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IPC-7351A LP Wizard
The “IPC-7351A LP Wizard” is the library maintenance
tool that builds parts for PADS, Pantheon, Allegro, and Boardstation, that simply revolutionize the way designers work. The
IPC-7351A LP family tools can give you access to options that will allow you
to quickly and easily browse your PCB land pattern library to locate, view, construct
and verify the mechanics of your PCB library design.
 The LP Wizard is designed to interact with the IPC-7351A PCB library.
It is a fantastic time saver, and it will build
you CAD library part with phenomenal precision. There are
so many features in today’s
CAD library part that even if you are building a standard
SMT Library Part, the process will take you 30 minutes
per part. With the Wizard, it just takes a couple of minutes.
The IPC-7351A LP Wizard is an IPC-7351A SMT land pattern
calculator that allows the user to define their own CAD land
patterns if they
cannot locate the correct CAD library part, then automatically
build the CAD Library Decals in their native CAD
format. The IPC-7351A LP Wizard will eventually
automatically build CAD land pattern symbols in the IPC-2581
neutral CAD database format
that can be imported into any CAD Tool.
The IPC-7351A LP Wizard allows you to
change the Manufacturing Tolerances that determine the
pad size, Placement Courtyard Tolerance, PAD Width Round-off,
Component Tolerance,
Land Pattern Name, and the Solder Joint Analysis. Alternatively,
you can simply use the default IPC settings.
The IPC-7351A LP Calculator provides the Pick & Place Zero Component
Rotation for accurate assembly data. The JEDEC JEP95 publication and the EIA
/ ANSI 481 specification for tape and reel packaging was used to determine
the exact component zero rotation on the assembly tape and reel or tube so
that you can build all your CAD library parts in the same zero rotation to
provide your vendors with accurate assembly data.
The IPC-7351A 3-Tier Library System
Land patterns need an accurate Solder Joint Statistical Analysis. To help ensure
that you have good solder joints regardless of what size tolerance (minimum,
nominal or maximum) the components come in, use the LP Wizard.
The solder joint analysis data is a must when it comes to DFA. Only the
IPC-7351A LP Wizard provides you the solder joint analysis information
that you need to insure a perfect Land Pattern.
The IPC-7351A LP Wizard is in accordance
with the new IPC-7351A specification. Different electronic products
have different requirements for reliability, maintainability and
board density. With the 3-tiered library construction concept built
into the IPC-7351A LP Wizard, you can generate land patterns
to meet different requirements by varying the pad and courtyard dimensions.
Three land pattern geometry variations are
supplied for each of the device families; maximum land protrusion
(Density Level A), median land protrusion (Density Level B) and minimum
land protrusion (Density Level C). With the 3-tiered library construction
concept built into our IPC-7351A tools you can generate land patterns
to meet those different requirements by varying the pad and courtyard
dimensions.
Here are the three different tiers and how and when you should use them:
Density Level A: Maximum (Most) Land Protrusion
For low-density product applications,
the 'maximum' land pattern condition has been developed to accommodate wave or flow solder of leadless chip devices
and leaded gull- wing devices. The geometry furnished for these devices, as well as inward and “J”-formed
lead contact device families, may provide a wider process window for reflow solder processes as well.
Density Level B: Median (Nominal) Land Protrusion
Products with a moderate level of component density may consider adapting the
'median' land pattern geometry. The median land patterns furnished for all device families will provide a robust
solder attachment condition for reflow solder processes and should provide a condition suitable for wave or
reflow soldering of leadless chip and leaded gull-wing type devices.
Density Level C: Minimum (Least) Land Protrusion
High component density typical of portable and hand-held product applications may
consider the 'minimum' land pattern geometry variation. Selection of the minimum land pattern geometry may
not be suitable for all product use categories. The use of classes of performance (1, 2, and 3) is combined
with that of component density levels (A, B, and C) in explaining the condition of an electronic assembly.
As an example, combining the description as Levels 1A or 3B or 2C, would indicate the different combinations
of performance and component density to aid in understanding the environment and the manufacturing requirements
of a particular assembly.
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