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Library Expert 2017.19 Released!!

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Nick B View Drop Down
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    Posted: 06 Oct 2017 at 7:28am
Version 2017.19 was just released!!

  • Calculator:
    • All parts with Thermal Pads – if a Thermal Pad is less than 1.00 mm width, it will now get 100% Paste Mask Coverage
  • Calculator:
    • Non-Plated Mounting Holes – fixed an issue with the Keep-out size generation to follow the Hole Size instead of the pad size
  • Unique Parts:
    • Fixed and issue with footprints with associated copper on slotted holes. This affected all CAD tool translators.
  • POD Builder:
    • Fixed an issue that was creating Handled Exception Errors for certain parts
  • Library Editor:
    • The automatic Manufacturer Name feature was fixed to only activate in the Manufacturer column
  • Drafting Items:
    • Fixed an issue when placing Drafting Outlines on the Bottom Assembly layer, reopening the properties menu displayed the incorrect layer assignment
  • PADS Layout:
    • BGA component family – fixed an issue where unpopulated pins showed up in the Part Type
  • Xpedition:
    • Fixed a problem with non-plated slotted holes that used circular pads smaller than the hole size
  • Allegro/OrCAD PCB:
    • Fixed an issue with offsetting top pads
    • Chamfered Rectangular pads with a corner length greater than half the edge are now converted to custom pads. A rectangle pad stack in Cadence cannot have a corner length that exceeds more than half the width.
    • Custom Pads which are offset from the center of the Pad Stack are now removed from the pad stack and converted to free floating copper. This is the *only* known way of offsetting a shape symbol pad as Allegro appears to be bugged and will not save offsets for Shape Symbol Pads.
    • Fixed a problem with negative rotation arcs that end at 0
    • Fixed a problem that was causing an error when the build was run more than once
    • Attached copper shapes with an offset will now rotate properly with their underlying pad stack
    • The translator will now differentiate when you have two pad stacks that are exactly the same, but differ in offset of attached copper
  • KiCad:
    • Fixed an issue where the terminal outlines were getting duplicated. They should now be generated only once.
    • The two Ref Des texts will now swap their layer. The primary reference text being on the Fabrication layer, and the extra user reference being on the Silkscreen layer.
    • Filled Paste Mask shapes for thermal tab checker-board patterns will no longer translate as unfilled lines. Instead, they will come in as Pads named “” on the F.Paste layer.
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