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Solder Joint Goal Tables for Nominal Calculation

Printed From: PCB Libraries Forum
Category: Libraries
Forum Name: PCB Libraries Guideline
Forum Description: (online edition)
URL: https://www.PCBLibraries.com/forum/forum_posts.asp?TID=3677
Printed Date: 24 Aug 2026 at 3:02pm


Topic: Solder Joint Goal Tables for Nominal Calculation
Posted By: Nick B
Subject: Solder Joint Goal Tables for Nominal Calculation
Date Posted: 15 Aug 2026 at 11:00am
The Nominal Calculation section was inspired by the https://www.fed.de/fed-shop/produkt/4607/" rel="nofollow - FED Vol 18 – The New Proportional Land Dimensioning Concepts . For more details, see Appendix I.

Gullwing Leads (SOP, QFP, SOT, DPAK, SOD)


Rectangular and Square-End Cap (Chips)


Inward L Lead Oscillator and Small Outline L-Lead (SOL)


Outward L-Lead (SOT)


Cylindrical End Cap (MELF)


Small Outline No-Lead (SON, QFN)


Small Outline Components, Flat Lead (SOFL, SODFL)


Flat Lug Lead (DPAK)


Small Outline Flat No-Lead Bottom (DFN, LGA, PSON, PQFN)


Under-Body Outward L-Lead (Aluminum Electrolytic Capacitor, Crystal)


Inward Flat Ribbon L-Lead (Molded Body)


Concave & Convex Chip Array and Leadless Chip Carrier (LCC)


J-Leads


Column and Land Grid Array (CGA & LGA)


Corner Concave Oscillator


Collapsing and Non-Collapsing Ball Grid Array (BGA)



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