PCB Libraries Guideline - Surface Mount Solder Joint Goal Tables (Min/Max)

The Min/Max Calculation section was originally inspired by IPC-7351 and subsequently by the superseding https://shop.ipc.org/ipc-7352/ipc-7352-standard-only/Revision-0/english - IPC-7352 - Generic Guideline for Land Pattern Design . The solder joint goals were derived from the https://www.electronics.org/TOC/IPC-J-STD-001G.pdf - IPC J-STD-001G - Requirements for Soldered Electrical and Electronic Assemblies . For more details, see Appendix I.

Gullwing Leads (SOP, QFP, SOT, DPAK, SOD)

Rectangular and Square-End Cap (Chips)

Inward L Lead Oscillator and Small Outline L-Lead (SOL)

Outward L-Lead (SOT)

Cylindrical End Cap (MELF)

Small Outline No-Lead (SON, QFN)

Small Outline Components, Flat Lead (SOFL, SODFL)

Flat Lug Lead (DPAK)

Small Outline Flat No-Lead Bottom (DFN, LGA, PSON, PQFN)

Under-Body Outward L-Lead (Aluminum Electrolytic Capacitor, Crystal)

Inward Flat Ribbon L-Lead (Molded Body)

Concave & Convex Chip Array and Leadless Chip Carrier (LCC)

J-Leads

Column and Land Grid Array (CGA & LGA)

Corner Concave Oscillator

Collapsing and Non-Collapsing Ball Grid Array (BGA)

FOOTPRINT EXPERT GUIDELINE Topics

https://www.pcblibraries.com/forum/terms-and-definitions_topic3672.html - Terms & Definitions https://www.pcblibraries.com/forum/component-descriptions_topic3673.html - Component Descriptions https://www.pcblibraries.com/forum/threetier-density-levels_topic3674.html - Three-Tier Density Levels

https://www.pcblibraries.com/forum/ipc7352-mathematical-model_topic3675.html - IPC-7352 Mathematical Model Solder Joint Goal Tables: [ https://www.pcblibraries.com/forum/surface-mount-solder-joint-goal-tables-min-max_topic3676.html - Min/Max ] [ https://www.pcblibraries.com/forum/solder-joint-goal-tables-for-nominal-calculation_topic3677.html - Nominal ]

https://www.pcblibraries.com/forum/manufacturer-recommended-patterns_topic3678.html - Manufacturer Recommended https://www.pcblibraries.com/forum/throughhole-terminals_topic3679.html - Through-hole Terminals https://www.pcblibraries.com/forum/courtyard-excess_topic3680.html - Courtyard Excess

https://www.pcblibraries.com/forum/pcbl-footprint-naming-convention-surface-mount_topic3681.html - PCBL Footprint Convention: SM IPC-7352 Naming Convention: [ https://www.pcblibraries.com/forum/ipc7352-footprint-naming-convention-throughhole_topic3682.html - Footprint TH ] [ https://www.pcblibraries.com/forum/ipc7352-pad-stack-naming-convention_topic3685.html - Pad Stack ]

https://www.pcblibraries.com/forum/oda-pad-stack-naming-convention_topic3686.html - ODA Pad Stack Convention https://www.pcblibraries.com/forum/terminal-lead-forms_topic3687.html - Terminal Lead Forms https://www.pcblibraries.com/forum/pad-shapes_topic3688.html - Pad Shapes https://www.pcblibraries.com/forum/design-units_topic3689.html - Design Units

https://www.pcblibraries.com/forum/fpx-file-definition_topic3690.html - FPX File Definition https://www.pcblibraries.com/forum/smd-pad-stack-rules_topic3691.html - SMD Pad Stack Rules https://www.pcblibraries.com/forum/drafting-outlines-polarity-marking_topic3692.html - Drafting Outlines & Polarity Marking

https://www.pcblibraries.com/forum/package-and-terminal-tolerances_topic3693.html - Package & Terminal Tolerances https://www.pcblibraries.com/forum/zero-component-orientation_topic3694.html - Zero Component Orientation

https://www.pcblibraries.com/forum/standard-reference-designators_topic3695.html - Standard Reference Designators Component Families: [ https://www.pcblibraries.com/forum/surface-mount-component-families_topic3696.html - Surface Mount ] [ https://www.pcblibraries.com/forum/throughhole-component-families_topic3697.html - Through-hole ]

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