The DFN and LGA are "Bottom Only" terminals.

The solder joint goal for DFN's is 0 (zero) and the only pad periphery is the lead and manufacturing tolerances. It's a very small periphery (annular) solder joint and rounded corners do not work well.

The solder joint goal for micro-miniature DFN pad size is equal to the lead size and subtracts -0.04 mm to compensate for the lead and manufacturing tolerances. We can't have exposed component leads without a pad under them.

However, the QFN (where the lead goes all the way to the component body edge and up the side 0.20 mm) should have a Rounded Rectangle pad shape. So we're adding that option in V2015.01 as a new feature.

Not sure if this is really a bug or not. 

In User Setup Preferences under "Dual Flat No-Lead (DFN)" for the "Default Pad Shape" only Rectangle is available. 

There is no Rounded Rectangle option. 

Not sure if this is due to IPC specs or if this is a slight bug?

Thanks, Mike