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   <title><![CDATA[IPC Class : Library Expert produces library...]]></title>
   <link>https://www.PCBLibraries.com/forum/ipc-class_topic2176_post9013.html#9013</link>
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    <![CDATA[<strong>Author:</strong> <a href="https://www.PCBLibraries.com/forum/member_profile.asp?PF=3">Tom H</a><br /><strong>Subject:</strong> 2176<br /><strong>Posted:</strong> 23 Jun 2017 at 1:19pm<br /><br /><div>Library Expert produces library parts for all 3 IPC Classes. The fabrication class code is mostly defined by through-hole pad stacks and not SMD pad stacks and Library Expert supports every standard SMD component family and they are good for all 3 IPC Classes. Other than the standard DIP, SIP and Header, most connector land patterns are created using the mfr. recommended pattern in Library Expert Pro.&nbsp;</div><div><b><br></b></div><div><b>IPC Class 1 </b>- General Electronic Products – Includes limited life products suitable for applications where the requirement is function of the completed product.</div><div><b><br></b></div><div><b>IPC Class 2</b> - Dedicated Service Electronic Products – Includes products where continued performance and extended life is required, and for which uninterrupted service is desired but not critical.</div><div><b><br></b></div><div><b>IPC Class 3</b> - High Reliability Electronic Products – Includes products where continued high performance or performance-on-demand is critical, product downtime cannot be tolerated, and the product must function when required.</div><div><u><b><br></b></u></div><div><u><b>IPC-7351 3-Tier Density library system:&nbsp;</b></u></div><div><br></div><div><div><b>Density Level A: </b>Maximum (Most) Land Protrusion – For low-density product applications, the ‘maximum’ land pattern condition has been developed to accommodate wave or flow solder of leadless chip devices and leaded gull-wing devices. The geometry furnished for these devices, as well as inward and ‘‘J’’-formed lead contact device families, may provide a wider process window for reflow solder processes as well.</div><div><b><br></b></div><div><b>Density Level B: </b>Median (Nominal) Land Protrusion – Products with a moderate level of component density may consider adapting the ‘median’ land pattern geometry. The median land patterns furnished for all device families will provide a robust solder attachment condition for reflow solder processes and should provide a condition suitable for wave or reflow soldering of leadless chip and leaded gull-wing type devices.</div><div><br></div><div><b>Density Level C: </b>Minimum (Least) Land Protrusion – High component density typical of portable and hand-held product applications may consider the ‘minimum’ land pattern geometry variation. Selection of the minimum land pattern geometry may not be suitable for all product use categories.</div></div><div><br></div>]]>
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   <pubDate>Fri, 23 Jun 2017 13:19:57 +0000</pubDate>
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   <title><![CDATA[IPC Class : What class level (1, 2, 3) are...]]></title>
   <link>https://www.PCBLibraries.com/forum/ipc-class_topic2176_post9012.html#9012</link>
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    <![CDATA[<strong>Author:</strong> <a href="https://www.PCBLibraries.com/forum/member_profile.asp?PF=11838">jmeinert</a><br /><strong>Subject:</strong> 2176<br /><strong>Posted:</strong> 23 Jun 2017 at 10:56am<br /><br />What class level (1, 2, 3) are the footprints designed to?]]>
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   <pubDate>Fri, 23 Jun 2017 10:56:21 +0000</pubDate>
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