Through-hole Naming Convention Suffix?
Printed From: PCB Libraries Forum
Category: PCB Footprint Expert
Forum Name: Questions & Answers
Forum Description: issues and technical support
URL: https://www.PCBLibraries.com/forum/forum_posts.asp?TID=3535
Printed Date: 13 Sep 2025 at 10:28am
Topic: Through-hole Naming Convention Suffix?
Posted By: m.elsayed
Subject: Through-hole Naming Convention Suffix?
Date Posted: 13 Sep 2025 at 12:16am
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I noticed Through-hole Naming Convention doesn't contain an N suffix. However Surface Mount contains the suffix 'N' when using Nominal Density Level in Options.
Can you explain this point? |
Replies:
Posted By: Tom H
Date Posted: 13 Sep 2025 at 8:09am
The 3-Tier library system only pertains to Surface Mount footprints.  There is only 1-Tier for through-hole and we refer to it as 'Proportional' pad stacks where the pad diameter is 1.5 times the hole diameter.  ------------- Stay connected - follow us! https://twitter.com/PCBLibraries" rel="nofollow - X - http://www.linkedin.com/company/pcb-libraries-inc-/" rel="nofollow - LinkedIn |
Posted By: Tom H
Date Posted: 13 Sep 2025 at 8:17am
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Also, when a Surface Mount footprint uses the Mfr. Recommended Pattern or the footprint is non-standard, there is no Density Level for these footprints as they are the mfr. recommended patterns. ------------- Stay connected - follow us! https://twitter.com/PCBLibraries" rel="nofollow - X - http://www.linkedin.com/company/pcb-libraries-inc-/" rel="nofollow - LinkedIn |