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Appendix I - Referenced Sources

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    Posted: 15 Aug 2026 at 11:00am
The following sources have been referenced in this Guideline.

To obtain these documents, click on the document links below:

IPC-7352 - Generic Guideline for Land Pattern Design
(released 05/2023)
Footprint Expert’s automatic padstack calculations are fundamentally based on IPC-735x formulas and geometry rules. This is the core standard Footprint Expert uses. It defines:
  • Land Pattern Naming Conventions for Surface Mount and Through-hole
  • Mathematical Model formula for pad stack dimensions
  • 3-Tier Density levels for Least, Nominal and Most
  • Courtyard Excess toe, heel, and side goals
  • IPC-compliant footprint generation rules 

IPC J-STD-001G - Requirements for Soldered Electrical and Electronic Assemblies
(released 10/2017)
This standard influences Solder Joint Goals for Toe, Heel and Side fillet targets.


IEEE/ANSI 315-1975 - IEEE Standard for Graphic Symbols for Electrical and Electronics Diagrams
(released 12/1975)
Standard Reference Designators


FED Vol 18 - The New Proportional Land Dimensioning Concepts
(released 2018)
Older proportional land pattern methods influenced the historical development of IPC land pattern standards. Many concepts in the FED Vol 18 evolved into IPC-7351 methodologies.


IEC_61188-7 - Zero Component Orientation
(released 2007)
This is used for:
  • Component orientation conventions
  • Zero-degree placement standards
  • Assembly documentation consistency
  • Pin-1 Orientation A - Pin 1 Upper Left
  • Pin-1 Orientation B - Pin 1 Lower Left
  • Rotation/origin conventions
  • Pick-and-place consistency

ECIA PDP-100 - Parts Division Publication 100 Registered and Standard Mechanical Outlines for Electronic Parts
(released 1987)


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