DS276 - Footprints & 3D Models with Customizable Preferences
2 MILLION+ intelligent footprints & 3D models, easily customizable with your preferences - or simply use the IPC or manufacturer defaults. You have unprecedented control of your CAD library features with no limit on number of preference files! Parts on POD must be used with the latest Footprint Expert.
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Part Number: "DS276"
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Status:Active Updated: 12/31/2017 11:21:00 AM Mounting Type:Through-hole Logical Description: IC, Low-Power Transceiver Chip Physical Description: DIP, 7.75 mm lead span, 2.54 mm pitch; 8 pin, 10.29 mm L X 7.87 mm W X 5.08 mm H body
Manufacturer:
Part Number:
Case Code:
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Footprint Name:
Status:Active Updated: 12/31/2017 11:21:00 AM Mounting Type:Through-hole Logical Description: IC, Low-Power Transceiver Chip Physical Description: DIP, 7.75 mm lead span, 2.54 mm pitch; 8 pin, 10.29 mm L X 7.87 mm W X 5.08 mm H body
Manufacturer:
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Status:Active Updated: 12/31/2017 11:21:00 AM Mounting Type:Surface Mount Logical Description: IC, Low-Power Transceiver Chip Physical Description: Small Outline IC (SOIC), 1.27 mm pitch; 8 pin, 4.90 mm L X 3.90 mm W X 1.75 mm H body
Manufacturer:
Part Number:
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Datasheet:
Footprint Name:
Status:Active Updated: 12/31/2017 11:21:00 AM Mounting Type:Surface Mount Logical Description: IC, Low-Power Transceiver Chip Physical Description: Small Outline IC (SOIC), 1.27 mm pitch; 8 pin, 4.90 mm L X 3.90 mm W X 1.75 mm H body
Manufacturer:
Part Number:
Case Code:
Datasheet:
Footprint Name:
Status:Active Updated: 12/31/2017 11:21:00 AM Mounting Type:Surface Mount Logical Description: IC, Low-Power Transceiver Chip Physical Description: Small Outline IC (SOIC), 1.27 mm pitch; 8 pin, 4.90 mm L X 3.90 mm W X 1.75 mm H body
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