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Wirebound inductor

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dramos View Drop Down
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Post Options Post Options   Thanks (0) Thanks(0)   Quote dramos Quote  Post ReplyReply Direct Link To This Post Topic: Wirebound inductor
    Posted: 03 Mar 2021 at 5:55am
Hi to all:

I am trying to create a footprint of a wirebound inductor, Murata LQW18AN5N6G80D.

I configured my component as an SMD/Chip/Inductor and as the metalization of the pin part is not the height of the component, I configured the height of the part as the height of the metalization.



How do you resolve that kind of components?

Thanks for your comments.
dramos


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Tom H View Drop Down
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Post Options Post Options   Thanks (0) Thanks(0)   Quote Tom H Quote  Post ReplyReply Direct Link To This Post Posted: 03 Mar 2021 at 9:53am
These Inductors are becoming more popular these days. There should be a mfr. recommended pattern for the footprint. If not, the pad size is: 

Heel = 0.00 but you need to compensate for the +/- body length tolerance of 0.10
Side = 50% of the metal thickness height up the side (Maximum)
Toe = 100% of the metal thickness height up the side (Maximum) 

So the pad size for this part is 0.56 L X 1.20 W. Add 0.05 for the Heel to compensate for the tolerance. 

Here's a SolidWorks 3D model: 




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dramos View Drop Down
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Post Options Post Options   Thanks (0) Thanks(0)   Quote dramos Quote  Post ReplyReply Direct Link To This Post Posted: 04 Mar 2021 at 12:17am
Hi Tom:

Yes you are right . We are using more and more this kind of components in our designs.

Many thanks for your recommendations.

Regards.
David
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IMI4tth3w View Drop Down
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Post Options Post Options   Thanks (0) Thanks(0)   Quote IMI4tth3w Quote  Post ReplyReply Direct Link To This Post Posted: 04 Mar 2021 at 8:53am
I actually just did a footprint for one of these types of inductors.

Coilcraft seems to have pretty good guidelines for footprints in their datasheets.

Here's an example:
https://www.coilcraft.com/en-us/products/rf/ferrite-core-chip-inductors/0603-(1608)/0603ls/


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Tom H View Drop Down
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Post Options Post Options   Thanks (0) Thanks(0)   Quote Tom H Quote  Post ReplyReply Direct Link To This Post Posted: 04 Mar 2021 at 9:06am
Continue to use the mfr. recommended pattern for this new package style and new terminal lead form. 

Automating a software program to calculate the pad stack would need to identify a new terminal lead form and then the solder joint goal table for a 3-Tier density level. 

It's too late to put it in IPC-7351C and it's not in IPC-J-STD-001 yet for assembly solder joint acceptability. 

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Post Options Post Options   Thanks (0) Thanks(0)   Quote Jeromeli Quote  Post ReplyReply Direct Link To This Post Posted: 01 Apr 2022 at 5:55am
I have encountered a similar problem recently, and I am trying to solve it
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Post Options Post Options   Thanks (0) Thanks(0)   Quote Tom H Quote  Post ReplyReply Direct Link To This Post Posted: 01 Apr 2022 at 10:46am
You must use the Manufacturer's Recommended Pattern. 

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