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PCBL Footprint Naming Convention: Surface Mount

Printed From: PCB Libraries Forum
Category: Libraries
Forum Name: PCB Libraries Guideline
Forum Description: (online edition)
URL: https://www.PCBLibraries.com/forum/forum_posts.asp?TID=3681
Printed Date: 19 Aug 2026 at 5:08am


Topic: PCBL Footprint Naming Convention: Surface Mount
Posted By: Nick B
Subject: PCBL Footprint Naming Convention: Surface Mount
Date Posted: 15 Aug 2026 at 11:00am
Common package types and their respective naming conventions are listed below.

Ball Grid Array’s with Alphanumeric Rows

BGA + Pin Qty. + C or N + P Pitch _ Ball Columns X Ball Rows _ Body Length X Width X Height + B Ball Diameter

Ball Grid Array’s with Alphanumeric Columns

BGA + Pin Qty. + C or N + P Pitch + A + Ball Columns X Ball Rows _ Body Length X Width X Height + B Ball Diameter

BGA w/Dual Pitch

BGA + Pin Qty. + C or N + P Col Pitch X Row Pitch _ Ball Columns X Ball Rows _ Body Length X Width X Height + B Ball Diameter

BGA w/Staggered Pins

BGAS + Pin Qty. + C or N + P Pitch _ Ball Columns X Ball Rows _ Body Length X Width X Height + B Ball Diameter

Capacitors, Aluminum Electrolytic

CAPAE + Base Body Size X Height + L Lead Length X Width

Capacitors, Chip, Array, Concave

CAPCAV + Pin Qty. + P Pitch _ + Body Length X Width X Height + L Lead Length X Width

Capacitors, Chip, Array, Flat

CAPCAF + Pin Qty. + P Pitch _ + Body Length X Width X Height + L Lead Length X Width

Capacitors, Chip

CAPC + Body Length X Width X Height + L Lead Length

Capacitors, Dual Flat No-lead

CAPDFN + Body Length X Width X Height + L Lead Length X Width

Capacitors, Molded

CAPM + Lead Span X Body Width X Height + L Lead Length X Width

Capacitors, Polarized, Chip

CAPPC + Body Length X Width X Height + L Lead Length

Capacitors, Polarized, Dual Flat No-lead

CAPPDFN + Body Length X Width X Height + L Lead Length X Width

Capacitors, Polarized, Molded

CAPPM + Lead Span X Body Width X Height + L Lead Length X Width

Capacitors, Side Concave, 2 Pin

CAPSC + Body Length X Height + L Lead Length X Width

Ceramic Flat Packages

CFP + Pin Qty. + P Pitch _ Body Length X Lead Span X Height + L Lead Length X Width

Column Grid Array, Circular Lead

CGA + Pin Qty. P Pitch _ Pin Columns X Pin Rows _ Body Length X Width X Height + L Diameter

Pillar Column Grid Array

PCGA + Pin Qty. P Pitch _ Pin Columns X Pin Rows _ Body Length X Width X Height + L Diameter

Crystals (2 leads)

XTAL + Body Length X Width X Height + L Lead Length X Width

Crystals, Dual Flat No-lead

XTALDFN + Body Length X Width X Height + L Lead Length X Width

Crystals, Side Concave

XTALSC + Body Length X Height + L Lead Length X Width

Diodes, Chip

DIOC + Body Length X Width X Height + L Lead Length

Diodes, Dual Flat No-lead

DIODFN + Pin Qty. _ Body Length X Width X Height + L Lead Length X Width

Diodes, Molded

DIOM + Lead Span X Body Width X Height + L Lead Length X Width

Diodes, Non-polarized, Chip

DIONC + Lead Span X Body Width X Height + L Lead Length

Diodes, Non-polarized, Dual Flat No-lead

DIONDFN + Pin Qty. _ Body Length X Width X Height + L Lead Length X Width

Diodes, Non-polarized, Molded

DIONM + Lead Span X Body Width X Height + L Lead Length X Width

Diodes, MELF

DIOMELF + Body Length + Diameter + L Lead Length

Diodes, Side Concave

DIOSC + Body Length X Width X Height + L Lead Length

Diodes, Side Concave, 4 Pin

DIOSC4 + P Pitch _ Body Length X Width X Height + L Lead Length

Diodes, Small Outline Flat Lead, 2 Pin

SODFL + Lead Span X Body Width X Height + L Lead Length X Width

Diodes, Small Outline Flat Lead, 3 - 6 Pin

DIOSOFL + Pin Qty. + P Pitch _ + Lead Span X Body Height + L Lead Length X Width

DPAK

DPAK + Pin Qty. + P Pitch _ Lead Span X Height + L Lead Length X Width + T Thermal Tab Pad Length X Width

Ferrite Bead, Chip

BEADC + Body Length X Width X Height + L Lead Length

Fuses, Chip

FUSC + Body Length X Width X Height + L Lead Length

Fuses, Dual Flat No-Lead

FUSDFN + Body Length X Width X Height + L Lead Length X Lead Width

Fuses, Molded

FUSM + Lead Span X Body Width X Height + L Lead Length X Lead Width

Fuses, Side Concave

FUSSC + Body Length X Height + L Lead Length X Width

IC, Small Outline Package, Flat Lead

SOPFL + Pin Qty. + P Pitch _ + Lead Span X Body Height + L Lead Length X Width

Inductors, Chip

INDC + Body Length X Width X Height + L Lead Length

Inductors, Chip, Array, Concave

INDCAV + Pin Qty. + P Pitch _ Body Length X Width X Height + L Lead Length X Width

Inductors, Chip, Array, Flat

INDCAF + Pin Qty. + P Pitch _ Body Length X Width X Height + L Lead Length X Width

Inductors, Dual Flat No-lead

INDDFN + Body Length X Width X Height + L Lead Length X Width

Inductors, Molded

INDM + Lead Span X Body Width X Height + L Lead Length X Width

Inductors, Precision, Molded

INDPM + Lead Span X Body Width X Height + L Lead Length X Width

Inductors, Side Concave

INDSC + Body Length X Height + L Lead Length X Width

Integrated Circuit, Small Outline, Flat Lead, 3 - 6 pin

ICSOFL + Pin Qty. + P Pitch _ + Lead Span X Body Height + L Lead Length X Width

Land Grid Array, Circular Lead

LGA + Pin Qty. + C + P Pitch _ Pin Columns X Pin Rows _ Body Length X Width X Height + L Lead Diameter

Land Grid Array, Square Lead

LGA + Pin Qty. + S + P Pitch _ Pin Columns X Pin Rows _ Body Length X Width X Height + L Lead Size

LED’s, Chip

LEDC + Body Length + Width X Height + L Lead Length

LED’s, Dual Flat No-lead

LEDDFN + Body Length X Width X Height + L Lead Length X Width

LED’s, Molded

LEDM + Lead Span X Body Width X Height + L Lead Length X Width

LED’s, Side Concave

LEDSC + Body Length X Height + L Lead Length X Width

LED’s, Side Concave, 4 Pin

LEDSC4 + P Pitch _ Body Length X Height + L Lead Length X Width

Oscillators, Dual Flat No-Lead (4-pin)

OSCDFN4 _ Body Length X Width X Height + L Lead Length X Width

Oscillators, Side Concave

OSCSC + Pin Qty. + P Pitch _ Body Length X Width X Height + L Lead Length X Width

Oscillators, Side Flat

OSCSF + Pin Qty. + P Pitch _ Body Length X Width X Height + L Lead Length X Width

Oscillators, J-Lead

OSCJ + Pin Qty. + P Pitch _ Body Length X Lead Span X Height + L Lead Width

Oscillators, L-Bend Lead

OSCL + Pin Qty. + P Pitch _ Body Length X Lead Span X Height + L Lead Length X Width

Oscillators, Corner Concave

OSCCC + Body Length X Width X Height + L Lead Length X Width

Plastic Leaded Chip Carriers

PLCC + Pin Qty. + P Pitch _ Lead Span L1 X Lead Span L2 Nominal X Height + L Lead Width

Plastic Leaded Chip Carrier Sockets Square

PLCCS + Pin Qty. + P Pitch _ Lead Span L1 X Lead Span L2 Nominal X Height + L Lead Width

Pull-back Small Outline No-lead

PSON + Pin Qty. + P Pitch _ Body Length X Width X Height + L Lead Length X Width + T Thermal Pad Length X Width

Pull-back Quad Flat No-lead

PQFN + Pin Qty. + P Pitch _ Body Length X Width X Height + L Lead Length X Width + T Thermal Pad Length X Width

Quad Flat Packages

QFP + Pin Qty. + P Pitch _ Lead Span L1 X Lead Span L2 Nominal X Height + L Lead Length X Width + T Thermal Pad Length X Width

Ceramic Quad Flat Packages

CQFP + Pin Qty. + P Pitch _ Lead Span L1 X Lead Span L2 Nominal X Height + L Lead Length X Width

Quad Flat No-lead

QFN + Pin Qty. + P Pitch _ Body Length X Width X Height + L Lead Length X Width + T Thermal Pad Length X Width

Quad Leadless Ceramic Chip Carriers

LCC + Pin Qty. + P Pitch _ Body Length X Width X Height + L Lead Length X Width

Quad Leadless Ceramic Chip Carriers (Pin 1 on Side)

LCCS + Pin Qty. + P Pitch _ Body Length X Width X Height + L Lead Length X Width

Resistors, Chip

RESC + Body Length X Width X Height + L Lead Width

Resistors, Chip, Array, Concave

RESCAV + Pin Qty. + P Pitch _ Body Length X Width X Height + L Lead Length X Width

Resistors, Chip, Array, Convex, E-Version (Even Pin Size)

RESCAXE + Pin Qty. + P Pitch _ Body Length X Width X Height + L Lead Length X Width

Resistors, Chip, Array, Convex, S-Version (Side Pins Diff)

RESCAXS + Pin Qty. + P Pitch _ Body Length X Width X Height + L Lead Length X Width

Resistors, Chip, Array, Flat

RESCAF + Pin Qty. + P Pitch _ Body Length X Width X Height + L Lead Length X Width

Resistors, Dual Flat No-lead

RESDFN + Pin Qty. _ Body Length X Width X Height + L Lead Length X Width

Resistors, MELF

RESMELF + Body Length + Diameter + L Lead Width

Resistors, Molded

RESM + Lead Span X Body Width X Height + L Lead Length X Width

Resistors, Side Concave

RESSC + Body Length X Width X Height + L Lead Length X Width

Small Outline IC, J-Leaded

SOJ + Pin Qty. + P Pitch _ Body Length X Lead Span X Height + L Lead Length X Width

Small Outline IC, L-Leaded

SOL + Pin Qty. + P Pitch _ Body Length X Lead Span X Height + L Lead Length X Width

Small Outline Integrated Circuit, (50 mil Pitch SOIC)

SOIC + Pin Qty. + P Pitch _ Body Length X Lead Span X Height + L Lead Length X Width

Small Outline Packages

SOP + Pin Qty. + P Pitch _ Body Length X Lead Span X Body Height + L Lead Length X Width + T Thermal Pad Length X Width

Small Outline No-lead

SON + Pin Qty. + P Pitch _ Body Length X Width X Height + L Lead Length X Width + T Thermal Pad Length X Width

Small Outline Diode

SOD + Lead Span X Body Width X Height + L Lead Length X Width

SOT143

SOT143 + P Pitch _ Body Length X Lead Span X Body Height + L Lead Length X Width

SOT223

SOT223 + Pin Qty. + P Pitch _ Body Length X Lead Span X Body Height + L Lead Length X Width

Thermistors, Chip

THRMC + Body Length + Width X Height + L Lead Width

Transistors, Small Outline, Flat Lead, 3 - 6 pin

TRXSOFL + Pin Qty. + P Pitch _ + Lead Span X Body Length X Body Height + L Lead Length X Width

Transistors, Dual Flat No-lead

TRXDFN + Pin Qty. _ Body Length X Body Width X Height + L Lead Length X Width

Varistors, Chip

VARC + Body Length X Width X Height + L Lead Width


SOT23 Form Factor Packages (EIA SOT & JEITA SC)

SOT23-3

SOT23-3P95 _ Body Length X Lead Span X Body Height + L Lead Length X Width

SC59-3

SC59-3P95 _ Body Length X Lead Span X Body Height + L Lead Length X Width

SOT23-5

SOT23-5P95 _ Body Length X Lead Span X Body Height + L Lead Length X Width

SC59-5

SC59-5P95 _ Body Length X Lead Span X Body Height + L Lead Length X Width

SOT23-6

SOT23-6P95 _ Body Length X Lead Span X Body Height + L Lead Length X Width

SC74

SC74-6P95 _ Body Length X Lead Span X Body Height + L Lead Length X Width

SOT28

SOT28-8P65 _ Body Length X Lead Span X Body Height + L Lead Length X Width

SC70-8

SC70-8P65 _ Body Length X Lead Span X Body Height + L Lead Length X Width

SOT323

SOT323-3P65 _ Body Length X Lead Span X Body Height + L Lead Length X Width

SC70

SC70-3P65 _ Body Length X Lead Span X Body Height + L Lead Length X Width

SOT346

SOT346-3P95 _ Body Length X Lead Span X Body Height + L Lead Length X Width

SC59A

SC59-3P95 _ Body Length X Lead Span X Body Height + L Lead Length X Width

SOT346T

SOT346T-3P95 _ Body Length X Lead Span X Body Height + L Lead Length X Width

SC96

SC96-3P95 _ Body Length X Lead Span X Body Height + L Lead Length X Width

SOT353

SOT353 -5P65 _ Body Length X Lead Span X Body Height + L Lead Length X Width

SC88A

SC88A-5P65 _ Body Length X Lead Span X Body Height + L Lead Length X Width

SOT363

SOT363-6P65 _ Body Length X Lead Span X Body Height + L Lead Length X Width

SC88

SC88-6P65 _ Body Length X Lead Span X Body Height + L Lead Length X Width

SOT416

SOT416-3P50 _ Body Length X Lead Span X Body Height + L Lead Length X Width

SC75

SC75-3P50 _ Body Length X Lead Span X Body Height + L Lead Length X Width

SOT753

SOT753 -5P95 _ Body Length X Lead Span X Body Height + L Lead Length X Width

SC74A

SC74A-5P95 _ Body Length X Lead Span X Body Height + L Lead Length X Width

Note: All footprint dimensional values are Nominal except Height is Maximum

  • All dimensions are in Metric Units
  • All Lead Span and Height numbers go two places past the decimal point and "include" trailing Zero
  • All Lead Span and Body Sizes go two place before the decimal point and "remove" leading Zeros
  • All Chip Component Body Sizes are one place to each side of the decimal point
  • Pitch Values are two places to the right & left of decimal point with no leading Zeros but include trailing zeros
Land Pattern Naming Convention: Each land pattern in IPC-7351 is specified by a unique name that must convey the package family type, pin quantity, pin pitch, body length and width dimensions, terminal lead span, terminal lead length and width and thermal pad dimensions whenever applicable. Other fields in a land pattern name are optional and are discussed below.
 
The following notes provide guidance on using the tables above. Specific characters are reserved for use in the naming convention to denote or separate certain fields:
  • P : Prefixes pin pitch.  For example, P80 specifies a 0.80 mm pitch between terminations.
  • L : Prefixes nominal lead dimensions
  • T : Prefixes thermal tab dimensions
  • X : Dimension separator. For example, 0.80 mm by 1.50 mm is denoted 80X150
  • C, N : Denote Collapsing and Non-collapsing balls respectively when specifying a BGA land pattern
  • _ : Underscore is a field separator between pin quantity and/or pin pitch and the package body dimensions
  • - : Dash is a field separator between pin quantity in hidden and deleted pin components
  • + : Plus denotes "in addition to".  The plus "+" symbol does not actually appear in the land pattern name, it is only used to assist in reading the information.
Additional notes:
  • All dimensions are metric units
  • All dimensions are nominal except height is maximum
  • All numeric values are two places before and after the decimal point and "remove" leading Zeros
  • If there is no pin quantity in the Land Pattern Name it is assumed that the pin quantity is 2
  • Thermal Tabs are included in the Pin Quantity
Additional and Optional Fields:
The suffix letters "L", "M", and "N" are used to signify when the land protrusion is at their minimum (least), maximum (most), or median (nominal) protrusion and appear as the last character. The 3 Density Levels are defined as follows:
  • M = Maximum (Most) Material Condition (Density Level A)
  • N = Median (Nominal) Material Condition (Density Level B)
  • L = Minimum (Least) Material Condition (Density Level C)
If no Density Level suffix is provided, then the land pattern either follows the component manufacturer's recommended pattern or a custom land pattern for use with multiple component manufacturer’s packages in the same component family.

Additional suffices for JEDEC Standard parts that have several alternate packages are as follows:
AA, AB, AC JEDEC Component Identifier (used primarily on Semiconductor packages).

Additional suffixes for alternate components that do not follow the JEDEC standard are as follows (these are located before the Density Level suffix):

"A" - Alternate Component letter is used when component package nominal dimensions are the same for two packages but the package tolerances are different enough to create a unique land pattern to avoid land pattern name duplication.

Ball Grid Array (BGA) packages may require land pattern names that indicate a difference in pitch between balls in the rows vs. balls in the columns. These are often referred to as a “dual pitch BGA”. For example, the BGA land pattern name of BGA48C80X100P6X8_900X1200X120 conveys that the pitch 0.80 mm between columns and 0.10 mm between rows. 
Note: In this example, Pin A1 is assumed to be located in the Lower left when viewing the package from the top view. A 90 rotation of the BGA swaps the definition of Rows and Columns.

A pin order or pin quantity modifier shall be added to the component package type specification to convey reverse pin ordering, hidden pins, or deleted pins.
  • SOP20R: 20 pin part, Reverse Pin Order
  • SOT143R: Reverse Pin Order
  • SOP20-24:  20 pin part in a 24 pin package. The pins are numbered 1 – 24 the hidden pins are skipped over. The schematic symbol displays up to 24 pins.
  • SOP24-20: 20 pin part in a 24 pin package. The pins are numbered 1 – 20 the deleted pins are removed. The schematic symbol displays 20 pins.
Land Pattern Naming for Non-conforming Packages: A large number of component packages are unique, non-standard packages or unique connectors. These component packages do not fit into a standard land pattern name due to their unique features. Therefore, in order to have a single land pat tern naming convention that covers every component package in the electronics industry, the land pattern name must be associated with the component manufacturer and their part number or case code as shown below: 

ManufacturerNameAbbreviation_ManufacturerPartNumber or
ManufacturerNameAbbreviation_ManufacturerCaseCode

All special characters used in the part number will be replaced with a hyphen "-" except periods "." will be replaced with an underscore "_".

If the component package or connector is unique and has a single manufacturer part number, then Part Number would be used to generate the Land Pattern Name
The component is a standard package and is associated with multiple manufacturer part numbers then manufacturer Case Code would be used to generate the Land Pattern Name

Examples:
FOXCONN_JFM38U1A-2PVT-4F TI_RKG41 CK_CRD16CM0SB
MOLEX_67503-1020 MAXIM_L1053-H2 ABRACON_ABM11
SAMTEC_QTH-060-01-L-D-A CUI_SJ-3566AN AMPHENOL_101-00565-64

For reference, various unique footprints are shown below that are non-conforming with Tables above.

This is the footprint of SAMTEC_QTH-060-01-L-D-A, an connector with plated mounting and non-plated alignment holes.




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