IPC-7352 Footprint Naming Convention: Through-hole

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   The land pattern naming convention uses component dimensions to derive the land pattern name.

The first 3 - 6 characters in the land pattern name describe the component family.

The first number in the land pattern name refers to the Lead Spacing or hole to hole location to insert the component lead.

All numbers that follow the Lead Spacing are component dimensions. 

These characters are used as component body identifiers that precede the value and this is the priority order of the component body identifiers -
P = Pitch for components with more than two leads
W = Maximum Lead Width (or Component Lead Diameter)
L = Body Length for horizontal mounting
D = Body Diameter for round component body
T = Body Thickness for rectangular component body
H = Height for vertically mounted components
Q = Pin Quantity for components with more than two leads
R = Number of Rows for connectors
Notes: 
All component body values are in millimeters and go two places to the right of the decimal point and no leading zeros.
All Complexity Levels used in the examples are "B".

Component, Category Land Pattern Name
Capacitors, Non-Polarized Axial Diameter Horizontal Mounting CAPAD + Lead Spacing + W Lead Width + L Body Length + D Body Diameter 
Capacitors, Non-Polarized Axial Rectangular CAPAR + Lead Spacing + W Lead Width + L Body Length + T Body thickness + H Body Height 
Capacitors, Non-Polarized Axial Diameter Vertical Mounting CAPADV + Lead Spacing + W Lead Width + L Body Length + D Body Diameter 
Capacitors, Non-Polarized Axial Rect. Vert. Mtg. CAPARV + Lead Spacing + W Lead Width + L Body Length + T Body Thickness + H Body Height
Capacitors, Non-Polarized Radial Diameter CAPRD + Lead Spacing + W Lead Width + D Body Diameter + H Body Height
Capacitors, Non-Polarized Radial Rectangular CAPRR + Lead Spacing + W Lead Width + L Body Length + T Body thickness + H Body Height
Capacitors, Non-Polarized Radial Disk Button CAPRB + Lead Spacing + W Lead Width + L Body Length + T Body thickness + H Body Height
Capacitors, Polarized Axial Diameter Horizontal Mounting CAPPAD + Lead Spacing + W Lead Width + L Body Length + D Body Diameter
Capacitor, Polarized Radial Diameter CAPPRD + Lead Spacing + W Lead Width + D Body Diameter + H Body Height
Diodes, Axial Diameter Horizontal Mounting DIOAD + Lead Spacing + W Lead Width + L Body Length + D Body Diameter
Diodes, Axial Diameter Vertical Mounting DIOADV + Lead Spacing + W Lead Width + L Body Length + D Body Diameter 
Dual-In-Line Packages DIP + Lead Span + W Lead Width + P Pin Pitch + L Body Length + H Component Height + Q Pin Qty
Dual-In-Line Sockets DIPS + Lead Span + W Lead Width + P Pin Pitch + L Body Length + H Component Height + Q Pin Qty
Headers, Vertical HDRV + Lead Span + W Lead Width + P Pin Pitch + R Pins per Row + L Body Length + T Body Thickness + H Height
Headers, Right Angle HDRRA + Lead Span + W Lead Width + P Pin Pitch + R Pins per Row + L Body Length + T Body Thickness + H Height
Inductors, Axial Diameter Horizontal Mounting INDAD + Lead Spacing + W Lead Width + L Body Length + D Body Diameter
Inductors, Axial Diameter Vertical Mounting INDADV + Lead Spacing + W Lead Width + L Body Length + D Body Diameter 
Inductors, Non-Polarized, Radial Diameter INDRD + Lead Spacing + W Lead Width + D Body Diameter + H Body Height
Inductors, Polarized, Radial Diameter INDPRD + Lead Spacing + W Lead Width + D Body Diameter + H Body Height 
Jumpers, Wire JUMP + Lead Spacing + W Lead Width
Mounting Holes Plated with Support Pad MTGP + Pad Size + H Hole Size + Z Inner Layer Pad Size
Mounting Holes Non-Plated With Support Pad MTGNP + Pad Size + H Hole Size + Z Inner Layer Pad Size
Mounting Holes Non-Plated Without Support Pad MTGNP + Pad Size + H Hole Size + Z Inner Layer Pad Size + K Keep-out Diameter
Mounting Holes Plated with 8 Vias MTGP + Pad Size + H Hole Size + Z Inner Layer Pad Size + 8 Vias
Pin Grid Array’s PGA + Pin Qty + P Pitch + C Pin Columns + R Pin Rows + L Body Length X Body Width + H Component Height
Resistors, Axial Diameter Horizontal Mounting RESAD + Lead Spacing + W Lead Width + L Body Length + D Body Diameter
Resistors, Axial Diameter Vertical Mounting RESADV + Lead Spacing + W Lead Width + L Body Length + D Body Diameter 
Resistors, Axial Rectangular Horizontal Mounting RESAR + Lead Spacing + W Lead Width + L Body Length + T Body thickness + H Body Height 
Single-In-Line Packages SIP + Body Width + W Lead Width + P Pin Pitch + L Body Length + H Component Height + Q Pin Qty
Test Points, Round Land TP + Lead Width
Test Points, Square Land TPS + Lead Width
Test Points, Top Land Round & Bottom Land Square TPRS + Lead Width
Wire PAD + Wire Width

FOOTPRINT EXPERT GUIDELINE Topics
Terms & Definitions       Component Descriptions       Three-Tier Density Levels
IPC-7352 Mathematical Model       Solder Joint Goal Tables: [Min/Max] [Nominal]
Manufacturer Recommended       Through-hole Terminals       Courtyard Excess
PCBL Footprint Convention: SM       IPC-7352 Naming Convention: [Footprint TH] [Pad Stack]
ODA Pad Stack Convention       Terminal Lead Forms       Pad Shapes       Design Units
FPX File Definition       SMD Pad Stack Rules       Drafting Outlines & Polarity Marking
Package & Terminal Tolerances       Zero Component Orientation
Standard Reference Designators       Component Families: [Surface Mount] [Through-hole]

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