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  <title>PCB Libraries Forum : Through-hole Naming Convention Suffix?</title>
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  <pubDate>Tue, 07 Apr 2026 01:14:54 +0000</pubDate>
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   <title><![CDATA[Through-hole Naming Convention Suffix? : Yes ]]></title>
   <link>https://www.PCBLibraries.com/forum/throughhole-naming-convention-suffix_topic3535_post14027.html#14027</link>
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    <![CDATA[<strong>Author:</strong> <a href="https://www.PCBLibraries.com/forum/member_profile.asp?PF=3">Tom H</a><br /><strong>Subject:</strong> 3535<br /><strong>Posted:</strong> 14 Sep 2025 at 9:08am<br /><br />Yes]]>
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   <pubDate>Sun, 14 Sep 2025 09:08:43 +0000</pubDate>
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   <title><![CDATA[Through-hole Naming Convention Suffix? : So the mentioned statement means...]]></title>
   <link>https://www.PCBLibraries.com/forum/throughhole-naming-convention-suffix_topic3535_post14023.html#14023</link>
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    <![CDATA[<strong>Author:</strong> <a href="https://www.PCBLibraries.com/forum/member_profile.asp?PF=11979">m.elsayed</a><br /><strong>Subject:</strong> 3535<br /><strong>Posted:</strong> 14 Sep 2025 at 5:50am<br /><br /><font size="3">So the mentioned statement means there is no suffix N in below cases also through hole, is this correct?</font><div><font size="3"><br></font><div><font size="3">"When a Surface Mount footprint uses the Mfr. Recommended Pattern or the footprint is non-standard, there is no Density Level for these footprints as they are the mfr. recommended patterns."</font></div><div><font size="2"><br></font></div></div>]]>
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   <pubDate>Sun, 14 Sep 2025 05:50:10 +0000</pubDate>
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   <title><![CDATA[Through-hole Naming Convention Suffix? : Also, when a Surface Mount footprint...]]></title>
   <link>https://www.PCBLibraries.com/forum/throughhole-naming-convention-suffix_topic3535_post14015.html#14015</link>
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    <![CDATA[<strong>Author:</strong> <a href="https://www.PCBLibraries.com/forum/member_profile.asp?PF=3">Tom H</a><br /><strong>Subject:</strong> 3535<br /><strong>Posted:</strong> 13 Sep 2025 at 8:17am<br /><br /><font size="3">Also, when a Surface Mount footprint uses the Mfr. Recommended Pattern or the footprint is non-standard, there is no Density Level for these footprints as they are the mfr. recommended patterns.</font><div><br></div>]]>
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   <pubDate>Sat, 13 Sep 2025 08:17:58 +0000</pubDate>
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   <title><![CDATA[Through-hole Naming Convention Suffix? : The 3-Tier library system only...]]></title>
   <link>https://www.PCBLibraries.com/forum/throughhole-naming-convention-suffix_topic3535_post14014.html#14014</link>
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    <![CDATA[<strong>Author:</strong> <a href="https://www.PCBLibraries.com/forum/member_profile.asp?PF=3">Tom H</a><br /><strong>Subject:</strong> 3535<br /><strong>Posted:</strong> 13 Sep 2025 at 8:09am<br /><br /><font size="3">The 3-Tier library system only pertains to Surface Mount footprints.&nbsp;</font><div><br></div><div><img src="uploads/3/3-Tier_SMD.png" height="659" width="794" border="0" /><br></div><div>&nbsp;</div><div><font size="3">There is only 1-Tier for through-hole and we refer to it as 'Proportional' pad stacks where the pad diameter is 1.5 times the hole diameter.&nbsp;</font></div><div><br></div><div><img src="uploads/3/Proporti&#111;nal_PTH_Padstacks_2025-09-13_08-01-07.png" height="486" width="910" border="0" /><br></div><div>&nbsp;</div>]]>
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   <pubDate>Sat, 13 Sep 2025 08:09:01 +0000</pubDate>
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   <title><![CDATA[Through-hole Naming Convention Suffix? : I noticed Through-hole Naming...]]></title>
   <link>https://www.PCBLibraries.com/forum/throughhole-naming-convention-suffix_topic3535_post14013.html#14013</link>
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    <![CDATA[<strong>Author:</strong> <a href="https://www.PCBLibraries.com/forum/member_profile.asp?PF=11979">m.elsayed</a><br /><strong>Subject:</strong> 3535<br /><strong>Posted:</strong> 13 Sep 2025 at 12:16am<br /><br />I noticed Through-hole Naming Convention doesn't contain an N suffix.&nbsp;<div><br></div><div>However Surface Mount contains the suffix 'N' when using Nominal Density Level in Options.&nbsp;<div><br><div>Can you explain this point?</div><div><br></div></div></div>]]>
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   <pubDate>Sat, 13 Sep 2025 00:16:38 +0000</pubDate>
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