The "Package Editor" for through-hole technology allows the user to define hole locations, hole sizes, plated & non-plated and hole pin names. Then you insert the component package outline around (or inside the hole pattern) and save to a PKG file format. The hole locations can be on many different grid spacings and various hole sizes and plating options. You will be able to create any non-standard through-hole library part in the world. The footprint will still be generated using IPC rules, but we cannot automatically create a variable print feature for highly customized parts with dozens of dimensions that are unique for each package. However, the dimensions for these non-standard footprints will be identical to the "mfr. recommended footprint" so there is no need for the FPX program to duplicate this data.

 

 

We need to postpone this feature because it will take 2 months to develop and all programmers are currently focused on the creation of the "Package Editor" for non-standard through-hole component families (including 50,000 connectors) and the "Footprint Editor" for non-standard surface mount library parts using the mfr. recommended patterns and 3D-STEP model export, additional CAD tool exports and the "Parts on Demand" (POD) library content.

 

So the "Print" feature probably will not happen any time soon and when it does, it will only apply to the IPC standard packages which only represent less than 50% of the component packages in the industry today.