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  <title>PCB Libraries Forum : TO-220 Package Footprint name</title>
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  <description><![CDATA[This is an XML content feed of; PCB Libraries Forum : Footprints / Land Patterns : TO-220 Package Footprint name]]></description>
  <pubDate>Wed, 15 Apr 2026 20:56:04 +0000</pubDate>
  <lastBuildDate>Thu, 03 Jun 2021 11:34:10 +0000</lastBuildDate>
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   <title><![CDATA[TO-220 Package Footprint name : The only reason to spread the...]]></title>
   <link>https://www.PCBLibraries.com/forum/to220-package-footprint-name_topic2922_post11644.html#11644</link>
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    <![CDATA[<strong>Author:</strong> <a href="https://www.PCBLibraries.com/forum/member_profile.asp?PF=3">Tom H</a><br /><strong>Subject:</strong> 2922<br /><strong>Posted:</strong> 03 Jun 2021 at 11:34am<br /><br />The only reason to spread the pins out is because the pin pitch is too small and the pad size too large and they short together.&nbsp;<div><br></div><div>The Footprint Name includes the pin pitch.&nbsp;</div><div><br></div><div>Ideally you want all the pads in a single row, but if the pads short together then you must bend the terminal leads to separate the pads so they do not short.&nbsp;</div><div><br></div><div>The footprint name doesn't change because you only have 2 options.&nbsp;</div><div><br></div><div>Pads in a row or staggered pads if the pin pitch is too tight.&nbsp;</div><div><br></div>]]>
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   <pubDate>Thu, 03 Jun 2021 11:34:10 +0000</pubDate>
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   <title><![CDATA[TO-220 Package Footprint name : Because IPC did not provide any...]]></title>
   <link>https://www.PCBLibraries.com/forum/to220-package-footprint-name_topic2922_post11641.html#11641</link>
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    <![CDATA[<strong>Author:</strong> <a href="https://www.PCBLibraries.com/forum/member_profile.asp?PF=3">Tom H</a><br /><strong>Subject:</strong> 2922<br /><strong>Posted:</strong> 02 Jun 2021 at 7:41am<br /><br />Because IPC did not provide any land pattern naming convention guidance for Vertical or Horizontal Flange Mount component family.&nbsp;<div><br></div><div>I guess we could create our own since IPC did not address this in the IPC-7351 guideline.&nbsp;</div><div><br></div><div>What would you propose?&nbsp;</div><div><br></div>]]>
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   <pubDate>Wed, 02 Jun 2021 07:41:30 +0000</pubDate>
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   <title><![CDATA[TO-220 Package Footprint name : Hi Tom,I have a Question regarding...]]></title>
   <link>https://www.PCBLibraries.com/forum/to220-package-footprint-name_topic2922_post11640.html#11640</link>
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    <![CDATA[<strong>Author:</strong> <a href="https://www.PCBLibraries.com/forum/member_profile.asp?PF=15710">Bharat_Verma</a><br /><strong>Subject:</strong> 2922<br /><strong>Posted:</strong> 01 Jun 2021 at 9:42pm<br /><br />Hi Tom,<div>I have a Question regarding Footprint name for flange mount TO-220 VERTICAL .</div><div><br></div><div>There are two different style or pattern of lead location for which Footprint name remain same.</div><div><br></div><div>See attached example. Why it was not differentiated ?</div><div><br></div><div><img src="uploads/15710/TO-220_Vertical-2.jpg" height="516" width="1000" border="0" /><br></div><div><br></div><div><img src="uploads/15710/TO-220_Vertical-1.jpg" height="519" width="1000" border="0" /><br></div>]]>
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   <pubDate>Tue, 01 Jun 2021 21:42:56 +0000</pubDate>
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