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  <title>PCB Libraries Forum : Chip Array Solder Joint Goals</title>
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  <description><![CDATA[This is an XML content feed of; PCB Libraries Forum : Footprints / Land Patterns : Chip Array Solder Joint Goals]]></description>
  <pubDate>Thu, 16 Apr 2026 03:30:42 +0000</pubDate>
  <lastBuildDate>Wed, 01 Aug 2012 09:59:27 +0000</lastBuildDate>
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   <title><![CDATA[Chip Array Solder Joint Goals :    You are OK using PCB Footprint...]]></title>
   <link>https://www.PCBLibraries.com/forum/chip-array-solder-joint-goals_topic483_post1472.html#1472</link>
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    <![CDATA[<strong>Author:</strong> <a href="https://www.PCBLibraries.com/forum/member_profile.asp?PF=3">Tom H</a><br /><strong>Subject:</strong> 483<br /><strong>Posted:</strong> 01 Aug 2012 at 9:59am<br /><br />You are OK using PCB Footprint Expert "Least" environment. <div>&nbsp;</div><div>The PCB Footprint Expert uses advanced technology for the unreleased version IPC-7351C. </div><div>&nbsp;</div><div>If you want to know the differences between IPC-7351B and IPC-7351C download the Power Point presentation here - </div><div><a href="http://www.pcblibraries.com/forum/pcb-library-optimizati&#111;n-presentati&#111;n-free_topic468.html" target="_blank" rel="nofollow">http://www.pcblibraries.com/forum/pcb-library-optimization-presentation-free_topic468.html</a></div><div>&nbsp;</div><div>The &lt; 1.6 mm is being updated to &lt; 2.0 mm to define mico-miniature component packages. The &lt; 1.6 mm was originally defined as any component body length less than an 0603 (metric 1608) package, when in fact, the 0603 needs to be included in the mico-miniature component package category. </div><div>&nbsp;</div>]]>
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   <pubDate>Wed, 01 Aug 2012 09:59:27 +0000</pubDate>
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   <title><![CDATA[Chip Array Solder Joint Goals : I see the difference, but now...]]></title>
   <link>https://www.PCBLibraries.com/forum/chip-array-solder-joint-goals_topic483_post1471.html#1471</link>
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    <![CDATA[<strong>Author:</strong> <a href="https://www.PCBLibraries.com/forum/member_profile.asp?PF=107">rickdehart</a><br /><strong>Subject:</strong> 483<br /><strong>Posted:</strong> 01 Aug 2012 at 9:45am<br /><br /><DIV>I see the difference, but now I'm looking&nbsp;at Solder Joint Goals for&nbsp;&gt; 1.6mm at Least.&nbsp; (Not micro-miniature)</DIV><DIV>&nbsp;</DIV><DIV>IPC (Least) Toe = 0.35, Heel = -0.10, Side = -0.10</DIV><DIV>Footprint Expert (Least) Toe = 0.15, Heel = 0, Side = -0.05</DIV><DIV>&nbsp;</DIV><DIV>Do I have outdated numbers for IPC?&nbsp;&nbsp;Am I okay using the Footprint Expert (Least) numbers?</DIV>]]>
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   <pubDate>Wed, 01 Aug 2012 09:45:18 +0000</pubDate>
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   <title><![CDATA[Chip Array Solder Joint Goals :   It depends on the size of...]]></title>
   <link>https://www.PCBLibraries.com/forum/chip-array-solder-joint-goals_topic483_post1468.html#1468</link>
   <description>
    <![CDATA[<strong>Author:</strong> <a href="https://www.PCBLibraries.com/forum/member_profile.asp?PF=3">Tom H</a><br /><strong>Subject:</strong> 483<br /><strong>Posted:</strong> 31 Jul 2012 at 7:42am<br /><br />It depends on the size of the Chip Array. <div>&nbsp;</div><div>Body Length 2 mm or greater Toe= 0.35, Heel= -0.10, Side= -0.10</div><div>&nbsp;</div><div>Body Length less than 2 mm Toe=0.20, Heel= 0.00, Side= 0.00 </div><div>&nbsp;</div><div>Same theory standard Chip Resistors &amp;&nbsp;Capacitors. </div><div>&nbsp;</div><div>The are solder joint goals for micro-miniature components must be reduced to avoid excess solder to prevent solder balls and tombstoning.</div><div>&nbsp;&nbsp;</div>]]>
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   <pubDate>Tue, 31 Jul 2012 07:42:26 +0000</pubDate>
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   <title><![CDATA[Chip Array Solder Joint Goals : I noticed adifference between...]]></title>
   <link>https://www.PCBLibraries.com/forum/chip-array-solder-joint-goals_topic483_post1439.html#1439</link>
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    <![CDATA[<strong>Author:</strong> <a href="https://www.PCBLibraries.com/forum/member_profile.asp?PF=107">rickdehart</a><br /><strong>Subject:</strong> 483<br /><strong>Posted:</strong> 26 Jul 2012 at 2:08pm<br /><br />I noticed a&nbsp;difference between IPC chip array solder joint goals of Toe= 0.35, Heel= -0.10, Side= -0.10&nbsp;and PCB Libraries solder joint goals of Toe=0.20, Heel= 0.00, Side= 0.00.&nbsp; Can you correct me if I'm wrong and if not can you please explain?<DIV></DIV><DIV></DIV><DIV></DIV><DIV></DIV>Thanks,<DIV>Rick</DIV>]]>
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   <pubDate>Thu, 26 Jul 2012 14:08:52 +0000</pubDate>
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