Integrated Device Technology - Case Codes

56-VFQFN 8x8
56-VFQFN Exposed Pad
56-VFQFPN 8x8
6-CLCC 7x5
60-VFBGA
603-25-173 Oscillator, Corner Concave; 3.30 mm L X 2.60 mm W X 1.10 mm H body
64-LQFP
64-pin TSSOP Small Outline Pkg (SOP), 0.50 mm pitch; 64 pin, 17.00 mm L X 6.10 mm W X 1.20 mm H body
64-QFN 9x9
64-STQFP 10x10
64-TFSOP 0.240, 6.10mm Width
64-TQFP
64-TQFP 10x10
64-TQFP 14x14
64-TQFP Exposed Pad
64-TQFP-EP 10x10
64-TSSOP
64-VFQFN Exposed Pad
64-VFQFPN 9x9
68-FPACK
68-PGA 29.46x29.46
68-PLCC
68-PLCC 24.21x24.21
72-QFN 10x10
72-VFQFN 10x10
72-VFQFN Exposed Pad
72-VFQFPN 10x10
8-DFN 2x2
8-MSOP
8-SOIC
8-SOIC 0.154, 3.90mm Width
8-TSSOP
8-TSSOP 0.173, 4.40mm Width
8-VFQFPN
8-VFQFPN 2x2
80-BGA 10x10
80-CABGA 10x10
80-TQFP
80-TQFP 14x14
80-VFQFN Dual Rows, Exposed Pad
84-FLATPAK
84-PGA 27.94x27.94
84-PLCC 29.31x29.31
88-VFQFPN 10x10
BC100 CABGA100 Ball Grid Array (BGA), 1.00 mm pitch, square; 100 pin, 11.00 mm L X 11.00 mm W X 1.50 mm H body
BC256 CABGA 256 Ball Grid Array (BGA), 1.00 mm pitch, square; 256 pin, 17.00 mm L X 17.00 mm W X 1.70 mm H body
BF208 FPBGA 208 Ball Grid Array (BGA), 0.80 mm pitch, square; 208 pin, 15.00 mm L X 15.00 mm W X 1.70 mm H body
BF48 FBGA 48 Ball Grid Array (BGA), 0.75 mm pitch, square; 48 pin, 7.00 mm L X 7.00 mm W X 1.34 mm H body
BG119 PBGA119 Ball Grid Array (BGA), 1.27 mm pitch, rect.; 119 pin, 22.00 mm L X 14.00 mm W X 2.36 mm H body
BL1156 FCBGA1156 Ball Grid Array (BGA), 1.00 mm pitch, square; 1156 pin, 35.00 mm L X 35.00 mm W X 3.26 mm H body
CD10
CD10, CLCC10 Ceramic Leadless Chip Carrier (CLCC); 10 pin, 7.00 mm L X 5.00 mm W X 1.72 mm H body
CD10, CLCC10 Oscillator; 10 pin, 7.00 mm L X 5.00 mm W X 1.72 mm H body
CD10, CLCC10 Oscillator; 10 pin, 7.00 mm L X 5.00 mm W X 1.85 mm H body
CD10, CLCC10 Voltage Controlled Oscillator (VCO); 10 pin, 7.00 mm L X 5.00 mm W X 1.72 mm H body
CD6, CDIP6 Oscillator, Side Concave, 2.54 mm pitch; 6 pin, 7.00 mm L X 5.00 mm W X 1.65 mm H body
DC16, SOIC16 Small Outline IC (SOIC), 1.27 mm pitch; 16 pin, 9.90 mm L X 3.90 mm W X 1.75 mm H body
DC16, SOIC16 Small Outline IC (SOIC), 1.27 mm pitch; 16 pin, 9.906 mm L X 3.912 mm W X 1.753 mm H body
DCG16, SOIC16 Small Outline IC (SOIC), 1.27 mm pitch; 16 pin, 9.893 mm L X 3.899 mm W X 1.727 mm H body
DCG16, SOIC16 Small Outline IC (SOIC), 1.27 mm pitch; 16 pin, 9.90 mm L X 3.90 mm W X 1.75 mm H body
DFN-8 Small Outline No-Lead (SON), 0.50 mm pitch; 8 pin, 2.00 mm L X 2.00 mm W X 1.00 mm H body
DR208 PQFP 208 Quad Flat Pack (QFP), 0.50 mm pitch; square, 52 pin X 52 pin, 28.00 mm L X 28.00 mm W X 4.10 mm H body
DRG208 PQFP 208 Quad Flat Pack (QFP), 0.50 mm pitch; square, 52 pin X 52 pin, 28.00 mm L X 28.00 mm W X 4.10 mm H body
DV8 Small Outline Pkg (SOP), 0.65 mm pitch; 8 pin, 3.00 mm L X 3.00 mm W X 1.10 mm H body
EJ24 Small Outline Pkg (SOP) with tab, 0.65 mm pitch; 25 pin, 7.80 mm L X 4.40 mm W X 1.10 mm H body
F2977 Quad Flat No-Lead (QFN) with tab, 0.50 mm pitch; 13 pin, 2.05 mm L X 2.05 mm W X 0.55 mm H body
FCBGA-324 Ball Grid Array (BGA), 1.00 mm pitch, square; 324 pin, 19.00 mm L X 19.00 mm W X 3.42 mm H body
FVXO PC72
FVXO PC73
FVXO-HC53
FVXO-HC72
FVXO-HC73
FVXO-LC53
FVXO-PC52
FVXO-PC53

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