2021.18 was just released!!

• CAD Tool Translators:
• Fixed an issue with multiple CAD tools. When the Build Library path was too long the program created an alternate folder
• Fixed an issue with KiCad not getting Assembly Outlines on Non-Plated holes
• Fixed an issue with Saving My Settings causing an Unhandled Exception Error
• Options:
• Added a new Rounded Rectangle feature for through-hole square pads in V2021.17 that caused regression for all SMD and PTH rounded rectangle pads
• Changing the 'Density level (suffix)' Option, the “Courtyard to Body Excess” and “Courtyard to Pad Excess” didn't update
• FP Designer:
• Added Cole switches to the ManufactureList.txt
• Fixed a Silkscreen on Pad bug in V2021.17 that caused regression for all FP Designer footprint silkscreen outlines
• Calculators:
• The master options value for Paste Mask is for Annular Ring and it was set to oversize instead
• QFP w/Thermal Add Fiducials changed the thermal pad pin number
• Axial Lead family – the silkscreen did not trim properly when the pads were a close pitch
• Chip component family – the body width dimension was missing the leading zero when using the IPC-7351B naming convention
• BGA Courtyard was 90 degrees out of rotation when opening a rectangle BGA