MT62F2G32D4DS-023 - Footprints & 3D Models with Customizable Preferences

2 MILLION+ intelligent footprints & 3D models, easily customizable with your preferences - or simply use the IPC or manufacturer defaults. You have unprecedented control of your CAD library features with no limit on number of preference files!
Parts on POD must be used with the latest Footprint Expert.

Micron searched for Part Number: "MT62F2G32D4DS-023"


(1 Total Part Found)  
     

       
Manufacturer:
Part Number:
Case Code:
Datasheet:
Footprint Name:
Micron
MT62F2G32D4DS-023
315-Ball TFBGA
Download PDF - login required
BGA315CP70X80_15X21_1500X1240X110B47

customer login required - 1 credit

Status:  Active
Updated:  8/25/2025
Mounting Type:  
Logical Description:
    IC, LPDDR5 Memory 32 Gbit Parallel 4.266 GHz
Physical Description:
    Ball Grid Array (BGA), 0.70 mm row pitch X 0.80 mm col. pitch, rect.; 315 pin, 15.00 mm L X 12.40 mm W X 1.10 mm H body