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IPC-7352 Footprint Naming Convention: Through-hole

Printed From: PCB Libraries Forum
Category: Libraries
Forum Name: PCB Libraries Guideline
Forum Description: (online edition)
URL: https://www.PCBLibraries.com/forum/forum_posts.asp?TID=3682
Printed Date: 19 Aug 2026 at 4:10am


Topic: IPC-7352 Footprint Naming Convention: Through-hole
Posted By: Nick B
Subject: IPC-7352 Footprint Naming Convention: Through-hole
Date Posted: 15 Aug 2026 at 11:00am
The land pattern naming convention uses component dimensions to derive the land pattern name.

The first 3 - 6 characters in the land pattern name describe the component family.

The first number in the land pattern name refers to the Lead Spacing or hole to hole location to insert the component lead.

All numbers that follow the Lead Spacing are component dimensions. 

These characters are used as component body identifiers that precede the value and this is the priority order of the component body identifiers –
  • P = Pitch for components with more than two leads
  • W = Maximum Lead Width (or Component Lead Diameter)
  • L = Body Length for horizontal mounting
  • D = Body Diameter for round component body
  • T = Body Thickness for rectangular component body
  • H = Height for vertically mounted components
  • Q = Pin Quantity for components with more than two leads
  • R = Number of Rows for connectors
Notes: 
All component body values are in millimeters and go two places to the right of the decimal point and no leading zeros.
All Complexity Levels used in the examples are "B".

Component, Category

Land Pattern Name

Capacitors, Non-Polarized Axial Diameter Horizontal Mounting

CAPAD + Lead Spacing + W Lead Width + L Body Length + D Body Diameter

Capacitors, Non-Polarized Axial Rectangular

CAPAR + Lead Spacing + W Lead Width + L Body Length + T Body thickness + H Body Height

Capacitors, Non-Polarized Axial Diameter Vertical Mounting

CAPADV + Lead Spacing + W Lead Width + L Body Length + D Body Diameter

Capacitors, Non-Polarized Axial Rect. Vert. Mtg.

CAPARV + Lead Spacing + W Lead Width + L Body Length + T Body Thickness + H Body Height

Capacitors, Non-Polarized Radial Diameter

CAPRD + Lead Spacing + W Lead Width + D Body Diameter + H Body Height

Capacitors, Non-Polarized Radial Rectangular

CAPRR + Lead Spacing + W Lead Width + L Body Length + T Body thickness + H Body Height

Capacitors, Non-Polarized Radial Disk Button

CAPRB + Lead Spacing + W Lead Width + L Body Length + T Body thickness + H Body Height

Capacitors, Polarized Axial Diameter Horizontal Mounting

CAPPAD + Lead Spacing + W Lead Width + L Body Length + D Body Diameter

Capacitor, Polarized Radial Diameter

CAPPRD + Lead Spacing + W Lead Width + D Body Diameter + H Body Height

Diodes, Axial Diameter Horizontal Mounting

DIOAD + Lead Spacing + W Lead Width + L Body Length + D Body Diameter

Diodes, Axial Diameter Vertical Mounting

DIOADV + Lead Spacing + W Lead Width + L Body Length + D Body Diameter

Dual-In-Line Packages

DIP + Lead Span + W Lead Width + P Pin Pitch + L Body Length + H Component Height + Q Pin Qty

Dual-In-Line Sockets

DIPS + Lead Span + W Lead Width + P Pin Pitch + L Body Length + H Component Height + Q Pin Qty

Headers, Vertical

HDRV + Lead Span + W Lead Width + P Pin Pitch + R Pins per Row + L Body Length + T Body Thickness + H Height

Headers, Right Angle

HDRRA + Lead Span + W Lead Width + P Pin Pitch + R Pins per Row + L Body Length + T Body Thickness + H Height

Inductors, Axial Diameter Horizontal Mounting

INDAD + Lead Spacing + W Lead Width + L Body Length + D Body Diameter

Inductors, Axial Diameter Vertical Mounting

INDADV + Lead Spacing + W Lead Width + L Body Length + D Body Diameter

Inductors, Non-Polarized, Radial Diameter

INDRD + Lead Spacing + W Lead Width + D Body Diameter + H Body Height

Inductors, Polarized, Radial Diameter

INDPRD + Lead Spacing + W Lead Width + D Body Diameter + H Body Height

Jumpers, Wire

JUMP + Lead Spacing + W Lead Width

Mounting Holes Plated with Support Pad

MTGP + Pad Size + H Hole Size + Z Inner Layer Pad Size

Mounting Holes Non-Plated With Support Pad

MTGNP + Pad Size + H Hole Size + Z Inner Layer Pad Size

Mounting Holes Non-Plated Without Support Pad

MTGNP + Pad Size + H Hole Size + Z Inner Layer Pad Size + K Keep-out Diameter

Mounting Holes Plated with 8 Vias

MTGP + Pad Size + H Hole Size + Z Inner Layer Pad Size + 8 Vias

Pin Grid Array’s

PGA + Pin Qty + P Pitch + C Pin Columns + R Pin Rows + L Body Length X Body Width + H Component Height

Resistors, Axial Diameter Horizontal Mounting

RESAD + Lead Spacing + W Lead Width + L Body Length + D Body Diameter

Resistors, Axial Diameter Vertical Mounting

RESADV + Lead Spacing + W Lead Width + L Body Length + D Body Diameter

Resistors, Axial Rectangular Horizontal Mounting

RESAR + Lead Spacing + W Lead Width + L Body Length + T Body thickness + H Body Height

Single-In-Line Packages

SIP + Body Width + W Lead Width + P Pin Pitch + L Body Length + H Component Height + Q Pin Qty

Test Points, Round Land

TP + Lead Width

Test Points, Square Land

TPS + Lead Width

Test Points, Top Land Round & Bottom Land Square

TPRS + Lead Width

Wire

PAD + Wire Width





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