PCBL Footprint Naming Convention: Surface Mount : Common package types and their...

Sat, 15 Aug 2026 11:00:48 +0000

Author: Nick B
Subject: 3681
Posted: 15 Aug 2026 at 11:00am

Common package types and their respective naming conventions are listed below.

Ball Grid Array’s with Alphanumeric Rows	BGA + Pin Qty. + C or N + P Pitch _ Ball Columns X Ball Rows _ Body Length X Width X Height + B Ball Diameter
Ball Grid Array’s with Alphanumeric Columns	BGA + Pin Qty. + C or N + P Pitch + A + Ball Columns X Ball Rows _ Body Length X Width X Height + B Ball Diameter
BGA w/Dual Pitch	BGA + Pin Qty. + C or N + P Col Pitch X Row Pitch _ Ball Columns X Ball Rows _ Body Length X Width X Height + B Ball Diameter
BGA w/Staggered Pins	BGAS + Pin Qty. + C or N + P Pitch _ Ball Columns X Ball Rows _ Body Length X Width X Height + B Ball Diameter
Capacitors, Aluminum Electrolytic	CAPAE + Base Body Size X Height + L Lead Length X Width
Capacitors, Chip, Array, Concave	CAPCAV + Pin Qty. + P Pitch _ + Body Length X Width X Height + L Lead Length X Width
Capacitors, Chip, Array, Flat	CAPCAF + Pin Qty. + P Pitch _ + Body Length X Width X Height + L Lead Length X Width
Capacitors, Chip	CAPC + Body Length X Width X Height + L Lead Length
Capacitors, Dual Flat No-lead	CAPDFN + Body Length X Width X Height + L Lead Length X Width
Capacitors, Molded	CAPM + Lead Span X Body Width X Height + L Lead Length X Width
Capacitors, Polarized, Chip	CAPPC + Body Length X Width X Height + L Lead Length
Capacitors, Polarized, Dual Flat No-lead	CAPPDFN + Body Length X Width X Height + L Lead Length X Width
Capacitors, Polarized, Molded	CAPPM + Lead Span X Body Width X Height + L Lead Length X Width
Capacitors, Side Concave, 2 Pin	CAPSC + Body Length X Height + L Lead Length X Width
Ceramic Flat Packages	CFP + Pin Qty. + P Pitch _ Body Length X Lead Span X Height + L Lead Length X Width
Column Grid Array, Circular Lead	CGA + Pin Qty. P Pitch _ Pin Columns X Pin Rows _ Body Length X Width X Height + L Diameter
Pillar Column Grid Array	PCGA + Pin Qty. P Pitch _ Pin Columns X Pin Rows _ Body Length X Width X Height + L Diameter
Crystals (2 leads)	XTAL + Body Length X Width X Height + L Lead Length X Width
Crystals, Dual Flat No-lead	XTALDFN + Body Length X Width X Height + L Lead Length X Width
Crystals, Side Concave	XTALSC + Body Length X Height + L Lead Length X Width
Diodes, Chip	DIOC + Body Length X Width X Height + L Lead Length
Diodes, Dual Flat No-lead	DIODFN + Pin Qty. _ Body Length X Width X Height + L Lead Length X Width
Diodes, Molded	DIOM + Lead Span X Body Width X Height + L Lead Length X Width
Diodes, Non-polarized, Chip	DIONC + Lead Span X Body Width X Height + L Lead Length
Diodes, Non-polarized, Dual Flat No-lead	DIONDFN + Pin Qty. _ Body Length X Width X Height + L Lead Length X Width
Diodes, Non-polarized, Molded	DIONM + Lead Span X Body Width X Height + L Lead Length X Width
Diodes, MELF	DIOMELF + Body Length + Diameter + L Lead Length
Diodes, Side Concave	DIOSC + Body Length X Width X Height + L Lead Length
Diodes, Side Concave, 4 Pin	DIOSC4 + P Pitch _ Body Length X Width X Height + L Lead Length
Diodes, Small Outline Flat Lead, 2 Pin	SODFL + Lead Span X Body Width X Height + L Lead Length X Width
Diodes, Small Outline Flat Lead, 3 - 6 Pin	DIOSOFL + Pin Qty. + P Pitch _ + Lead Span X Body Height + L Lead Length X Width
DPAK	DPAK + Pin Qty. + P Pitch _ Lead Span X Height + L Lead Length X Width + T Thermal Tab Pad Length X Width
Ferrite Bead, Chip	BEADC + Body Length X Width X Height + L Lead Length
Fuses, Chip	FUSC + Body Length X Width X Height + L Lead Length
Fuses, Dual Flat No-Lead	FUSDFN + Body Length X Width X Height + L Lead Length X Lead Width
Fuses, Molded	FUSM + Lead Span X Body Width X Height + L Lead Length X Lead Width
Fuses, Side Concave	FUSSC + Body Length X Height + L Lead Length X Width
IC, Small Outline Package, Flat Lead	SOPFL + Pin Qty. + P Pitch _ + Lead Span X Body Height + L Lead Length X Width
Inductors, Chip	INDC + Body Length X Width X Height + L Lead Length
Inductors, Chip, Array, Concave	INDCAV + Pin Qty. + P Pitch _ Body Length X Width X Height + L Lead Length X Width
Inductors, Chip, Array, Flat	INDCAF + Pin Qty. + P Pitch _ Body Length X Width X Height + L Lead Length X Width
Inductors, Dual Flat No-lead	INDDFN + Body Length X Width X Height + L Lead Length X Width
Inductors, Molded	INDM + Lead Span X Body Width X Height + L Lead Length X Width
Inductors, Precision, Molded	INDPM + Lead Span X Body Width X Height + L Lead Length X Width
Inductors, Side Concave	INDSC + Body Length X Height + L Lead Length X Width
Integrated Circuit, Small Outline, Flat Lead, 3 - 6 pin	ICSOFL + Pin Qty. + P Pitch _ + Lead Span X Body Height + L Lead Length X Width
Land Grid Array, Circular Lead	LGA + Pin Qty. + C + P Pitch _ Pin Columns X Pin Rows _ Body Length X Width X Height + L Lead Diameter
Land Grid Array, Square Lead	LGA + Pin Qty. + S + P Pitch _ Pin Columns X Pin Rows _ Body Length X Width X Height + L Lead Size
LED’s, Chip	LEDC + Body Length + Width X Height + L Lead Length
LED’s, Dual Flat No-lead	LEDDFN + Body Length X Width X Height + L Lead Length X Width
LED’s, Molded	LEDM + Lead Span X Body Width X Height + L Lead Length X Width
LED’s, Side Concave	LEDSC + Body Length X Height + L Lead Length X Width
LED’s, Side Concave, 4 Pin	LEDSC4 + P Pitch _ Body Length X Height + L Lead Length X Width
Oscillators, Dual Flat No-Lead (4-pin)	OSCDFN4 _ Body Length X Width X Height + L Lead Length X Width
Oscillators, Side Concave	OSCSC + Pin Qty. + P Pitch _ Body Length X Width X Height + L Lead Length X Width
Oscillators, Side Flat	OSCSF + Pin Qty. + P Pitch _ Body Length X Width X Height + L Lead Length X Width
Oscillators, J-Lead	OSCJ + Pin Qty. + P Pitch _ Body Length X Lead Span X Height + L Lead Width
Oscillators, L-Bend Lead	OSCL + Pin Qty. + P Pitch _ Body Length X Lead Span X Height + L Lead Length X Width
Oscillators, Corner Concave	OSCCC + Body Length X Width X Height + L Lead Length X Width
Plastic Leaded Chip Carriers	PLCC + Pin Qty. + P Pitch _ Lead Span L1 X Lead Span L2 Nominal X Height + L Lead Width
Plastic Leaded Chip Carrier Sockets Square	PLCCS + Pin Qty. + P Pitch _ Lead Span L1 X Lead Span L2 Nominal X Height + L Lead Width
Pull-back Small Outline No-lead	PSON + Pin Qty. + P Pitch _ Body Length X Width X Height + L Lead Length X Width + T Thermal Pad Length X Width
Pull-back Quad Flat No-lead	PQFN + Pin Qty. + P Pitch _ Body Length X Width X Height + L Lead Length X Width + T Thermal Pad Length X Width
Quad Flat Packages	QFP + Pin Qty. + P Pitch _ Lead Span L1 X Lead Span L2 Nominal X Height + L Lead Length X Width + T Thermal Pad Length X Width
Ceramic Quad Flat Packages	CQFP + Pin Qty. + P Pitch _ Lead Span L1 X Lead Span L2 Nominal X Height + L Lead Length X Width
Quad Flat No-lead	QFN + Pin Qty. + P Pitch _ Body Length X Width X Height + L Lead Length X Width + T Thermal Pad Length X Width
Quad Leadless Ceramic Chip Carriers	LCC + Pin Qty. + P Pitch _ Body Length X Width X Height + L Lead Length X Width
Quad Leadless Ceramic Chip Carriers (Pin 1 on Side)	LCCS + Pin Qty. + P Pitch _ Body Length X Width X Height + L Lead Length X Width
Resistors, Chip	RESC + Body Length X Width X Height + L Lead Width
Resistors, Chip, Array, Concave	RESCAV + Pin Qty. + P Pitch _ Body Length X Width X Height + L Lead Length X Width
Resistors, Chip, Array, Convex, E-Version (Even Pin Size)	RESCAXE + Pin Qty. + P Pitch _ Body Length X Width X Height + L Lead Length X Width
Resistors, Chip, Array, Convex, S-Version (Side Pins Diff)	RESCAXS + Pin Qty. + P Pitch _ Body Length X Width X Height + L Lead Length X Width
Resistors, Chip, Array, Flat	RESCAF + Pin Qty. + P Pitch _ Body Length X Width X Height + L Lead Length X Width
Resistors, Dual Flat No-lead	RESDFN + Pin Qty. _ Body Length X Width X Height + L Lead Length X Width
Resistors, MELF	RESMELF + Body Length + Diameter + L Lead Width
Resistors, Molded	RESM + Lead Span X Body Width X Height + L Lead Length X Width
Resistors, Side Concave	RESSC + Body Length X Width X Height + L Lead Length X Width
Small Outline IC, J-Leaded	SOJ + Pin Qty. + P Pitch _ Body Length X Lead Span X Height + L Lead Length X Width
Small Outline IC, L-Leaded	SOL + Pin Qty. + P Pitch _ Body Length X Lead Span X Height + L Lead Length X Width
Small Outline Integrated Circuit, (50 mil Pitch SOIC)	SOIC + Pin Qty. + P Pitch _ Body Length X Lead Span X Height + L Lead Length X Width
Small Outline Packages	SOP + Pin Qty. + P Pitch _ Body Length X Lead Span X Body Height + L Lead Length X Width + T Thermal Pad Length X Width
Small Outline No-lead	SON + Pin Qty. + P Pitch _ Body Length X Width X Height + L Lead Length X Width + T Thermal Pad Length X Width
Small Outline Diode	SOD + Lead Span X Body Width X Height + L Lead Length X Width
SOT143	SOT143 + P Pitch _ Body Length X Lead Span X Body Height + L Lead Length X Width
SOT223	SOT223 + Pin Qty. + P Pitch _ Body Length X Lead Span X Body Height + L Lead Length X Width
Thermistors, Chip	THRMC + Body Length + Width X Height + L Lead Width
Transistors, Small Outline, Flat Lead, 3 - 6 pin	TRXSOFL + Pin Qty. + P Pitch _ + Lead Span X Body Length X Body Height + L Lead Length X Width
Transistors, Dual Flat No-lead	TRXDFN + Pin Qty. _ Body Length X Body Width X Height + L Lead Length X Width
Varistors, Chip	VARC + Body Length X Width X Height + L Lead Width

SOT23 Form Factor Packages (EIA SOT & JEITA SC)

SOT23-3	SOT23-3P95 _ Body Length X Lead Span X Body Height + L Lead Length X Width
SC59-3	SC59-3P95 _ Body Length X Lead Span X Body Height + L Lead Length X Width
SOT23-5	SOT23-5P95 _ Body Length X Lead Span X Body Height + L Lead Length X Width
SC59-5	SC59-5P95 _ Body Length X Lead Span X Body Height + L Lead Length X Width
SOT23-6	SOT23-6P95 _ Body Length X Lead Span X Body Height + L Lead Length X Width
SC74	SC74-6P95 _ Body Length X Lead Span X Body Height + L Lead Length X Width
SOT28	SOT28-8P65 _ Body Length X Lead Span X Body Height + L Lead Length X Width
SC70-8	SC70-8P65 _ Body Length X Lead Span X Body Height + L Lead Length X Width
SOT323	SOT323-3P65 _ Body Length X Lead Span X Body Height + L Lead Length X Width
SC70	SC70-3P65 _ Body Length X Lead Span X Body Height + L Lead Length X Width
SOT346	SOT346-3P95 _ Body Length X Lead Span X Body Height + L Lead Length X Width
SC59A	SC59-3P95 _ Body Length X Lead Span X Body Height + L Lead Length X Width
SOT346T	SOT346T-3P95 _ Body Length X Lead Span X Body Height + L Lead Length X Width
SC96	SC96-3P95 _ Body Length X Lead Span X Body Height + L Lead Length X Width
SOT353	SOT353 -5P65 _ Body Length X Lead Span X Body Height + L Lead Length X Width
SC88A	SC88A-5P65 _ Body Length X Lead Span X Body Height + L Lead Length X Width
SOT363	SOT363-6P65 _ Body Length X Lead Span X Body Height + L Lead Length X Width
SC88	SC88-6P65 _ Body Length X Lead Span X Body Height + L Lead Length X Width
SOT416	SOT416-3P50 _ Body Length X Lead Span X Body Height + L Lead Length X Width
SC75	SC75-3P50 _ Body Length X Lead Span X Body Height + L Lead Length X Width
SOT753	SOT753 -5P95 _ Body Length X Lead Span X Body Height + L Lead Length X Width
SC74A	SC74A-5P95 _ Body Length X Lead Span X Body Height + L Lead Length X Width

Note: All footprint dimensional values are Nominal except Height is Maximum

All dimensions are in Metric Units
All Lead Span and Height numbers go two places past the decimal point and "include" trailing Zero
All Lead Span and Body Sizes go two place before the decimal point and "remove" leading Zeros
All Chip Component Body Sizes are one place to each side of the decimal point
Pitch Values are two places to the right & left of decimal point with no leading Zeros but include trailing zeros

Land Pattern Naming Convention: Each land pattern in IPC-7351 is specified by a unique name that must convey the package family type, pin quantity, pin pitch, body length and width dimensions, terminal lead span, terminal lead length and width and thermal pad dimensions whenever applicable. Other fields in a land pattern name are optional and are discussed below.

The following notes provide guidance on using the tables above. Specific characters are reserved for use in the naming convention to denote or separate certain fields:

P : Prefixes pin pitch. For example, P80 specifies a 0.80 mm pitch between terminations.
L : Prefixes nominal lead dimensions
T : Prefixes thermal tab dimensions
X : Dimension separator. For example, 0.80 mm by 1.50 mm is denoted 80X150
C, N : Denote Collapsing and Non-collapsing balls respectively when specifying a BGA land pattern
_ : Underscore is a field separator between pin quantity and/or pin pitch and the package body dimensions
- : Dash is a field separator between pin quantity in hidden and deleted pin components
+ : Plus denotes "in addition to". The plus "+" symbol does not actually appear in the land pattern name, it is only used to assist in reading the information.

Additional notes:

All dimensions are metric units
All dimensions are nominal except height is maximum
All numeric values are two places before and after the decimal point and "remove" leading Zeros
If there is no pin quantity in the Land Pattern Name it is assumed that the pin quantity is 2
Thermal Tabs are included in the Pin Quantity

Additional and Optional Fields:

The suffix letters "L", "M", and "N" are used to signify when the land protrusion is at their minimum (least), maximum (most), or median (nominal) protrusion and appear as the last character. The 3 Density Levels are defined as follows:

M = Maximum (Most) Material Condition (Density Level A)
N = Median (Nominal) Material Condition (Density Level B)
L = Minimum (Least) Material Condition (Density Level C)

If no Density Level suffix is provided, then the land pattern either follows the component manufacturer's recommended pattern or a custom land pattern for use with multiple component manufacturer’s packages in the same component family.

Additional suffices for JEDEC Standard parts that have several alternate packages are as follows:

AA, AB, AC JEDEC Component Identifier (used primarily on Semiconductor packages).

Additional suffixes for alternate components that do not follow the JEDEC standard are as follows (these are located before the Density Level suffix):

"A" - Alternate Component letter is used when component package nominal dimensions are the same for two packages but the package tolerances are different enough to create a unique land pattern to avoid land pattern name duplication.

Ball Grid Array (BGA) packages may require land pattern names that indicate a difference in pitch between balls in the rows vs. balls in the columns. These are often referred to as a “dual pitch BGA”. For example, the BGA land pattern name of BGA48C80X100P6X8_900X1200X120 conveys that the pitch 0.80 mm between columns and 0.10 mm between rows.

Note: In this example, Pin A1 is assumed to be located in the Lower left when viewing the package from the top view. A 90 rotation of the BGA swaps the definition of Rows and Columns.

A pin order or pin quantity modifier shall be added to the component package type specification to convey reverse pin ordering, hidden pins, or deleted pins.

SOP20R: 20 pin part, Reverse Pin Order
SOT143R: Reverse Pin Order
SOP20-24: 20 pin part in a 24 pin package. The pins are numbered 1 – 24 the hidden pins are skipped over. The schematic symbol displays up to 24 pins.
SOP24-20: 20 pin part in a 24 pin package. The pins are numbered 1 – 20 the deleted pins are removed. The schematic symbol displays 20 pins.

Land Pattern Naming for Non-conforming Packages: A large number of component packages are unique, non-standard packages or unique connectors. These component packages do not fit into a standard land pattern name due to their unique features. Therefore, in order to have a single land pat tern naming convention that covers every component package in the electronics industry, the land pattern name must be associated with the component manufacturer and their part number or case code as shown below:

ManufacturerNameAbbreviation_ManufacturerPartNumber or

ManufacturerNameAbbreviation_ManufacturerCaseCode

All special characters used in the part number will be replaced with a hyphen "-" except periods "." will be replaced with an underscore "_".

If the component package or connector is unique and has a single manufacturer part number, then Part Number would be used to generate the Land Pattern Name

The component is a standard package and is associated with multiple manufacturer part numbers then manufacturer Case Code would be used to generate the Land Pattern Name

Examples:

FOXCONN_JFM38U1A-2PVT-4F TI_RKG41 CK_CRD16CM0SB

MOLEX_67503-1020 MAXIM_L1053-H2 ABRACON_ABM11

SAMTEC_QTH-060-01-L-D-A CUI_SJ-3566AN AMPHENOL_101-00565-64

For reference, various unique footprints are shown below that are non-conforming with Tables above.

This is the footprint of SAMTEC_QTH-060-01-L-D-A, an connector with plated mounting and non-plated alignment holes.

PCB Libraries Forum : PCBL Footprint Naming Convention: Surface Mount

PCBL Footprint Naming Convention: Surface Mount : Common package types and their...