PCB Libraries Forum : Footprint Expert 23.02 Released!! https://www.PCBLibraries.com/forum/ Tue, 07 Apr 2026 14:46:56 +0000 Tue, 17 Jan 2023 09:15:39 +0000 http://blogs.law.harvard.edu/tech/rss Web Wiz Forums 12.07 360 https://www.PCBLibraries.com/forum/RSS_post_feed.asp?TID=3210 <![CDATA[PCB Libraries Forum]]> https://www.PCBLibraries.com/forum/forum_images/PCBLForumLogo.gif https://www.PCBLibraries.com/forum/ <![CDATA[Footprint Expert 23.02 Released!! : Version 23.02 was just released!!Fixes...]]> https://www.PCBLibraries.com/forum/footprint-expert-23-02-released_topic3210_post12772.html#12772 Author: Nick B
Subject: 3210
Posted: 17 Jan 2023 at 9:15am

Version 23.02 was just released!!

 
Fixes & Enhancements:
  • Resolved FIPS issue
  • Options:
    • Console Options was not restoring the component outline color if it was changed and restored
  • FP Designer:
    • Added a new feature – the silkscreen and assembly outlines now map to the outside of the package body outline
    • Assign Pins – Pin reorder was not working 100%
  • Physical Description Text File:
    • Updated the Physical Descriptions for all footprints with Thermal Pads
    • This impacted physical descriptions for footprints created in FP Designer 
  • Calculators:
    • Chip and MELF Assembly Ref Des was using the wrong package dimension to calculate the height
    • Resolved issues with Footprint Names:
      • DFN 2, 3, 4 – duplicating pin quantity
      • DPAK missing a tab dimension
      • SOJ & SOL, and OSCJ & OSCL & Crystal was using lead span E instead of body dimension of E1
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