IPC-7352 Footprint Naming Convention: Through-hole : The land pattern naming convention...

Sat, 15 Aug 2026 11:00:47 +0000

Author: Nick B
Subject: 3682
Posted: 15 Aug 2026 at 11:00am

The land pattern naming convention uses component dimensions to derive the land pattern name.

The first 3 - 6 characters in the land pattern name describe the component family.

The first number in the land pattern name refers to the Lead Spacing or hole to hole location to insert the component lead.

All numbers that follow the Lead Spacing are component dimensions.

These characters are used as component body identifiers that precede the value and this is the priority order of the component body identifiers –

P = Pitch for components with more than two leads
W = Maximum Lead Width (or Component Lead Diameter)
L = Body Length for horizontal mounting
D = Body Diameter for round component body
T = Body Thickness for rectangular component body
H = Height for vertically mounted components
Q = Pin Quantity for components with more than two leads
R = Number of Rows for connectors

Notes:

All component body values are in millimeters and go two places to the right of the decimal point and no leading zeros.

All Complexity Levels used in the examples are "B".

Component, Category	Land Pattern Name
Capacitors, Non-Polarized Axial Diameter Horizontal Mounting	CAPAD + Lead Spacing + W Lead Width + L Body Length + D Body Diameter
Capacitors, Non-Polarized Axial Rectangular	CAPAR + Lead Spacing + W Lead Width + L Body Length + T Body thickness + H Body Height
Capacitors, Non-Polarized Axial Diameter Vertical Mounting	CAPADV + Lead Spacing + W Lead Width + L Body Length + D Body Diameter
Capacitors, Non-Polarized Axial Rect. Vert. Mtg.	CAPARV + Lead Spacing + W Lead Width + L Body Length + T Body Thickness + H Body Height
Capacitors, Non-Polarized Radial Diameter	CAPRD + Lead Spacing + W Lead Width + D Body Diameter + H Body Height
Capacitors, Non-Polarized Radial Rectangular	CAPRR + Lead Spacing + W Lead Width + L Body Length + T Body thickness + H Body Height
Capacitors, Non-Polarized Radial Disk Button	CAPRB + Lead Spacing + W Lead Width + L Body Length + T Body thickness + H Body Height
Capacitors, Polarized Axial Diameter Horizontal Mounting	CAPPAD + Lead Spacing + W Lead Width + L Body Length + D Body Diameter
Capacitor, Polarized Radial Diameter	CAPPRD + Lead Spacing + W Lead Width + D Body Diameter + H Body Height
Diodes, Axial Diameter Horizontal Mounting	DIOAD + Lead Spacing + W Lead Width + L Body Length + D Body Diameter
Diodes, Axial Diameter Vertical Mounting	DIOADV + Lead Spacing + W Lead Width + L Body Length + D Body Diameter
Dual-In-Line Packages	DIP + Lead Span + W Lead Width + P Pin Pitch + L Body Length + H Component Height + Q Pin Qty
Dual-In-Line Sockets	DIPS + Lead Span + W Lead Width + P Pin Pitch + L Body Length + H Component Height + Q Pin Qty
Headers, Vertical	HDRV + Lead Span + W Lead Width + P Pin Pitch + R Pins per Row + L Body Length + T Body Thickness + H Height
Headers, Right Angle	HDRRA + Lead Span + W Lead Width + P Pin Pitch + R Pins per Row + L Body Length + T Body Thickness + H Height
Inductors, Axial Diameter Horizontal Mounting	INDAD + Lead Spacing + W Lead Width + L Body Length + D Body Diameter
Inductors, Axial Diameter Vertical Mounting	INDADV + Lead Spacing + W Lead Width + L Body Length + D Body Diameter
Inductors, Non-Polarized, Radial Diameter	INDRD + Lead Spacing + W Lead Width + D Body Diameter + H Body Height
Inductors, Polarized, Radial Diameter	INDPRD + Lead Spacing + W Lead Width + D Body Diameter + H Body Height
Jumpers, Wire	JUMP + Lead Spacing + W Lead Width
Mounting Holes Plated with Support Pad	MTGP + Pad Size + H Hole Size + Z Inner Layer Pad Size
Mounting Holes Non-Plated With Support Pad	MTGNP + Pad Size + H Hole Size + Z Inner Layer Pad Size
Mounting Holes Non-Plated Without Support Pad	MTGNP + Pad Size + H Hole Size + Z Inner Layer Pad Size + K Keep-out Diameter
Mounting Holes Plated with 8 Vias	MTGP + Pad Size + H Hole Size + Z Inner Layer Pad Size + 8 Vias
Pin Grid Array’s	PGA + Pin Qty + P Pitch + C Pin Columns + R Pin Rows + L Body Length X Body Width + H Component Height
Resistors, Axial Diameter Horizontal Mounting	RESAD + Lead Spacing + W Lead Width + L Body Length + D Body Diameter
Resistors, Axial Diameter Vertical Mounting	RESADV + Lead Spacing + W Lead Width + L Body Length + D Body Diameter
Resistors, Axial Rectangular Horizontal Mounting	RESAR + Lead Spacing + W Lead Width + L Body Length + T Body thickness + H Body Height
Single-In-Line Packages	SIP + Body Width + W Lead Width + P Pin Pitch + L Body Length + H Component Height + Q Pin Qty
Test Points, Round Land	TP + Lead Width
Test Points, Square Land	TPS + Lead Width
Test Points, Top Land Round & Bottom Land Square	TPRS + Lead Width
Wire	PAD + Wire Width

PCB Libraries Forum : IPC-7352 Footprint Naming Convention: Through-hole

IPC-7352 Footprint Naming Convention: Through-hole : The land pattern naming convention...