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Same chip size but different terminal metalization

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dramos View Drop Down
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    Posted: 18 Feb 2021 at 2:19am
Hi to all,

I have been making a small research with footprints on same resistor size.

I have been working with Samsung, Vishay and Yageo.

According with PCBLibraries here is the data of each component
 


As it was supposed the size of the pads are different because the metal termiantions are different. I took Samsung and Yageo in order to see any difference between them.


Taking the same center reference here is a comparison.

The top pads are obtained using PCBL with SAMSUNG data
Th ebottom pads are obtained using PCBL with YAGEO data
The green body is the YAGEO resistor.
The  magenta body is the SAMSUNG resistor



The Samsung part on the Yageo footprint is "at limit"
In the other hand, the Yageo part on the Samsung footprint has a big amount of ceramic over the pad.

My opinion is the the Samsung part is ok over the Yageo footprint. 

I would like to know your opinion about it. 
I know that it is impossible to have only a footprint for all  resistors, caps,....

Thanks a lot for your time.
Regards.
David



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Tom H View Drop Down
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Post Options Post Options   Thanks (1) Thanks(1)   Quote Tom H Quote  Post ReplyReply Direct Link To This Post Posted: 18 Feb 2021 at 8:59am
As long as the Terminal Lead is on the pad it will work OK. 

For the Chip component family, the solder strength is under the Terminal Lead and the Toe area. 

The Heel only provides area for packages with different Terminal Lead Lengths. 

The assembly problems occur when the Terminal Lead falls off the pad. 

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