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Footprint Expert 2021.02 Released!!

Printed From: PCB Libraries Forum
Category: PCB Footprint Expert
Forum Name: Version History
Forum Description: software version release announcements & history
URL: https://www.PCBLibraries.com/forum/forum_posts.asp?TID=2871
Printed Date: 06 Dec 2024 at 6:38pm


Topic: Footprint Expert 2021.02 Released!!
Posted By: Nick B
Subject: Footprint Expert 2021.02 Released!!
Date Posted: 15 Apr 2021 at 8:25am

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NEW or Enhanced Features:
  • New Options > Drafting > Courtyard feature to Exclude Body and Pad Excess and ignore pads.
  • Drafting Shapes – Changed the default orientation for the Diode symbol to Cathode on the Left.
  • Updated the IPC-7351C Option file. Removed all negative solder joint goals and manufacturing tolerances.
  • Aluminum Capacitor component family – Footprint Name updated. The Lead Span was removed from old 2018 CAPAE name.
  • Capacitor Polarized, Axial Lead component family – Footprint Name updated. The V2018 axial body physical dimension wrong.
  • Fuse, Radial Lead component family – Footprint Name updated. The old name the letter O added to denote offset leads on radial parts.
  • LED, Radial Disk component family – Footprint Name updated. The old name was using the terminal thickness instead of the width.

Updates & Bugs Fixed:
  • Options > Pad Stack Rules > Diode Pin Names – fixed an issue for Numeric pin names.
  • Fixed an FP Designer Courtyard issue when translating older FPX files to V2021 format.
  • Fixed an FP Designer issue for Round footprints the diameter was coming in at 0.00 when translating old FPX files to V2021 format.
  • Drafting Symbols – when changing the line width value, then selecting “Apply or Done” the original 0.12 value came back.
  • Courtyard Excess – when changing the courtyard excess to 0.00 the courtyard hugs the pads and body, except Chip Components.Axial Lead component family – Correction made to Footprint Name.
  • BGA component family – Correction made to Footprint Name. V2021 was not pulling the body style from the FPX file plus 2021 BGA pins in D & E axis were swapped.
  • Molded Body component family – Correction made to Footprint Name. V2021 footprint name was missing optional L1 dimension.
  • Header, Right Angle component family – Correction made to Footprint Name. V2021 right-angle-header height was missing.
  • Header, Vertical component family – Correction made to Footprint Name.  R and S added to name prefix to denote receptacle or shrouded; height missing in vertical configuration; H replaced X before height.
  • 2-pin Side Concave component family – Correction made to Footprint Name. V2021 doesn’t need pin count for 2 pin parts;  pitch removed as a factor in the side-concave name.
  • QFN Component Family – Correction made to Footprint Name.  Thermal Tab missing from pin quantity in parts with removed or hidden pins.
  • TO, Flange Mount component family – Correction made to Footprint Name. Replaced H with X before height.
  • SOIC component family – Correction made to Footprint Name, Physical Description and 3D STEP model.
  • Footprint Warning text redundancy fixed.


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