IPC-7352 Footprint Naming Convention: Through-hole

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   The land pattern naming convention uses component dimensions to derive the land pattern name.

The first 3 - 6 characters in the land pattern name describe the component family.

The first number in the land pattern name refers to the Lead Spacing or hole to hole location to insert the component lead.

All numbers that follow the Lead Spacing are component dimensions. 

These characters are used as component body identifiers that precede the value and this is the priority order of the component body identifiers –
P = Pitch for components with more than two leads
W = Maximum Lead Width (or Component Lead Diameter)
L = Body Length for horizontal mounting
D = Body Diameter for round component body
T = Body Thickness for rectangular component body
H = Height for vertically mounted components
Q = Pin Quantity for components with more than two leads
R = Number of Rows for connectors
Notes: 
All component body values are in millimeters and go two places to the right of the decimal point and no leading zeros.
All Complexity Levels used in the examples are "B".

  Component, Category

  Land Pattern Name

  Capacitors, Non-Polarized Axial Diameter Horizontal
  Mounting

  CAPAD
  + Lead Spacing + W
  Lead Width + L Body Length + D Body Diameter 

  Capacitors, Non-Polarized Axial Rectangular

  CAPAR
  + Lead Spacing + W
  Lead Width + L Body Length + T Body thickness + H Body Height 

  Capacitors, Non-Polarized Axial Diameter Vertical
  Mounting 

  CAPADV
  + Lead Spacing + W
  Lead Width + L Body Length + D Body Diameter 

  Capacitors, Non-Polarized Axial Rect. Vert. Mtg.

  CAPARV
  + Lead Spacing + W
  Lead Width + L Body Length + T Body Thickness + H Body Height

  Capacitors, Non-Polarized Radial Diameter

  CAPRD
  + Lead Spacing + W
  Lead Width + D Body Diameter + H Body Height

  Capacitors, Non-Polarized Radial Rectangular

  CAPRR
  + Lead Spacing + W
  Lead Width + L Body Length + T Body thickness + H Body Height

  Capacitors, Non-Polarized Radial Disk Button

  CAPRB
  + Lead Spacing + W
  Lead Width + L Body Length + T Body thickness + H Body Height

  Capacitors, Polarized Axial Diameter Horizontal
  Mounting

  CAPPAD
  + Lead Spacing + W
  Lead Width + L Body Length + D Body Diameter

  Capacitor, Polarized Radial Diameter

  CAPPRD +
  Lead Spacing + W Lead Width + D Body Diameter + H Body Height

  Diodes, Axial Diameter Horizontal Mounting

  DIOAD
  + Lead Spacing + W
  Lead Width + L Body Length + D Body Diameter

  Diodes, Axial Diameter Vertical Mounting 

  DIOADV
  + Lead Spacing + W
  Lead Width + L Body Length + D Body Diameter 

  Dual-In-Line Packages

  DIP +
  Lead Span + W Lead Width + P Pin Pitch + L Body Length + H
  Component Height + Q Pin Qty

  Dual-In-Line Sockets

  DIPS +
  Lead Span + W Lead Width + P Pin Pitch + L Body Length + H
  Component Height + Q Pin Qty

  Headers, Vertical

  HDRV +
  Lead Span + W Lead Width + P Pin Pitch + R Pins per Row + L
  Body Length + T Body Thickness + H Height

  Headers, Right Angle

  HDRRA +
  Lead Span + W Lead Width + P Pin Pitch + R Pins per Row + L
  Body Length + T Body Thickness + H Height

  Inductors, Axial Diameter Horizontal Mounting

  INDAD
  + Lead Spacing + W
  Lead Width + L Body Length + D Body Diameter

  Inductors, Axial Diameter Vertical Mounting 

  INDADV
  + Lead Spacing + W
  Lead Width + L Body Length + D Body Diameter 

  Inductors, Non-Polarized, Radial Diameter

  INDRD
  + Lead Spacing + W
  Lead Width + D Body Diameter + H Body Height

  Inductors, Polarized, Radial Diameter 

  INDPRD
  + Lead Spacing + W
  Lead Width + D Body Diameter + H Body Height 

  Jumpers, Wire

  JUMP +
  Lead Spacing + W Lead Width

  Mounting Holes Plated with Support Pad

  MTGP +
  Pad Size + H Hole Size + Z Inner Layer Pad Size

  Mounting Holes Non-Plated With Support Pad

  MTGNP +
  Pad Size + H Hole Size + Z Inner Layer Pad Size

  Mounting Holes Non-Plated Without Support Pad

  MTGNP +
  Pad Size + H Hole Size + Z Inner Layer Pad Size + K Keep-out Diameter

  Mounting Holes Plated with 8 Vias 

  MTGP +
  Pad Size + H Hole Size + Z Inner Layer Pad Size + 8 Vias

  Pin Grid Array’s

  PGA
  + Pin Qty + P
  Pitch + C Pin Columns + R Pin Rows + L Body Length X Body
  Width + H Component Height

  Resistors, Axial Diameter Horizontal Mounting

  RESAD
  + Lead Spacing + W
  Lead Width + L Body Length + D Body Diameter

  Resistors, Axial Diameter Vertical Mounting 

  RESADV
  + Lead Spacing + W
  Lead Width + L Body Length + D Body Diameter 

  Resistors, Axial Rectangular Horizontal Mounting

  RESAR
  + Lead Spacing + W
  Lead Width + L Body Length + T Body thickness + H Body Height 

  Single-In-Line Packages

  SIP +
  Body Width + W Lead Width + P Pin Pitch + L Body Length + H
  Component Height + Q Pin Qty

  Test Points, Round Land

  TP +
  Lead Width

  Test Points, Square Land

  TPS +
  Lead Width

  Test Points, Top Land Round & Bottom Land Square

  TPRS +
  Lead Width

  Wire

  PAD +
  Wire Width