![]() |
![]() |
Multi-component Footprint When Small Changed |
Post Reply ![]() |
Author | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Emilien38 ![]() New User ![]() Joined: 26 May 2025 Status: Offline Points: 2 |
![]() ![]() ![]() ![]() ![]() Posted: 26 May 2025 at 4:12am |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Hello, We started
building our footprint library without the support of a PCB footprint expert,
and we also face several internal constraints:
-
Our
Altium component library is managed by a small team, so it’s more efficient for
us to keep the number of components and footprints to a minimum. Given these
constraints, we’re unsure how best to manage footprints for multiple components
sharing the same package. For example, with SOT23-3 components, generic name, MFR/MPN equivalent, FootPrintName according to pcblibraries
Table : 1
Pcblibraries
naming conventions : For the
first line of the table 1, there are three multi-source parts. This means
that these three footprints must be exactly the same. Many companies use
multi-source components to manage the supply chain without issues during the
assembly process.
Note: On PCBLibraries.com component from Nexperia
seems to have NEXPERIA_SOT23 Casecode instead
of TO-236AB (except TL431A) ? Why Nexperia doesn’t have a generic footprint
name like SOT23-3P95_290X230X110L30X43 ? Question is
: All of they footprint are compatible for assembly ? Only one footprint can be
created with the worst case dimension? There is a difference about the pitch with “diodes”
footprint with 40µm less. One difference
is the length and height of the body which have an influence only in the 3D
body (we used max 3D body with additional margin, so not a big issues) It should
be very interesting for us (and other companies?) to link these footprints and
maybe to add some acceptable tolerance (+/-100µm ? or 5% for some criteria) to
check the compatibilities in order to generate only one footprint if possible.
Same thing
here : with SOT23-5
Note: On
PCBLibraries.com, the ST LD3985 seems to have an incorrect case code:
"SOT23-5" instead of "SOT23-5L". Same
question here: the footprint provided by ST shows lead dimensions that are 0.2 mm smaller… How should we handle this? (Sorry for this big post) Thank you for your help. Emilien |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Tom H ![]() Admin Group ![]() ![]() Joined: 05 Jan 2012 Location: San Diego, CA Status: Offline Points: 5789 |
![]() ![]() ![]() ![]() ![]() |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Package body dimensions that are within a 0.20 mm difference from each other can be combined into a single footprint by taking the average dimensions.
The only problem is a different pin pitch cannot be tolerated. There's another issue with component manufacturers. With chip components like 0603, there are many vendors and the electronic function can be the same values between manufacturers. You might have an AVX chip resistor but the assembly shop stock is an equivalent value in Vishay. Just because the value is the same, doesn't mean the package dimensions and tolerances are the same. However, in the SOT23, are the component functions swappable between manufacturers? Do you need to create a unique footprint for every SOT23 manufacturer? We would us 'Silicon Expert' as a source to find out all the equivalent vendors and then try to create a master pattern to accommodate all the SOT23 vendors that have identical functions. If the NXP component electronic function is unique and no other vendor has an equivalent function, then you need to single source NXP as your vendor. However, Silicon Expert has all the vendors with equivalent electronic functions for the same component package. It's the package tolerances that vary from vendor to vendor. These can be rounded up and down to make them match between vendors. Lastly, the ST Microelectronics P/N LD3985 is a BGA, not a SOT23. |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() |
Post Reply ![]() |
|
Tweet |
Forum Jump | Forum Permissions ![]() You cannot post new topics in this forum You cannot reply to topics in this forum You cannot delete your posts in this forum You cannot edit your posts in this forum You cannot create polls in this forum You cannot vote in polls in this forum |