PCB Libraries Forum : Footprint Expert 23.07 Released!!

Footprint Expert 23.07 Released!! : Version 23.07 was just released!!Fixes...

Tue, 02 May 2023 07:58:26 +0000

Author: Nick B
Subject: 3267
Posted: 02 May 2023 at 7:58am

Version 23.07 was just released!!

Fixes & Enhancements:

Options:

Updated the IPC-7352.opt file – The default Thermal Tab Paste Mask Reduction was changed from 50% to 60%

New Library Files:

Added 5 FPX files to the Library folder that contain over 18,600 component mfr. Case Codes:
BGA, SM Discrete, TH Discrete, Semiconductors, Connectors

Calculators:

Updated – Enlarged the graphic dimensional images so that the image fits in the box
DPAK – L1 dimension can now be a negative value and it autogenerates a Thermal Pad
QFN – Assembly Outline was not mapping to the Nominal dimension when set “Map to Nominal” in Options
LCC – Changing a package dimension threw an unhandled exception error
Flange Mount (Horizontal) – the silkscreen to Flat Lug Lead clearance was not following Option settings

Library Editor:

When selecting a single footprint row, selecting the Batch Build option added a duplicate Density Level suffix

FP Designer:

Silkscreen to Pad Clearance Option was not being applied to through-hole pads
Editing package dimensions was not updating the Physical Description
The 3D model was not generating a Polarity Dot

CAD Tool Interfaces:

KiCad – translator didn’t produce rounded-corner shapes for surface mount Square pad