Surface Mount Solder Joint Goal Tables (Min / Max)
Printed From: PCB Libraries Forum
Category: Libraries
Forum Name: PCB Libraries Guideline
Forum Description: (online edition)
URL: https://www.PCBLibraries.com/forum/forum_posts.asp?TID=3676
Printed Date: 19 Aug 2026 at 5:08am
Topic: Surface Mount Solder Joint Goal Tables (Min / Max)
Posted By: Nick B
Subject: Surface Mount Solder Joint Goal Tables (Min / Max)
Date Posted: 15 Aug 2026 at 11:00am
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The Min/Max Calculation section was originally inspired by IPC-7351 and subsequently by the superseding https://shop.ipc.org/ipc-7352/ipc-7352-standard-only/Revision-0/english" rel="nofollow - IPC-7352 – Generic Guideline for Land Pattern Design . The solder joint goals were derived from the https://www.electronics.org/TOC/IPC-J-STD-001G.pdf" rel="nofollow - IPC J-STD-001G - Requirements for Soldered Electrical and Electronic Assemblies . For more details, see Appendix I. Gullwing Leads (SOP, QFP, SOT, DPAK, SOD)  Rectangular and Square-End Cap (Chips)  Inward L Lead Oscillator and Small Outline L-Lead (SOL)  Outward L-Lead (SOT)  Cylindrical End Cap (MELF)  Small Outline No-Lead (SON, QFN)  Small Outline Components, Flat Lead (SOFL, SODFL)  Flat Lug Lead (DPAK)  Small Outline Flat No-Lead Bottom (DFN, LGA, PSON, PQFN)  Under-Body Outward L-Lead (Aluminum Electrolytic Capacitor, Crystal)  Inward Flat Ribbon L-Lead (Molded Body)  Concave & Convex Chip Array and Leadless Chip Carrier (LCC)  J-Leads  Column and Land Grid Array (CGA & LGA)  Corner Concave Oscillator  Collapsing and Non-Collapsing Ball Grid Array (BGA)  ------------- Stay connected - follow us! https://twitter.com/PCBLibraries" rel="nofollow - X - http://www.linkedin.com/company/pcb-libraries-inc-/" rel="nofollow - LinkedIn |