3DPM0385-1 IB - Footprints & 3D Models with Customizable Preferences
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3DPM0385-1 IB
BGA-259
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BGA259CP127_13X20_3000X2200X580B76
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Status:Active Updated: 10/19/2022 Mounting Type:Surface Mount Logical Description: IC, REG, LIN, DDR3 TERM, 2A, -40-85C Physical Description: Ball Grid Array (BGA) 1.27 mm pitch, rect.; 259 pin, 30.00 mm L X 22.00 mm W X 5.80 mm H body