Three-Tier Density Levels

Performance classification: IPC J-STD-001, formally titled "Requirements for Soldered Electrical and Electronic Assemblies," is the global industry standard for soldering materials and processes. Unlike other standards that focus solely on visual inspection, J-STD-001 emphasizes process control, ensuring that the assembly is built correctly from the start.

Classification: Products are divided into three classes based on their criticality:

Includes products suitable for applications where the major requirement is function of the completed assembly.

Includes products where continued performance and extended life are required, and for which uninterrupted service is desired but not critical. Typically, the end-use environment would not cause failures.

Includes products where continued high performance or performance-on-demand is critical, equipment downtime cannot be tolerated, end-use environment may be uncommonly harsh, and the equipment must function when required, such as life support or other critical systems.

The use of performance classes (1, 2, and 3) is combined with that of component density levels (A, B, and C) in explaining the condition of an electronic printed board assembly.

As an example, combining the description as Levels 1A or 3B or 2C, would indicate the different combinations of performance and component density to aid in understanding the environment and the manufacturing requirements of a particular printed board assembly.

Select the correct level depending on your target manufacturing capability and the physical size constraints of your PCB. Using tools like the free PCB Libraries Footprint Expert Calculator or the Footprint Expert can help automatically generate these patterns based on component dimensions.