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  <title>PCB Libraries Forum : Can you have the case code for Footprint</title>
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  <pubDate>Thu, 11 Jun 2026 13:16:32 +0000</pubDate>
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   <title><![CDATA[Can you have the case code for Footprint : You can manually edit every Footprint...]]></title>
   <link>https://www.PCBLibraries.com/forum/can-you-have-the-case-code-for-footprint_topic3381_post13518.html#13518</link>
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    <![CDATA[<strong>Author:</strong> <a href="https://www.PCBLibraries.com/forum/member_profile.asp?PF=3">Tom H</a><br /><strong>Subject:</strong> 3381<br /><strong>Posted:</strong> 19 Apr 2024 at 1:11pm<br /><br />You can manually edit every Footprint Name to whatever you want.&nbsp;<div><br></div><div>You can create as many FPX files as you want.&nbsp;</div><div><br></div><div>You might want to keep all your Footprints in one FPX file and all your 3D STEP models in a separate FPX file.&nbsp;</div><div><br></div><div>Name the FPX files so you know what they contain. Example: <b>Chips.fpx</b> and <b>3D STEP Models.fpx</b></div><div><br></div><div>Use the Import 3D STEP feature in Altium. The 3D STEP rotation and origin are the same as the footprint.&nbsp;</div><div><br></div><div><br></div>]]>
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   <pubDate>Fri, 19 Apr 2024 13:11:07 +0000</pubDate>
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   <title><![CDATA[Can you have the case code for Footprint : Hi Tom,I have a license of 3D...]]></title>
   <link>https://www.PCBLibraries.com/forum/can-you-have-the-case-code-for-footprint_topic3381_post13517.html#13517</link>
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    <![CDATA[<strong>Author:</strong> <a href="https://www.PCBLibraries.com/forum/member_profile.asp?PF=11740">almhuq75</a><br /><strong>Subject:</strong> 3381<br /><strong>Posted:</strong> 19 Apr 2024 at 11:35am<br /><br />Hi Tom,<div><br></div><div>I have a license of 3D STEP file.&nbsp;</div><div><br></div><div>All the parts that I created for the chip capacitor have different part numbers.&nbsp;</div><div><br></div><div>Could i create a case code such as C0805-88 for chip capacitor with height 0.88 mm and another chip capacitor with Case Code C0805-1.4 with a height of 1.40 mm.&nbsp;</div><div><br></div><div>I am creating unique parts in my FPX library although some parts have the same case package.&nbsp;</div><div><br></div><div>Once I batch generate the footprints in Altium I want to link all the footprints with the 3D step files to the schematic symbols that I have created in Altium.&nbsp;</div><div><br></div><div>Once I generate the BOM, I can be sure that the footprints are tied the the parts and accurate.&nbsp;<div><br></div><div>Will PCB FPX library have an issue creating new case code such as C0805-1.4 or should I just create one standard chip capacitor with CAPC0805 case code like you have suggested?</div></div><div><br></div><div>-Al</div>]]>
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   <pubDate>Fri, 19 Apr 2024 11:35:40 +0000</pubDate>
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   <title><![CDATA[Can you have the case code for Footprint : You have 3 different package heights.The...]]></title>
   <link>https://www.PCBLibraries.com/forum/can-you-have-the-case-code-for-footprint_topic3381_post13515.html#13515</link>
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    <![CDATA[<strong>Author:</strong> <a href="https://www.PCBLibraries.com/forum/member_profile.asp?PF=3">Tom H</a><br /><strong>Subject:</strong> 3381<br /><strong>Posted:</strong> 18 Apr 2024 at 3:29pm<br /><br />You have 3 different package heights.&nbsp;<div><br></div><div>The Height does not affect the Footprint, it affects the 3D STEP model.&nbsp;</div><div><br></div><div>i.e.: the same package dimensions and tolerances but different package heights will produce the same pad stacks.</div><div><br></div><div>You could have one main entry for CAPC0805 Footprint Name and multiple rows that have "3D STEP Model" in the Part number.&nbsp;</div><div><br></div><div>However, if you don't have a license for 3D STEP, create one entry in your FPX file. Or make all your Heights the same value to create the same Footprint Name.&nbsp;</div><div><br></div><div>You can have many identical Footprint Names, but when you Batch Build Footprint Expert will only create the first entry and ignore all the duplicate names.</div><div><br></div>]]>
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   <pubDate>Thu, 18 Apr 2024 15:29:43 +0000</pubDate>
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   <title><![CDATA[Can you have the case code for Footprint : Hi All,I have created three ceramic...]]></title>
   <link>https://www.PCBLibraries.com/forum/can-you-have-the-case-code-for-footprint_topic3381_post13514.html#13514</link>
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    <![CDATA[<strong>Author:</strong> <a href="https://www.PCBLibraries.com/forum/member_profile.asp?PF=11740">almhuq75</a><br /><strong>Subject:</strong> 3381<br /><strong>Posted:</strong> 18 Apr 2024 at 1:10pm<br /><br />Hi All,<div><br><div>I have created three ceramic chip capacitors which are 0805 package size.&nbsp;</div><div><br></div><div>The components have almost identical footprints but have different heights.<b>&nbsp;</b></div><div><b><br></b></div><div><b>Can all these chip ceramic capacitors have the same case code (C0805)? What is the naming convention for all the chip capacitors of the same package size?&nbsp;</b></div><div><br></div><div>I also downloaded a chip capacitor from parts on demand Mfr. P/N 08053D105KAT2A which has a case code of C0805.&nbsp;</div><div><br></div><div>Here are the footprints of the parts I've created in my new footprint library:</div><div><br></div><div>The manufacturer is Kemet. The footprint names, physical and logical description are as follows:&nbsp;</div><div>Footprint name&nbsp;<span style="white-space:pre">			</span>Physical description&nbsp;<span style="white-space:pre">								</span></div><div>1. CAPC200X125X88L50&nbsp;<span style="white-space:pre">	</span>Capacitor, Chip; 2.00 mm L X 1.25 mm W X 0.88 mm H body&nbsp;</div><div>logical description&nbsp;</div><div>Capacitor, Chip, Ceramic, General Purpose, 100nF, 50V, X&amp;R, 0805</div><div><br></div><div><div>Footprint name&nbsp;<span style="white-space: pre;">			</span>Physical description&nbsp;<span style="white-space: pre;">								</span></div><div>2. CAPC200X125X140L50&nbsp;<span style="white-space: pre;">	</span>Capacitor, Chip; 2.00 mm L X 1.25 mm W X 1.40 mm H body</div><div>logical description&nbsp;</div><div>Capacitor, Chip, Ceramic, General Purpose, 220nF, 50V, X7R, 0805</div></div><div><br></div><div><div>Footprint name&nbsp;<span style="white-space: pre;">			</span>Physical description&nbsp;<span style="white-space: pre;">								</span></div><div>3. CAPC200X125X100L50&nbsp;<span style="white-space: pre;">	</span>Capacitor, Chip; 2.00 mm L X 1.25 mm W X 1.00 mm H body</div><div>logical description&nbsp;</div><div>Capacitor, Chip, Ceramic, General Purpose, 10nF, 50V, X7R, 0805</div></div><div><br></div></div>]]>
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   <pubDate>Thu, 18 Apr 2024 13:10:59 +0000</pubDate>
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