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The Nominal Calculation section was inspired by the https://www.fed.de/fed-shop/produkt/4607/" rel="nofollow - FED Vol 18 – The New Proportional Land Dimensioning Concepts . For more details, see Appendix I.
Gullwing Leads (SOP, QFP, SOT, DPAK, SOD)
Rectangular and Square-End Cap (Chips)
Inward L Lead Oscillator and Small Outline L-Lead (SOL)
Outward L-Lead (SOT)
Cylindrical End Cap (MELF)
Small Outline No-Lead (SON, QFN)
Small Outline Components, Flat Lead (SOFL, SODFL)
Flat Lug Lead (DPAK)
Small Outline Flat No-Lead Bottom (DFN, LGA, PSON, PQFN)
Under-Body Outward L-Lead (Aluminum Electrolytic Capacitor, Crystal)
Inward Flat Ribbon L-Lead (Molded Body)
Concave & Convex Chip Array and Leadless Chip Carrier (LCC)
J-Leads
Column and Land Grid Array (CGA & LGA)
Corner Concave Oscillator
Collapsing and Non-Collapsing Ball Grid Array (BGA)
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