LS1023A - Footprints & 3D Models with Customizable Preferences

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NXP Semiconductors searched for Part Number: "LS1023A"


(42 Total Parts Found)   (Showing 1 - 5)   (Page 1 of 9)
     

       
Manufacturer:
Part Number:
Case Code:
Datasheet:
Footprint Name:
 NXP Semiconductors
LS1023A
SOT1661-1
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BGA621CP80_25X25_2100X2100X207B45

customer login required - 1 credit

Status:  Active
Updated:  4/18/2023 3:15:00 PM
Mounting Type:  Surface Mount
Logical Description:
    IC, QorIQ 64-Bit ARM-Based Communications Processor
Physical Description:
    Ball Grid Array (BGA), 0.80 mm pitch, square; 621 pin, 21.00 mm L X 21.00 mm W X 2.07 mm H body
Manufacturer:
Part Number:
Case Code:
Datasheet:
Footprint Name:
 NXP Semiconductors
LS1023ASN7MNLB
SOT1661-1
Download PDF - login required
BGA621CP80_25X25_2100X2100X207B45

customer login required - 1 credit

Status:  Active
Updated:  4/18/2023 3:15:00 PM
Mounting Type:  Surface Mount
Logical Description:
    IC, Plastic, Fine Pitch
Physical Description:
    Ball Grid Array (BGA), 0.80 mm pitch, square; 621 pin, 21.00 mm L X 21.00 mm W X 2.07 mm H body
Manufacturer:
Part Number:
Case Code:
Datasheet:
Footprint Name:
 NXP Semiconductors
LS1023ASE7KNLB
SOT1661-1
Download PDF - login required
BGA621CP80_25X25_2100X2100X207B45

customer login required - 1 credit

Status:  Active
Updated:  4/18/2023 3:15:00 PM
Mounting Type:  Surface Mount
Logical Description:
    IC, ARM Based Processor for Embedded Networking and Industrial Infrastructure
Physical Description:
    Ball Grid Array (BGA), 0.80 mm pitch, square; 621 pin, 21.00 mm L X 21.00 mm W X 2.07 mm H body
Manufacturer:
Part Number:
Case Code:
Datasheet:
Footprint Name:
 NXP Semiconductors
LS1023ASE7KQB
SOT1661-1
Download PDF - login required
BGA621CP80_25X25_2100X2100X207B45

customer login required - 1 credit

Status:  Active
Updated:  4/18/2023 3:15:00 PM
Mounting Type:  Surface Mount
Logical Description:
    IC, ARM Based Processor for Embedded Networking and Industrial Infrastructure
Physical Description:
    Ball Grid Array (BGA), 0.80 mm pitch, square; 621 pin, 21.00 mm L X 21.00 mm W X 2.07 mm H body
Manufacturer:
Part Number:
Case Code:
Datasheet:
Footprint Name:
 NXP Semiconductors
LS1023ASE7MNLB
SOT1661-1
Download PDF - login required
BGA621CP80_25X25_2100X2100X207B45

customer login required - 1 credit

Status:  Active
Updated:  4/18/2023 3:15:00 PM
Mounting Type:  Surface Mount
Logical Description:
    IC, ARM Based Processor for Embedded Networking and Industrial Infrastructure
Physical Description:
    Ball Grid Array (BGA), 0.80 mm pitch, square; 621 pin, 21.00 mm L X 21.00 mm W X 2.07 mm H body

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(Showing 1 - 5 of 42)   (Page 1 of 9)