Surface Mount Solder Joint Goal Tables (Min / Max)

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   The Min/Max Calculation section was originally inspired by IPC-7351 and subsequently by the superseding IPC-7352 – Generic Guideline for Land Pattern Design. The solder joint goals were derived from the IPC J-STD-001G - Requirements for Soldered Electrical and Electronic Assemblies. For more details, see Appendix I.

Gullwing Leads (SOP, QFP, SOT, DPAK, SOD)

Rectangular and Square-End Cap (Chips)

Inward L Lead Oscillator and Small Outline L-Lead (SOL)

Outward L-Lead (SOT)

Cylindrical End Cap (MELF)

Small Outline No-Lead (SON, QFN)

Small Outline Components, Flat Lead (SOFL, SODFL)

Flat Lug Lead (DPAK)

Small Outline Flat No-Lead Bottom (DFN, LGA, PSON, PQFN)

Under-Body Outward L-Lead (Aluminum Electrolytic Capacitor, Crystal)

Inward Flat Ribbon L-Lead (Molded Body)

Concave & Convex Chip Array and Leadless Chip Carrier (LCC)

J-Leads

Column and Land Grid Array (CGA & LGA)

Corner Concave Oscillator

Collapsing and Non-Collapsing Ball Grid Array (BGA)

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Nick B Members Profile Send Private Message Find Members Posts Add to Buddy List Admin Group Joined: 02 Jan 2012 Status: Online Points: 2066	Post Options Post Reply Quote Nick B Report Post Thanks(0) Quote Reply Topic: Surface Mount Solder Joint Goal Tables (Min / Max) Posted: 15 Aug 2026 at 11:00am
	The Min/Max Calculation section was originally inspired by IPC-7351 and subsequently by the superseding IPC-7352 – Generic Guideline for Land Pattern Design. The solder joint goals were derived from the IPC J-STD-001G - Requirements for Soldered Electrical and Electronic Assemblies. For more details, see Appendix I. Gullwing Leads (SOP, QFP, SOT, DPAK, SOD) Rectangular and Square-End Cap (Chips) Inward L Lead Oscillator and Small Outline L-Lead (SOL) Outward L-Lead (SOT) Cylindrical End Cap (MELF) Small Outline No-Lead (SON, QFN) Small Outline Components, Flat Lead (SOFL, SODFL) Flat Lug Lead (DPAK) Small Outline Flat No-Lead Bottom (DFN, LGA, PSON, PQFN) Under-Body Outward L-Lead (Aluminum Electrolytic Capacitor, Crystal) Inward Flat Ribbon L-Lead (Molded Body) Concave & Convex Chip Array and Leadless Chip Carrier (LCC) J-Leads Column and Land Grid Array (CGA & LGA) Corner Concave Oscillator Collapsing and Non-Collapsing Ball Grid Array (BGA)
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