<?xml version="1.0" encoding="utf-8" ?>
<?xml-stylesheet type="text/xsl" href="RSS_xslt_style.asp" version="1.0" ?>
<rss version="2.0" xmlns:WebWizForums="https://syndication.webwiz.net/rss_namespace/">
 <channel>
  <title>PCB Libraries Forum : Class A (Most) Land Pattern Extended Pads</title>
  <link>https://www.PCBLibraries.com/forum/</link>
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  <pubDate>Tue, 14 Apr 2026 22:38:02 +0000</pubDate>
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  <docs>http://blogs.law.harvard.edu/tech/rss</docs>
  <generator>Web Wiz Forums 12.07</generator>
  <ttl>360</ttl>
  <WebWizForums:feedURL>https://www.PCBLibraries.com/forum/RSS_post_feed.asp?TID=3391</WebWizForums:feedURL>
  <image>
   <title><![CDATA[PCB Libraries Forum]]></title>
   <url>https://www.PCBLibraries.com/forum/forum_images/PCBLForumLogo.gif</url>
   <link>https://www.PCBLibraries.com/forum/</link>
  </image>
  <item>
   <title><![CDATA[Class A (Most) Land Pattern Extended Pads : You can&amp;#039;t manually solder...]]></title>
   <link>https://www.PCBLibraries.com/forum/class-a-most-land-pattern-extended-pads_topic3391_post13553.html#13553</link>
   <description>
    <![CDATA[<strong>Author:</strong> <a href="https://www.PCBLibraries.com/forum/member_profile.asp?PF=3">Tom H</a><br /><strong>Subject:</strong> 3391<br /><strong>Posted:</strong> 11 Jun 2024 at 8:30am<br /><br /><div>You can't manually solder BTC or Grid Array parts, and Gullwing parts don't require a lot of solder on the Toe.&nbsp;</div><div><br></div>However, 80% of the parts on a typical PCB layout are Chips. Here is the IPC J-STD-001 guidelines for Chip packages. The main focus is the "F" dimension or the Toe solder joint goal.<div><br></div><div><img src="uploads/3/IPC_J-STD-001_for_Chips.png" height="487" width="1000" border="0" /><br></div>]]>
   </description>
   <pubDate>Tue, 11 Jun 2024 08:30:36 +0000</pubDate>
   <guid isPermaLink="true">https://www.PCBLibraries.com/forum/class-a-most-land-pattern-extended-pads_topic3391_post13553.html#13553</guid>
  </item> 
  <item>
   <title><![CDATA[Class A (Most) Land Pattern Extended Pads : Hey everyone,My understanding...]]></title>
   <link>https://www.PCBLibraries.com/forum/class-a-most-land-pattern-extended-pads_topic3391_post13552.html#13552</link>
   <description>
    <![CDATA[<strong>Author:</strong> <a href="https://www.PCBLibraries.com/forum/member_profile.asp?PF=18524">Alex Quilty</a><br /><strong>Subject:</strong> 3391<br /><strong>Posted:</strong> 11 Jun 2024 at 7:28am<br /><br />Hey everyone,<div><br>My understanding for IPC's Class A Land Patterns is that they perform just as well as Class B (Nominal) Land Patterns. I also know that the Class A Land Patterns have been kept for those who may be soldering the component to the PCB by hand. Finally, where I am a little confused, is where a particular Pad may be too small or too big, this could cause issues in manufacturing to IPC Class specifications depending on the size, which leads me to the question:&nbsp;<br><br>Is it okay to extend my Pads to allow for easier hand soldering? If so, how much longer am I allowed to make these Pads before it degrades the Fillet too much, since the solder would be spreading along the Pad instead of climbing the lead to form the Filet?<br><br>Edit: I just noticed the Land Pattern Forum section, I can move this there if you would like, otherwise I will leave it here, or if a MOD could move this post, that would be awesome! Let me know if you want me to move it.</div>]]>
   </description>
   <pubDate>Tue, 11 Jun 2024 07:28:49 +0000</pubDate>
   <guid isPermaLink="true">https://www.PCBLibraries.com/forum/class-a-most-land-pattern-extended-pads_topic3391_post13552.html#13552</guid>
  </item> 
 </channel>
</rss>