PCB Libraries Forum : Solder Joint Goal Tables for Nominal Calculation https://www.PCBLibraries.com/forum/ Thu, 20 Aug 2026 14:38:41 +0000 Sat, 15 Aug 2026 11:00:52 +0000 http://blogs.law.harvard.edu/tech/rss Web Wiz Forums 12.07 360 https://www.PCBLibraries.com/forum/RSS_post_feed.asp?TID=3677 <![CDATA[PCB Libraries Forum]]> https://www.PCBLibraries.com/forum/forum_images/PCBLForumLogo.gif https://www.PCBLibraries.com/forum/ <![CDATA[Solder Joint Goal Tables for Nominal Calculation : The Nominal Calculation section...]]> https://www.PCBLibraries.com/forum/solder-joint-goal-tables-for-nominal-calculation_topic3677_post14616.html#14616 Author: Nick B
Subject: 3677
Posted: 15 Aug 2026 at 11:00am

The Nominal Calculation section was inspired by the FED Vol 18 – The New Proportional Land Dimensioning Concepts. For more details, see Appendix I.

Gullwing Leads (SOP, QFP, SOT, DPAK, SOD)


Rectangular and Square-End Cap (Chips)


Inward L Lead Oscillator and Small Outline L-Lead (SOL)


Outward L-Lead (SOT)


Cylindrical End Cap (MELF)


Small Outline No-Lead (SON, QFN)


Small Outline Components, Flat Lead (SOFL, SODFL)


Flat Lug Lead (DPAK)


Small Outline Flat No-Lead Bottom (DFN, LGA, PSON, PQFN)


Under-Body Outward L-Lead (Aluminum Electrolytic Capacitor, Crystal)


Inward Flat Ribbon L-Lead (Molded Body)


Concave & Convex Chip Array and Leadless Chip Carrier (LCC)


J-Leads


Column and Land Grid Array (CGA & LGA)


Corner Concave Oscillator


Collapsing and Non-Collapsing Ball Grid Array (BGA)


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