Fixes & Enhancements:

• Free Calculator: 
• Turned on the local options for Terminal Density Level
• Unique Footprints:
• The Silkscreen Ref Des was not generated
• FP Designer
• Pad Stack Designer:
• Some display and functional issues when using non-millimeter units
• Through Hole roundoffs now works for all unit types (mm, mils. etc.)
• New feature for setting Units for pad stack dimensions and pad stack names
• Pad Stack Manager generated names not following Design Option for pad stack name units
• Calculators:
• DPAK - updated the calculation for the large thermal pad
• DPAK - 2-Pin version throwing an exception
• SON - the 'G' pad stack dimension value was assigned to the longer pin 1 and not the other pins
• SON - the mfr.'s footprint showing the wrong dimension value for 'G'
• DFN 3-Pin - 'G' and 'G1' pad stack dimension values were swapped
• DFN 4-Pin - not showing a trim warning when the 'G1' dimension is trimmed
• QFN - thermal pad 'r' and 'c' cells that were blank were unintentionally populated with 0.00 when opening a footprint
• PQFN & PSON mfr.'s footprint reference drawing erroneously showing a long pin 1' x 1' option
• Chip Array, 4-Sided - the 'G1' pad stack dimension value was 6 places and not following the Design Options