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   <title><![CDATA[PCB Marking :   Is the &amp;#034;M&amp;#034; the last...]]></title>
   <link>https://www.PCBLibraries.com/forum/pcb-marking_topic626_post2129.html#2129</link>
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    <![CDATA[<strong>Author:</strong> <a href="https://www.PCBLibraries.com/forum/member_profile.asp?PF=3">Tom H</a><br /><strong>Subject:</strong> 626<br /><strong>Posted:</strong> 25 Oct 2012 at 8:30am<br /><br />Is the "M" the last character in the Footprint Name? <div>&nbsp;</div><div>If so, it was built using the IPC-7351 "Most" Environment. </div><div>&nbsp;</div><div><font size="3" face="Times New Roman"></font><p style="margin: 0in 0in 10pt 0.5in; text-indent: -0.25in; mso-list: l0 level1 lfo1; tab-stops: list .5in;" ="Ms&#111;normal"><span style="line-height: 115%; font-family: Wingdings; font-size: 9pt; mso-fareast-font-family: Wingdings; mso-bidi-font-family: Wingdings;"><span style="mso-list: Ignore;">n<span style='font: 7ptormal "Times New Roman"; font-size-adjust: n&#111;ne; font-stretch: normal;'>&nbsp; </span></span></span><b><span style='line-height: 115%; font-family: "Verdana","sans-serif"; font-size: 9pt;'>IPC-7351Density Level A: </span></b><span style='line-height: 115%; font-family: "Verdana","sans-serif"; font-size: 9pt;'>Maximum (Most) Land Protrusion – Forlow-density product applications, the 'maximum' land pattern condition has beendeveloped to accommodate wave or flow solder of leadless chip devices andleaded gull wing devices. The geometry furnished for these devices, as well asinward and “J” - formed lead contact device families, may provide a widerprocess window for reflow solder processes as well.</span></p><font size="3" face="Times New Roman"></font><p style="margin: 0in 0in 10pt 0.5in; text-indent: -0.25in; mso-list: l0 level1 lfo1; tab-stops: list .5in;" ="Ms&#111;normal"><span style="line-height: 115%; font-family: Wingdings; font-size: 9pt; mso-fareast-font-family: Wingdings; mso-bidi-font-family: Wingdings;"><span style="mso-list: Ignore;">n<span style='font: 7ptormal "Times New Roman"; font-size-adjust: n&#111;ne; font-stretch: normal;'>&nbsp; </span></span></span><b><span style='line-height: 115%; font-family: "Verdana","sans-serif"; font-size: 9pt;'>IPC-7351Density Level B: </span></b><span style='line-height: 115%; font-family: "Verdana","sans-serif"; font-size: 9pt;'>Median (Nominal) Land Protrusion – Productswith a moderate level of component density may consider adapting the 'median'land pattern geometry. The median land patterns furnished for all devicefamilies will provide a robust solder attachment condition for reflow solderprocesses and should provide a condition suitable for wave or reflow solderingof leadless chip and leaded Gull Wing type devices.<?: prefix = o ns = "urn:schemas-microsoft-com:office:office" /><o:p></o:p></span></p><font size="3" face="Times New Roman"></font><p style="margin: 0in 0in 10pt 0.5in; text-indent: -0.25in; mso-list: l0 level1 lfo1; tab-stops: list .5in;" ="Ms&#111;normal"><span style="line-height: 115%; font-family: Wingdings; font-size: 9pt; mso-fareast-font-family: Wingdings; mso-bidi-font-family: Wingdings;"><span style="mso-list: Ignore;">n<span style='font: 7ptormal "Times New Roman"; font-size-adjust: n&#111;ne; font-stretch: normal;'>&nbsp; </span></span></span><b><span style='line-height: 115%; font-family: "Verdana","sans-serif"; font-size: 9pt;'>IPC-7351Density Level C: </span></b><span style='line-height: 115%; font-family: "Verdana","sans-serif"; font-size: 9pt;'>Minimum (Least) Land Protrusion – Highcomponent density typical of portable and hand-held product applications mayconsider the 'minimum' land pattern geometry variation.</p><div><o:p></o:p>&nbsp;</div><div><o:p>&nbsp;</o:p></span>Note: IPC and IEC are both considering dropping the "Most" Envirnoment in the near future. It will still be available for PC boards that require hand-soldering. It has been proven that the "Nominal" Environment passes all the stress tests that the "Most" Environment does. So there is no longer a future need for the "Most" Environment. The "Least" environment will become the new Standard Footprint pattern coming up in the near future.</div><div>&nbsp;</div><font size="3" face="Times New Roman"></font></div>]]>
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   <pubDate>Thu, 25 Oct 2012 08:30:46 +0000</pubDate>
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   <title><![CDATA[PCB Marking :  I need help determining what&amp;#039;s...]]></title>
   <link>https://www.PCBLibraries.com/forum/pcb-marking_topic626_post2121.html#2121</link>
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    <![CDATA[<strong>Author:</strong> <a href="https://www.PCBLibraries.com/forum/member_profile.asp?PF=1156">mlh_biomed</a><br /><strong>Subject:</strong> 626<br /><strong>Posted:</strong> 24 Oct 2012 at 9:29am<br /><br />I need help determining what's the component on my computer PCB marked with M, it is surface mounted similar to a capacitor or an inductor.&nbsp; <div>&nbsp;</div>Measured it with no resistance and has 0.12 uF.<div>&nbsp;</div><div>Thanks</div>]]>
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   <pubDate>Wed, 24 Oct 2012 09:29:52 +0000</pubDate>
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