Span L1 X Lead Span L2 Nominal X Height + L Lead Length X Width
  + T Thermal Pad Length X Width

  Ceramic Quad Flat Packages

  CQFP
  + Pin Qty. + P Pitch
  _ Lead Span L1 X Lead Span L2 Nominal X Height + L Lead Length X Width

  Quad Flat No-lead

  QFN
  + Pin Qty. + P Pitch
  _ Body Length X Width X Height + L Lead Length X Width + T Thermal
  Pad Length X Width

  Quad Leadless Ceramic Chip Carriers

  LCC
  + Pin Qty. + P Pitch
  _ Body Length X Width X Height + L Lead Length X Width

  Quad Leadless Ceramic Chip Carriers (Pin 1 on Side)

  LCCS
  + Pin Qty. + P Pitch
  _ Body Length X Width X Height + L Lead Length X Width

  Resistors, Chip

  RESC +
  Body Length X Width X Height + L Lead Width

  Resistors, Chip, Array, Concave

  RESCAV
  + Pin Qty. + P Pitch
  _ Body Length X Width X Height + L Lead Length X Width

  Resistors, Chip, Array, Convex, E-Version (Even Pin
  Size)

  RESCAXE
  + Pin Qty. + P Pitch
  _ Body Length X Width X Height + L Lead Length X Width

  Resistors, Chip, Array, Convex, S-Version (Side Pins
  Diff)

  RESCAXS
  + Pin Qty. + P Pitch
  _ Body Length X Width X Height + L Lead Length X Width

  Resistors, Chip, Array, Flat

  RESCAF
  + Pin Qty. + P Pitch
  _ Body Length X Width X Height + L Lead Length X Width

  Resistors, Dual Flat No-lead

  RESDFN
  + Pin Qty. _ Body Length X Width X Height + L Lead Length X Width

  Resistors, MELF

  RESMELF +
  Body Length + Diameter + L Lead
  Width

  Resistors, Molded

  RESM +
  Lead Span X Body Width X Height + L Lead Length X Width

  Resistors, Side Concave

  RESSC +
  Body Length X Width X Height + L Lead Length X Width

  Small Outline IC, J-Leaded

  SOJ
  + Pin Qty. + P Pitch
  _ Body Length X Lead Span X Height
  + L Lead Length X Width

  Small Outline IC, L-Leaded

  SOL
  + Pin Qty. + P Pitch
  _ Body Length X Lead Span X Height +
  L Lead Length X Width

  Small Outline Integrated Circuit, (50 mil Pitch SOIC)

  SOIC
  + Pin Qty. + P Pitch
  _ Body Length X Lead Span X Height
  + L Lead Length X Width

  Small Outline Packages

  SOP
  + Pin Qty. + P Pitch
  _ Body Length X Lead Span X Body
  Height + L Lead Length X Width + T Thermal Pad Length X Width

  Small Outline No-lead

  SON
  + Pin Qty. + P Pitch
  _ Body Length X Width X Height + L Lead Length X Width + T Thermal
  Pad Length X Width

  Small Outline Diode

  SOD
  + Lead Span X Body
  Width X Height + L Lead Length X Width

  SOT143

  SOT143
  + P Pitch _ Body Length X Lead Span X Body
  Height + L Lead Length X Width

  SOT223

  SOT223
  + Pin Qty. + P Pitch
  _ Body Length X Lead Span X Body
  Height + L Lead Length X Width

  Thermistors, Chip

  THRMC +
  Body Length + Width X Height + L Lead Width

  Transistors, Small Outline, Flat Lead, 3 - 6 pin

  TRXSOFL
  + Pin Qty. + P
  Pitch _ + Lead Span X Body Length X Body Height + L Lead
  Length X Width

  Transistors, Dual Flat No-lead

  TRXDFN
  + Pin Qty. _ Body Length X Body Width X Height
  + L Lead Length X Width

  Varistors, Chip

  VARC +
  Body Length X Width X Height + L Lead Width

SOT23 Form Factor Packages (EIA SOT & JEITA SC)

  SOT23-3

  SOT23-3P95 _ Body Length X Lead Span X Body
  Height + L Lead Length X Width

  SC59-3

  SC59-3P95 _ Body Length X Lead Span X Body
  Height + L Lead Length X Width

  SOT23-5

  SOT23-5P95 _ Body Length X Lead Span X Body
  Height + L Lead Length X Width

  SC59-5

  SC59-5P95 _ Body Length X Lead Span X Body
  Height + L Lead Length X Width

  SOT23-6

  SOT23-6P95 _ Body Length X Lead Span X Body
  Height + L Lead Length X Width

  SC74

  SC74-6P95 _ Body Length X Lead Span X Body
  Height + L Lead Length X Width

  SOT28

  SOT28-8P65 _ Body Length X Lead Span X Body
  Height + L Lead Length X Width

  SC70-8

  SC70-8P65 _ Body Length X Lead Span X Body
  Height + L Lead Length X Width

  SOT323

  SOT323-3P65 _ Body Length X Lead Span X Body
  Height + L Lead Length X Width

  SC70

  SC70-3P65 _ Body Length X Lead Span X Body
  Height + L Lead Length X Width

  SOT346

  SOT346-3P95 _ Body Length X Lead Span X Body
  Height + L Lead Length X Width

  SC59A

  SC59-3P95 _ Body Length X Lead Span X Body
  Height + L Lead Length X Width

  SOT346T

  SOT346T-3P95 _ Body Length X Lead Span X Body
  Height + L Lead Length X Width

  SC96

  SC96-3P95 _ Body Length X Lead Span X Body
  Height + L Lead Length X Width

  SOT353

  SOT353
  -5P65 _ Body Length X Lead Span X Body Height + L Lead
  Length X Width

  SC88A

  SC88A-5P65 _ Body Length X Lead Span X Body
  Height + L Lead Length X Width

  SOT363

  SOT363-6P65 _ Body Length X Lead Span X Body
  Height + L Lead Length X Width

  SC88

  SC88-6P65 _ Body Length X Lead Span X Body
  Height + L Lead Length X Width

  SOT416

  SOT416-3P50 _ Body Length X Lead Span X Body
  Height + L Lead Length X Width

  SC75

  SC75-3P50 _ Body Length X Lead Span X Body
  Height + L Lead Length X Width

  SOT753

  SOT753
  -5P95 _ Body Length X Lead Span X Body Height + L Lead
  Length X Width

  SC74A

  SC74A-5P95 _ Body Length X Lead Span X Body
  Height + L Lead Length X Width

Note: All footprint dimensional values are Nominal except Height is Maximum

All dimensions are in Metric Units
All Lead Span and Height numbers go two places past the decimal point and "include" trailing Zero
All Lead Span and Body Sizes go two place before the decimal point and "remove" leading Zeros
All Chip Component Body Sizes are one place to each side of the decimal point
Pitch Values are two places to the right & left of decimal point with no leading Zeros but include trailing zeros
Land Pattern Naming Convention: Each land pattern in IPC-7351 is specified by a unique name that must convey the package family type, pin quantity, pin pitch, body length and width dimensions, terminal lead span, terminal lead length and width and thermal pad dimensions whenever applicable. Other fields in a land pattern name are optional and are discussed below.

The following notes provide guidance on using the tables above. Specific characters are reserved for use in the naming convention to denote or separate certain fields:
P : Prefixes pin pitch.  For example, P80 specifies a 0.80 mm pitch between terminations.
L : Prefixes nominal lead dimensions
T : Prefixes thermal tab dimensions
X : Dimension separator. For example, 0.80 mm by 1.50 mm is denoted 80X150
C, N : Denote Collapsing and Non-collapsing balls respectively when specifying a BGA land pattern
_ : Underscore is a field separator between pin quantity and/or pin pitch and the package body dimensions
- : Dash is a field separator between pin quantity in hidden and deleted pin components
+ : Plus denotes "in addition to".  The plus "+" symbol does not actually appear in the land pattern name, it is only used to assist in reading the information.
Additional notes:
All dimensions are metric units
All dimensions are nominal except height is maximum
All numeric values are two places before and after the decimal point and "remove" leading Zeros
If there is no pin quantity in the Land Pattern Name it is assumed that the pin quantity is 2
Thermal Tabs are included in the Pin Quantity
Additional and Optional Fields:
The suffix letters "L", "M", and "N" are used to signify when the land protrusion is at their minimum (least), maximum (most), or median (nominal) protrusion and appear as the last character. The 3 Density Levels are defined as follows:
M = Maximum (Most) Material Condition (Density Level A)
N = Median (Nominal) Material Condition (Density Level B)
L = Minimum (Least) Material Condition (Density Level C)
If no Density Level suffix is provided, then the land pattern either follows the component manufacturer's recommended pattern or a custom land pattern for use with multiple component manufacturer’s packages in the same component family.

Additional suffices for JEDEC Standard parts that have several alternate packages are as follows:
AA, AB, AC JEDEC Component Identifier (used primarily on Semiconductor packages).

Additional suffixes for alternate components that do not follow the JEDEC standard are as follows (these are located before the Density Level suffix):

"A" - Alternate Component letter is used when component package nominal dimensions are the same for two packages but the package tolerances are different enough to create a unique land pattern to avoid land pattern name duplication.

Ball Grid Array (BGA) packages may require land pattern names that indicate a difference in pitch between balls in the rows vs. balls in the columns. These are often referred to as a “dual pitch BGA”. For example, the BGA land pattern name of BGA48C80X100P6X8_900X1200X120 conveys that the pitch 0.80 mm between columns and 0.10 mm between rows. 
Note: In this example, Pin A1 is assumed to be located in the Lower left when viewing the package from the top view. A 90 rotation of the BGA swaps the definition of Rows and Columns.

A pin order or pin quantity modifier shall be added to the component package type specification to convey reverse pin ordering, hidden pins, or deleted pins.
SOP20R: 20 pin part, Reverse Pin Order
SOT143R: Reverse Pin Order
SOP20-24:  20 pin part in a 24 pin package. The pins are numbered 1 – 24 the hidden pins are skipped over. The schematic symbol displays up to 24 pins.
SOP24-20: 20 pin part in a 24 pin package. The pins are numbered 1 – 20 the deleted pins are removed. The schematic symbol displays 20 pins.
Land Pattern Naming for Non-conforming Packages: A large number of component packages are unique, non-standard packages or unique connectors. These component packages do not fit into a standard land pattern name due to their unique features. Therefore, in order to have a single land pat tern naming convention that covers every component package in the electronics industry, the land pattern name must be associated with the component manufacturer and their part number or case code as shown below: 

ManufacturerNameAbbreviation_ManufacturerPartNumber	or
ManufacturerNameAbbreviation_ManufacturerCaseCode

All special characters used in the part number will be replaced with a hyphen "-" except periods "." will be replaced with an underscore "_".

If the component package or connector is unique and has a single manufacturer part number, then Part Number would be used to generate the Land Pattern Name
The component is a standard package and is associated with multiple manufacturer part numbers then manufacturer Case Code would be used to generate the Land Pattern Name

Examples:
FOXCONN_JFM38U1A-2PVT-4F	TI_RKG41			CK_CRD16CM0SB
MOLEX_67503-1020			MAXIM_L1053-H2	ABRACON_ABM11
SAMTEC_QTH-060-01-L-D-A	CUI_SJ-3566AN		AMPHENOL_101-00565-64

For reference, various unique footprints are shown below that are non-conforming with Tables above.

This is the footprint of SAMTEC_QTH-060-01-L-D-A, an connector with plated mounting and non-plated alignment holes.