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PCBL Footprint Naming Convention
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    Posted: 20 Aug 2026 at 11:00am
This chapter applies to all Surface Mount and Through-hole standard packages, where pad stacks are automatically generated by the Footprint Expert from component dimensions. Common package types and their respective naming conventions are listed below.

Surface Mount

Ball Grid Array’s with Alphanumeric Rows BGA + Pin Qty. + C or N + P Pitch _ Ball Columns X Ball Rows _ Body Length X Width X Height + B Ball Diameter
Ball Grid Array’s with Alphanumeric Columns BGA + Pin Qty. + C or N + P Pitch + A + Ball Columns X Ball Rows _ Body Length X Width X Height + B Ball Diameter
BGA w/Dual Pitch BGA + Pin Qty. + C or N+ P Col Pitch X Row Pitch _ Ball Columns X Ball Rows _ Body Length X Width X Height + B Ball Diameter
BGA w/Staggered Pins BGAS + Pin Qty. + C or N+ P Pitch _ Ball Columns X Ball Rows _ Body Length X Width X Height + B Ball Diameter
Capacitors, Aluminum Electrolytic CAPAE + Base Body Size X Height + L Lead Length X Width
Capacitors, Chip, Array, Concave CAPCAV + Pin Qty. + P Pitch _ + Body Length X Width X Height + L Lead Length X Width
Capacitors, Chip, Array, Flat CAPCAF + Pin Qty. + P Pitch _ + Body Length X Width X Height + L Lead Length X Width
Capacitors, Chip CAPC + Body Length X Width X Height + L Lead Length
Capacitors, Dual Flat No-lead CAPDFN + Body Length X Width X Height + L Lead Length X Width
Capacitors, Molded CAPM + Lead Span X Body Width X Height + L Lead Length X Width
Capacitors, Polarized, Chip CAPPC + Body Length X Width X Height + L Lead Length
Capacitors, Polarized, Dual Flat No-lead CAPPDFN + Body Length X Width X Height + L Lead Length X Width
Capacitors, Polarized, Molded CAPPM + Lead Span X Body Width X Height + L Lead Length X Width
Capacitors, Side Concave, 2 Pin CAPSC + Body Length X Height + L Lead Length X Width
Ceramic Flat Packages CFP + Pin Qty. + P Pitch _ Body Length X Lead Span X Height + L Lead Length X Width
Column Grid Array, Circular Lead CGA + Pin Qty. P Pitch _ Pin Columns X Pin Rows _ Body Length X Width X Height + L Diameter
Pillar Column Grid Array PCGA + Pin Qty. P Pitch _ Pin Columns X Pin Rows _ Body Length X Width X Height + L Diameter
Crystals (2 leads) XTAL + Body Length X Width X Height + L Lead Length X Width
Crystals, Dual Flat No-lead XTALDFN + Body Length X Width X Height + L Lead Length X Width
Crystals, Side Concave XTALSC + Body Length X Height + L Lead Length X Width
Diodes, Chip DIOC + Body Length X Width X Height + L Lead Length
Diodes, Dual Flat No-lead DIODFN + Pin Qty. _ Body Length X Width X Height + L Lead Length X Width
Diodes, Molded DIOM + Lead Span X Body Width X Height + L Lead Length X Width
Diodes, Non-polarized, Chip DIONC + Lead Span X Body Width X Height + L Lead Length
Diodes, Non-polarized, Dual Flat No-lead DIONDFN + Pin Qty. _ Body Length X Width X Height + L Lead Length X Width
Diodes, Non-polarized, Molded DIONM + Lead Span X Body Width X Height + L Lead Length X Width
Diodes, MELF DIOMELF + Body Length + Diameter + L Lead Length
Diodes, Side Concave DIOSC+ Body Length X Width X Height + L Lead Length
Diodes, Side Concave, 4 Pin DIOSC4 + P Pitch _ Body Length X Width X Height + L Lead Length
Diodes, Small Outline Flat Lead, 2 Pin SODFL + Lead Span X Body Width X Height + L Lead Length X Width
Diodes, Small Outline Flat Lead, 3 - 6 Pin DIOSOFL + Pin Qty. + P Pitch _ + Lead Span X Body Height + L Lead Length X Width
DPAK DPAK + Pin Qty. + P Pitch _ Lead Span X Height + L Lead Length X Width + T Thermal Tab Pad Length X Width
Ferrite Bead, Chip BEADC + Body Length X Width X Height + L Lead Length
Fuses, Chip FUSC + Body Length X Width X Height + L Lead Length
Fuses, Dual Flat No-Lead FUSDFN + Body Length X Width X Height + L Lead Length X Lead Width
Fuses, Molded FUSM + Lead Span X Body Width X Height + L Lead Length X Lead Width
Fuses, Side Concave FUSSC + Body Length X Height + L Lead Length X Width
IC, Small Outline Package, Flat Lead SOPFL + Pin Qty. + P Pitch _ + Lead Span X Body Height + L Lead Length X Width
Inductors, Chip INDC + Body Length X Width X Height + L Lead Length
Inductors, Chip, Array, Concave INDCAV + Pin Qty. + P Pitch _ Body Length X Width X Height + L Lead Length X Width
Inductors, Chip, Array, Flat INDCAF + Pin Qty. + P Pitch _ Body Length X Width X Height + L Lead Length X Width
Inductors, Dual Flat No-lead INDDFN + Body Length X Width X Height + L Lead Length X Width
Inductors, Molded INDM + Lead Span X Body Width X Height + L Lead Length X Width
Inductors, Precision, Molded INDPM + Lead Span X Body Width X Height + L Lead Length X Width
Inductors, Side Concave INDSC + Body Length X Height + L Lead Length X Width
Integrated Circuit, Small Outline, Flat Lead, 3 - 6 pin ICSOFL + Pin Qty. + P Pitch _ + Lead Span X Body Height + L Lead Length X Width
Land Grid Array, Circular Lead LGA + Pin Qty. + C + P Pitch _ Pin Columns X Pin Rows _ Body Length X Width X Height + L Lead Diameter
Land Grid Array, Square Lead LGA + Pin Qty. + S + P Pitch _ Pin Columns X Pin Rows _ Body Length X Width X Height + L Lead Size
LED’s, Chip LEDC + Body Length + Width X Height + L Lead Length
LED’s, Dual Flat No-lead LEDDFN + Body Length X Width X Height + L Lead Length X Width
LED’s, Molded LEDM + Lead Span X Body Width X Height + L Lead Length X Width
LED’s, Side Concave LEDSC +Body Length X Height + L Lead Length X Width
LED’s, Side Concave, 4 Pin LEDSC4 + P Pitch _ Body Length X Height + L Lead Length X Width
Oscillators, Dual Flat No-Lead (4-pin) OSCDFN4 _ Body Length X Width X Height + L Lead Length X Width
Oscillators, Side Concave OSCSC + Pin Qty. + P Pitch _ Body Length X Width X Height + L Lead Length X Width
Oscillators, Side Flat OSCSF + Pin Qty. + P Pitch _ Body Length X Width X Height + L Lead Length X Width
Oscillators, J-Lead OSCJ + Pin Qty. + P Pitch _ Body Length X Lead Span X Height + L Lead Width
Oscillators, L-Bend Lead OSCL + Pin Qty. + P Pitch _ Body Length X Lead Span X Height + L Lead Length X Width
Oscillators, Corner Concave OSCCC + Body Length X Width X Height + L Lead Length X Width
Plastic Leaded Chip Carriers PLCC + Pin Qty. + P Pitch _ Lead Span L1 X Lead Span L2 Nominal X Height + L Lead Width
Plastic Leaded Chip Carrier Sockets Square PLCCS + Pin Qty. + P Pitch _ Lead Span L1 X Lead Span L2 Nominal X Height + L Lead Width
Pull-back Small Outline No-lead PSON + Pin Qty. + P Pitch _ Body Length X Width X Height + L Lead Length X Width + T Thermal Pad Length X Width
Pull-back Quad Flat No-lead PQFN + Pin Qty. + P Pitch _ Body Length X Width X Height + L Lead Length X Width + T Thermal Pad Length X Width
Quad Flat Packages QFP + Pin Qty. + P Pitch _ Lead Span L1 X Lead Span L2 Nominal X Height + L Lead Length X Width + T Thermal Pad Length X Width
Ceramic Quad Flat Packages CQFP + Pin Qty. + P Pitch _ Lead Span L1 X Lead Span L2 Nominal X Height + L Lead Length X Width
Quad Flat No-lead QFN + Pin Qty. + P Pitch _ Body Length X Width X Height + L Lead Length X Width + T Thermal Pad Length X Width
Quad Leadless Ceramic Chip Carriers LCC + Pin Qty. + P Pitch _ Body Length X Width X Height + L Lead Length X Width
Quad Leadless Ceramic Chip Carriers (Pin 1 on Side) LCCS + Pin Qty. + P Pitch _ Body Length X Width X Height + L Lead Length X Width
Resistors, Chip RESC + Body Length X Width X Height + L Lead Width
Resistors, Chip, Array, Concave RESCAV + Pin Qty. + P Pitch _ Body Length X Width X Height + L Lead Length X Width
Resistors, Chip, Array, Convex, E-Version (Even Pin Size) RESCAXE + Pin Qty. + P Pitch _ Body Length X Width X Height + L Lead Length X Width
Resistors, Chip, Array, Convex, S-Version (Side Pins Diff) RESCAXS + Pin Qty. + P Pitch _ Body Length X Width X Height + L Lead Length X Width
Resistors, Chip, Array, Flat RESCAF + Pin Qty. + P Pitch _ Body Length X Width X Height + L Lead Length X Width
Resistors, Dual Flat No-lead RESDFN + Pin Qty. _ Body Length X Width X Height + L Lead Length X Width
Resistors, MELF RESMELF + Body Length + Diameter + L Lead Width
Resistors, Molded RESM + Lead Span X Body Width X Height + L Lead Length X Width
Resistors, Side Concave RESSC + Body Length X Width X Height + L Lead Length X Width
Small Outline IC, J-Leaded SOJ + Pin Qty. + P Pitch _ Body Length X Lead Span X Height + L Lead Length X Width
Small Outline IC, L-Leaded SOL + Pin Qty. + P Pitch _ Body Length X Lead Span X Height + L Lead Length X Width
Small Outline Integrated Circuit, (50 mil Pitch SOIC) SOIC + Pin Qty. + P Pitch _ Body Length X Lead Span X Height + L Lead Length X Width
Small Outline Packages SOP + Pin Qty. + P Pitch _ Body Length X Lead Span X Body Height + L Lead Length X Width + T Thermal Pad Length X Width
Small Outline No-lead SON + Pin Qty. + P Pitch _ Body Length X Width X Height + L Lead Length X Width + T Thermal Pad Length X Width
Small Outline Diode SOD + Lead Span X Body Width X Height + L Lead Length X Width
SOT143 SOT143 + P Pitch _ Body Length X Lead Span X Body Height + L Lead Length X Width
SOT223 SOT223 + Pin Qty. + P Pitch _ Body Length X Lead Span X Body Height + L Lead Length X Width
Thermistors, Chip THRMC + Body Length + Width X Height + L Lead Width
Transistors, Small Outline, Flat Lead, 3 - 6 pin TRXSOFL + Pin Qty. + P Pitch _ + Lead Span X Body Length X Body Height + L Lead Length X Width
Transistors, Dual Flat No-lead TRXDFN + Pin Qty. _ Body Length X Body Width X Height + L Lead Length X Width
Varistors, Chip VARC + Body Length X Width X Height + L Lead Width

SOT23 Form Factor Packages (EIA SOT & JEITA SC)

SOT23-3 SOT23-3P95_ Body Length X Lead Span X Body Height + L Lead Length X Width
SC59-3 SC59-3P95_ Body Length X Lead Span X Body Height + L Lead Length X Width
SOT23-5 SOT23-5P95_ Body Length X Lead Span X Body Height + L Lead Length X Width
SC59-5 SC59-5P95_ Body Length X Lead Span X Body Height + L Lead Length X Width
SOT23-6 SOT23-6P95_ Body Length X Lead Span X Body Height + L Lead Length X Width
SC74 SC74-6P95_ Body Length X Lead Span X Body Height + L Lead Length X Width
SOT28 SOT28-8P65_ Body Length X Lead Span X Body Height + L Lead Length X Width
SC70-8 SC70-8P65_ Body Length X Lead Span X Body Height + L Lead Length X Width
SOT323 SOT323-3P65_ Body Length X Lead Span X Body Height + L Lead Length X Width
SC70 SC70-3P65_ Body Length X Lead Span X Body Height + L Lead Length X Width
SOT346 SOT346-3P95_ Body Length X Lead Span X Body Height + L Lead Length X Width
SC59A SC59-3P95_ Body Length X Lead Span X Body Height + L Lead Length X Width
SOT346T SOT346T-3P95_ Body Length X Lead Span X Body Height + L Lead Length X Width
SC96 SC96-3P95_ Body Length X Lead Span X Body Height + L Lead Length X Width
SOT353 SOT353 -5P65_ Body Length X Lead Span X Body Height + L Lead Length X Width
SC88A SC88A-5P65_ Body Length X Lead Span X Body Height + L Lead Length X Width
SOT363 SOT363-6P65_ Body Length X Lead Span X Body Height + L Lead Length X Width
SC88 SC88-6P65_ Body Length X Lead Span X Body Height + L Lead Length X Width
SOT416 SOT416-3P50_ Body Length X Lead Span X Body Height + L Lead Length X Width
SC75 SC75-3P50_ Body Length X Lead Span X Body Height + L Lead Length X Width
SOT753 SOT753 -5P95_ Body Length X Lead Span X Body Height + L Lead Length X Width
SC74A SC74A-5P95_ Body Length X Lead Span X Body Height + L Lead Length X Width

Note: All footprint dimensional values are Nominal except Height is Maximum

  • All dimensions are in Metric Units
  • All Lead Span and Height numbers go two places past the decimal point and "include" trailing Zero
  • All Lead Span and Body Sizes go two place before the decimal point and "remove" leading Zeros
  • All Chip Component Body Sizes are one place to each side of the decimal point
  • Pitch Values are two places to the right & left of decimal point with no leading Zeros but include trailing zeros
Footprint Naming Convention: Each footprint in IPC-7351 is specified by a unique name that must convey the package family type, pin quantity, pin pitch, body length and width dimensions, terminal lead span, terminal lead length and width and thermal pad dimensions whenever applicable. Other fields in a footprint name are optional and are discussed below.
 
The following notes provide guidance on using the tables above. Specific characters are reserved for use in the naming convention to denote or separate certain fields:
  • P : Prefixes pin pitch.  For example, P80 specifies a 0.80 mm pitch between terminations.
  • L : Prefixes nominal lead dimensions
  • T : Prefixes thermal tab dimensions
  • X : Dimension separator. For example, 0.80 mm by 1.50 mm is denoted 80X150
  • C, N : Denote Collapsing and Non-collapsing balls respectively when specifying a BGA footprint
  • _ : Underscore is a field separator between pin quantity and/or pin pitch and the package body dimensions
  • - : Dash is a field separator between pin quantity in hidden and deleted pin components
  • + : Plus denotes "in addition to".  The plus "+" symbol does not actually appear in the footprint name, it is only used to assist in reading the information.
Additional notes:
  • All dimensions are metric units
  • All dimensions are nominal except height is maximum
  • All numeric values are two places before and after the decimal point and "remove" leading Zeros
  • If there is no pin quantity in the Footprint Name it is assumed that the pin quantity is 2
  • Thermal Tabs are included in the Pin Quantity
Additional and Optional Fields:
The suffix letters "L", "M", and "N" are used to signify when the land protrusion is at their minimum (least), maximum (most), or median (nominal) protrusion and appear as the last character. The 3 Density Levels are defined as follows:
  • M = Maximum (Most) Material Condition (Density Level A)
  • N = Median (Nominal) Material Condition (Density Level B)
  • L = Minimum (Least) Material Condition (Density Level C)
If no Density Level suffix is provided, then the footprint either follows the component manufacturer's recommended pattern or a custom footprint for use with multiple component manufacturer’s packages in the same component family.

Additional suffices for JEDEC Standard parts that have several alternate packages are as follows:
AA, AB, AC JEDEC Component Identifier (used primarily on Semiconductor packages).

Additional suffixes for alternate components that do not follow the JEDEC standard are as follows (these are located before the Density Level suffix):

"A" - Alternate Component letter is used when component package nominal dimensions are the same for two packages but the package tolerances are different enough to create a unique footprint to avoid footprint name duplication.

Ball Grid Array (BGA) packages may require footprint names that indicate a difference in pitch between balls in the rows vs. balls in the columns. These are often referred to as a “dual pitch BGA”. For example, the BGA footprint name of BGA48C80X100P6X8_900X1200X120 conveys that the pitch 0.80 mm between columns and 0.10 mm between rows. 
Note: In this example, Pin A1 is assumed to be located in the Lower left when viewing the package from the top view. A 90 rotation of the BGA swaps the definition of Rows and Columns.

A pin order or pin quantity modifier shall be added to the component package type specification to convey reverse pin ordering, hidden pins, or deleted pins.
  • SOP20R: 20 pin part, Reverse Pin Order
  • SOT143R: Reverse Pin Order
  • SOP20-24:  20 pin part in a 24 pin package. The pins are numbered 1 - 24 the hidden pins are skipped over. The schematic symbol displays up to 24 pins.
  • SOP24-20: 20 pin part in a 24 pin package. The pins are numbered 1 - 20 the deleted pins are removed. The schematic symbol displays 20 pins.

Through-hole
The footprint naming convention uses component dimensions to derive the footprint name.

The first 3 - 6 characters in the footprint name describe the component family.

The first number in the footprint name refers to the Lead Spacing or hole to hole location to insert the component lead.

All numbers that follow the Lead Spacing are component dimensions. 

These characters are used as component body identifiers that precede the value and this is the priority order of the component body identifiers -
  • P = Pitch for components with more than two leads
  • W = Maximum Lead Width (or Component Lead Diameter)
  • L = Body Length for horizontal mounting
  • D = Body Diameter for round component body
  • T = Body Thickness for rectangular component body
  • H = Height for vertically mounted components
  • Q = Pin Quantity for components with more than two leads
  • R = Number of Rows for connectors
Notes: 
All component body values are in millimeters and go two places to the right of the decimal point and no leading zeros.
All Complexity Levels used in the examples are "B".

Component, CategoryFootprint Name
Capacitors, Non-Polarized Axial Diameter Horizontal MountingCAPAD + Lead Spacing + W Lead Width + L Body Length + D Body Diameter
Capacitors, Non-Polarized Axial RectangularCAPAR + Lead Spacing + W Lead Width + L Body Length + T Body thickness + H Body Height
Capacitors, Non-Polarized Axial Diameter Vertical MountingCAPADV + Lead Spacing + W Lead Width + L Body Length + D Body Diameter
Capacitors, Non-Polarized Axial Rect. Vert. Mtg.CAPARV + Lead Spacing + W Lead Width + L Body Length + T Body Thickness + H Body Height
Capacitors, Non-Polarized Radial DiameterCAPRD + Lead Spacing + W Lead Width + D Body Diameter + H Body Height
Capacitors, Non-Polarized Radial RectangularCAPRR + Lead Spacing + W Lead Width + L Body Length + T Body thickness + H Body Height
Capacitors, Non-Polarized Radial Disk ButtonCAPRB + Lead Spacing + W Lead Width + L Body Length + T Body thickness + H Body Height
Capacitors, Polarized Axial Diameter Horizontal MountingCAPPAD + Lead Spacing + W Lead Width + L Body Length + D Body Diameter
Capacitor, Polarized Radial DiameterCAPPRD + Lead Spacing + W Lead Width + D Body Diameter + H Body Height
Diodes, Axial Diameter Horizontal MountingDIOAD + Lead Spacing + W Lead Width + L Body Length + D Body Diameter
Diodes, Axial Diameter Vertical MountingDIOADV + Lead Spacing + W Lead Width + L Body Length + D Body Diameter
Dual-In-Line PackagesDIP + Lead Span + W Lead Width + P Pin Pitch + L Body Length + H Component Height + Q Pin Qty
Dual-In-Line SocketsDIPS + Lead Span + W Lead Width + P Pin Pitch + L Body Length + H Component Height + Q Pin Qty
Headers, VerticalHDRV + Lead Span + W Lead Width + P Pin Pitch + R Pins per Row + L Body Length + T Body Thickness + H Height
Headers, Right AngleHDRRA + Lead Span + W Lead Width + P Pin Pitch + R Pins per Row + L Body Length + T Body Thickness + H Height
Inductors, Axial Diameter Horizontal MountingINDAD + Lead Spacing + W Lead Width + L Body Length + D Body Diameter
Inductors, Axial Diameter Vertical MountingINDADV + Lead Spacing + W Lead Width + L Body Length + D Body Diameter
Inductors, Non-Polarized, Radial DiameterINDRD + Lead Spacing + W Lead Width + D Body Diameter + H Body Height
Inductors, Polarized, Radial DiameterINDPRD + Lead Spacing + W Lead Width + D Body Diameter + H Body Height
Jumpers, WireJUMP + Lead Spacing + W Lead Width
Mounting Holes Plated with Support PadMTGP + Pad Size + H Hole Size + Z Inner Layer Pad Size
Mounting Holes Non-Plated With Support PadMTGNP + Pad Size + H Hole Size + Z Inner Layer Pad Size
Mounting Holes Non-Plated Without Support PadMTGNP + Pad Size + H Hole Size + Z Inner Layer Pad Size + K Keep-out Diameter
Mounting Holes Plated with 8 ViasMTGP + Pad Size + H Hole Size + Z Inner Layer Pad Size + 8 Vias
Pin Grid Array’sPGA + Pin Qty + P Pitch + C Pin Columns + R Pin Rows + L Body Length X Body Width + H Component Height
Resistors, Axial Diameter Horizontal MountingRESAD + Lead Spacing + W Lead Width + L Body Length + D Body Diameter
Resistors, Axial Diameter Vertical MountingRESADV + Lead Spacing + W Lead Width + L Body Length + D Body Diameter
Resistors, Axial Rectangular Horizontal MountingRESAR + Lead Spacing + W Lead Width + L Body Length + T Body thickness + H Body Height
Single-In-Line PackagesSIP + Body Width + W Lead Width + P Pin Pitch + L Body Length + H Component Height + Q Pin Qty
Test Points, Round LandTP + Lead Width
Test Points, Square LandTPS + Lead Width
Test Points, Top Land Round & Bottom Land SquareTPRS + Lead Width
WirePAD + Wire Width






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